JPS62101453

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DESCRIPTION JPS62101453
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
method of manufacturing a ceramic electronic component in which fine pores are formed with
high accuracy. (Conventional art) As a method of forming pores in a conventional ceramic
electronic component, there is a method of applying a paste which is decomposed and scattered
up to the ceramic baking temperature of carbon or the like, or pressing a pressing plate on a
ceramic clean sheet. It has been done. For example, in a multilayer ceramic capacitor, paste
containing carbon is applied on a green sheet, laminated and crimped temporarily sintered, holes
are formed in the part to which the carbon paste is applied, and a gold solder such as lead is
pressed into the inside. An electrode is formed (Japanese Patent Application Laid-Open No. 521665. Japanese Patent Publication No. 53-35085). Further, in the ink jet head, a metal pressing
plate is pressed onto a green sheet, or an acrylic sheet pressing die is embedded in the green
sheet to form a void (JP-A-58-87060). (Problems to be Solved by the Invention) However, in the
method of forming holes which has been conventionally used, there are problems such as the
accuracy is not obtained and the thickness of the holes can not be increased. When using a paste
such as carbon that decomposes and scatters at high temperature and forms a pattern on a green
sheet by screen printing, etc., the screen printing accuracy is 100μ! The limit is to form an nwidth pattern with a 200 μm pitch. In this case, the thickness of the pattern was at most 10
μm, which was insufficient as a hole for an electronic component. Also when forming a hole
using a metal pressing plate or a plastic film pressing plate, it is difficult to form a pattern with
high accuracy due to deformation due to pressure or the like. In particular, in the method of
forming a recess on a green sheet by pressing using a metal pressing plate, a ceramic sheet
forming a lid member is further stacked thereon, and a part of the green sheet stacked on four
portions when thermocompression bonding is performed. When embedded, the thickness of the
pores becomes extremely uneven depending on the location, which is a drawback. Even in the
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case where the acrylic sheet is used as a pressing plate, the acrylic sheet is deformed when it is
embedded in the green sheet i by pressure, resulting in a defect that the accuracy is deteriorated.
Generally, the operation of the ceramic electronic component is performed through the
electrodes, but according to the conventional manufacturing method, it has been difficult to form
the electrodes on the surface of the pores inside or in the ceramic. Therefore, conventionally,
after sintering the ceramic, a thick film is printed on the surface and the electrode is formed by
baking or plating.
In such a method, since an electrode can be formed only on the surface, the use applications of
piezoelectric ceramic materials and the like are limited, and it has been difficult to produce highperformance electronic components. An object of the present invention is to solve all the
problems and to provide high-performance electronic parts by forming fine holes with high
precision in a ceramic and forming an electrode inside. (Means for Solving the Problem) The
point of the present invention is to form a highly accurate hole pattern with a photosensitive
resin, and to form a thermocompression bonding with a ceramic green sheet including a ceramic
green sheet on which an electrode is formed. , To be fired. In this method of manufacturing an
electronic component, a photosensitive resin is used to form a fine pore pattern with high
accuracy, and a part of the pore pattern is not embedded in the ceramic green sheet by pressure,
It is important to simultaneously press and laminate the ceramic green sheets. As a
photosensitive resin, it is generally used for resists. Various photosensitive resins such as nylon,
epoxy, polyurethane, polybutadiene and the like can be used, including acrylic photo-curing
resins. Moreover, the temperature of pressure bonding should just be more than the glass work
shift point of the binder resin currently used for the green sheet. Furthermore, a small amount of
solvent may be dusted onto the green sheet during pressure bonding. (Operation) Since the hole
pattern is formed by the photosensitive resin, it is possible to form a very fine pattern with high
accuracy. When a photosensitive resin is used, it is easy to form a pattern having a pattern width
of about 10 μm at a pitch of 20 μm even by a currently commercialized technique. In addition,
the thickness can be up to several, and the aspect ratio, which is the ratio of the pattern width to
the thickness, can be 1 or more. In the step of forming the pores in a rough manner, in the case
of applying pressure into the green sheet for embedding as in the prior art, the embedded depth
has its own limit, and is several tens of microns. In addition, high pressure is required for deep
embedding, and when embedding is performed, the hole pattern is deformed and it is impossible
to maintain accuracy. As shown in the method of the invention, the depth of the void pattern
embedded in the green sheet is simultaneously divided into two in the upper and lower directions
by simultaneously pressing the ceramic green sheet and the void pattern. If deformation occurs
<< and the ceramic green sheet is crimped simultaneously with a plurality of hole patterns at the
same time, the green sheet is deformed so as to fill the gaps of the hole pattern at the time of
pressing; It is possible to form a pattern with almost no recognition and high accuracy.
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Further, by forming an electrode on the surface of the ceramic green sheet, the electrode can be
formed on the inside of the ceramic after sintering, the surface of the pores formed on the inside,
the outer surface of the ceramic, etc. Through this hole, electrodes formed on the hole pattern
surface, the inside of the ceramic, and the outer surface of the ceramic can be threedimensionally wired through this hole. In addition to metal conductors, green sheets such as
resistors and dielectrics and materials different from the electrodes are formed on ceramic green
sheets and wiring can be expected to have electronic and electrical functions. EXAMPLE A
method of manufacturing an electronic component having a void will be described with reference
to the following example. 1 and 2 (a)-(f) illustrate the process of the method. First, photosensitive
resin 1 is uniformly coated on carrier film 2 such as polyester to a predetermined thickness. A
photomask 3 having a predetermined pattern formed thereon is brought into close contact with
the photosensitive resin sheet thus produced, light is irradiated and exposed, and then
development processing is performed to form a predetermined hole pattern 4. On the other
hand, ceramic green sheet 5 is made into a slurry state by mixing and dispersing ceramic
powder, organic binder, plasticizer and solvent according to a general method, and this is made
into a doctor film method, casting method, plastic film, glass plate, By coating and drying on a
metal sheet etc.-). The ceramic clean sheet is peeled off from the formed film or plate after
drying, and is punched or cut into a predetermined size. The green sheet obtained in this manner
forms through holes by punching or the like, or prints electrode paste 6, resistance paste,
dielectric paste or the like on the surface, as required. The hole pattern 4 is peeled off from the
carrier film, and laminated together with the ceramic green sheet 5 into a mold for pressure
bonding so that the holes, electrodes and other printed patterns are in a predetermined threedimensional arrangement. Pressure to integrate. Here, heat may be added together with the
pressure as needed. . The laminate 7 produced in this manner is cut to a predetermined size as
required, and then the organic matter present in the void pattern or the ceramic green sheet is
slowly heated in an oxidizing atmosphere in a binder removal step. Dissolve and lose. Usually,
these organic substances decompose and oxidize completely by 500 ° C to 600 ° C, but if the
temperature is rapidly raised to the decomposition temperature, the laminate will break, so 25 °
C / hour or slower The temperature is raised at a temperature rising speed, and the organic
matter is completely eliminated by maintaining the temperature at 500 ° C. to 600 ° C. for a
sufficiently long time.
As described above, since the organic matter does not remain in the laminate after the step of
removing the spacers, the portion of the vacancy pattern remains in the laminate as the holes 9.
The laminated body is sintered at a predetermined temperature to form a ceramic 10, and cut as
necessary according to a predetermined size to obtain an electronic component. FIGS. 3 (a) and 3
(b) show a plan view and a cross-sectional view, respectively, of a ceramic electrode integrated
type on-demand type ink jet head prepared by this method. In this on-demand type ink jet head,
as the piezoelectric ceramic material 1, Pb'1'i0. -PbZrO, a ceramic of the system was used.
Moreover, as a material of the electrode 12, the electrode paste whose ratio of Ag / I'd is 70730
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(weight ratio) was used. The photosensitive resin for the hole pattern was an acrylic photocurable resin, exposed to ultraviolet light, and developed using methyl ethyl ketone. The pressure
bonding of 250 kg / − was applied to the ceramic green sheet and the hole pattern, and heating
was performed at a temperature of 110 ° C. for 30 minutes. The laminate was heated in air at a
temperature rising rate of 5 ° C./hour, held at 500 ° C. for 3 hours, and decomposed and
disappeared as an organic component. Sintering was also performed in air and held at 1150 ° C.
for 2 hours. By applying an alternating voltage of 40 V to the electrodes in the ink jet head thus
formed, the electrode-formed portion vibrates due to the piezoelectric lateral effect, and the
ejection of ink droplets from the nozzles 13 was confirmed. The shape of the formed nozzle
portion was 100 μm square, and a portion of the pressure chamber 14 inside was 100 μm high
and had a hole with a width of 5 m at maximum. FIGS. 4 (a) and 4 (b) show a plan view and a
cross-sectional view, respectively, of the bubble type ink jet head prepared by the present
method. In this head, a mixed powder of lead borosilicate glass and alumina was used as a raw
material of the insulator ceramic 15, and a paste having an Ag / Pd ratio of 85/15 (weight ratio)
was used as a paste for forming the conductor 16 . The photosensitive resin for the hole pattern
was a nylon photocurable resin, exposed to ultraviolet light, and developed using an alkali. The
pressure bonding of the ceramic green sheet and the hole pattern was performed by applying a
temperature of 80 ° C. at a pressure of 300 # / −. The heater resistor 19 for bubble generation
was formed using a ruthenium oxide paste. After decomposition of the organic matter at 500 °
C., sintering was performed by holding at 900 ° C. for 2 hours. When the ink reservoir 18 was
filled with the ink and a high frequency pulse was applied to the resistance 19 in the bubble type
ink jet head, the ejection of the ink from the nozzle 17 was confirmed.
The nozzle dimensions are 50 μm corners. FIGS. 5 (a) and 5 (b) show a plan view and a crosssectional view of a piezoelectric sounding body formed by using this method. Here, a Pb'l'i0 ° PbZrO-based piezoelectric material was used as the piezoelectric ceramic 11, and platinum was
used as the electrode material. The photosensitive resin for the hole pattern used was an epoxybased one having a thickness of 500 μm. An air chamber 24 is provided via a drive portion of
the piezoelectric ceramic 11 including a part of the electrodes 21 inside, and the air chamber 24
communicates with the outside through the air holes 23. Conductor wires 22 are also formed.
After sintering, when an AC voltage was applied to the electrode, a sound of 1 phantom was
generated. In this case, holes are formed in the state of the green sheet in the portions of the
housing above and below the vibrating body, and the sound is transmitted to the outside. (Effects
of the Invention) According to this method, the number of parts required for the process can be
significantly reduced, and the use of the photosensitive resin can achieve a significant
improvement in accuracy. In addition, in the prior art technology, it was not possible to realize
miniaturization as in the case of a sound generator or the like in the prior art, but significant
miniaturization and chip formation could be realized by this method. This method is a component
device requiring holes such as a ceramic filter, a ceramic vibrator, a ceramic oscillator, a
piezoelectric speaker, a piezoelectric microphone, a ceramic sensor, a ceramic heat pipe, etc. in
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addition to the inkjet head sounding body described in the embodiments. Can be applied to any
of the above, and a great effect can be obtained.
[0002]
Brief description of the drawings
[0003]
FIG. 1 illustrates the manufacturing process of the method.
2 (a) to 2 (f) are process flow diagrams of the present method, and FIG. 3 (al, (b) are a plan view
and a sectional view of the on-demand type ink jet head, respectively; b) is a plan view and a
sectional view of the bubble type ink jet head, and FIGS. 5 (a) and 5 (b) are a plan view and a
sectional view of the piezoelectric speaker. In the figure, 1 is a photosensitive resin, 2 is a carrier
film, 3 is a photomask, 4 is a hole pattern, 5 is a ceramic green sheet, 6 is a printed electrode
paste 7 is a laminate obtained by pressure bonding a green sheet, 8 is a Electrodes or resistors
after sintering, 9: holes formed in ceramics, 10: sintered ceramics, 11: piezoelectric ceramics, 12:
electrodes for driving piezoelectric ceramics, 13: nozzles, 14: pressure Reference numeral 15
denotes an insulator ceramic, 16 denotes a wiring conductor 17, denotes a ceramic nozzle, 18
denotes ink retention, 19 denotes a bubble generating resistor, 21 denotes a piezoelectric
ceramic drive electrode, and 22 denotes a conductor for conducting electricity to the drive
electrode A wiring portion, 23 are holes, and 24 is an air chamber formed in the ceramic. Agent's
valve,: N7-:-Uchihara Takumi 2 升 3 Fig. (B) 71-4 Fig. 71-5 Mouth (b)
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