JPS53129619

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DESCRIPTION JPS53129619
2 Specification 1, Name of Invention Diaphragm for Speaker
λ claims
5. Detailed Description of the Invention The present invention relates to a speaker diaphragm
useful for producing a speaker having excellent resonance reproduction characteristics. In
general, in a speaker, it is desirable that the diaphragm of the speaker force reciprocate over a
wide frequency range in order to faithfully reproduce the sound. For this purpose, it is
advantageous to use a material which is light and hard for the diaphragm. That is, assuming that
Young's modulus is E and density is P, the larger the specific elastic modulus 14 / p represented
by the ratio, the better. Conventionally, for this purpose, a relatively light metal such as
aluminum, titanium, beryllium or the like has been used as a diaphragm material of a high sound
range speaker having a small diameter. However, since it is necessary to provide bending
strength over a large area for use in a speaker for large / low sound area with a large aperture,
the thickness of the diaphragm must be increased, and therefore the diaphragm The weight of
itself increases. Therefore, even the light metals mentioned above are not suitable as materials
for large diameter speakers. Therefore, the porous synthetic resin foam material which is light in
weight and increases in thickness in a relationship in which the strength against bending, that is,
the bending rigidity is in proportion to the third power of thickness, is used alone or in a
sandwich structure using this as a core material. Is being developed. However, the diaphragm
material according to this structure did not reach a sufficient value in terms of strength.
Therefore, the one as shown in FIG. 1 is proposed as a speaker diaphragm. In the figure, (1) is a
metal porous structure, and the structure (2) is, for example, a ternary network-like structure in
which pores (2) form a continuously different structure. EndPage: 1 is described in detail in
Japanese Patent Publication No. 47-10524 about this ternary network structure and its
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manufacturing method. (3) is a reinforcing plate of a metal foil or a synthetic resin thin film, and
the strong plate (3) is an adhesive sheet or adhesive which compensates for the specific elastic
modulus E / p of the ternary network structure (1). Etc. is attached to the-surface of the ternary
network structure (1) via an adhesive means (4). By the attachment of the reinforcing plate (3),
the hole (2) is closed together with the reinforcement of the molar modulus E / p. However, since
the strength of the diaphragm due to the attachment of the reinforcing plate (3) is determined by
the material of the reinforcing plate (3) and the adhesive force of the bonding means (4) itself,
the reinforcing plate (3) itself is sufficient In spite of having a certain strength, the adhesion of
the bonding means (4) may be weak (it may not be possible to achieve its purpose. Therefore, if
the amount is increased to give a desired adhesive strength to the bonding means (4), then the
ratio of the weight to the total weight of the diaphragm is increased to increase the diameter of
the diaphragm and to reproduce the sound. Adversely affect
The present invention provides a diaphragm for a speaker in which sealing is performed without
using such an adhesive means (4) and in which the specific elastic modulus E / p is increased, as
shown in FIGS. 2 to 4 below. It demonstrates using. FIG. 2 is a cross-sectional view of a ternary
net-like structure +11 having a single-sided continuous thin plate (5) which is a base material of a
diaphragm for a speaker according to the present invention. The structure (1) has a sandwich
structure in which a thin metal layer (5) and a lightweight ternary reticulated portion (6) are
closely adhered to each other by forming an indented metal layer on one side of the ternary
reticulated portion (6). It is. It is shown in FIG. 3 that a light metal is deposited using this ternary
network structure (1) as a base material. In the figure, (7) is a light metal deposited on the entire
area of the ternary network (1) shown in FIG. 2 by chemical vapor deposition using the chemical
vapor plating method. (7) is, for example, aluminum, titanium, beryllium or the like. The adhesion
of the light metal (7) reinforces the bending of the structure (1). The above-mentioned chemical
vapor deposition method is the base metal of the plated metal by vaporizing the compound salt
of the plated metal (mainly volatile metal halide) and thermal decomposition at high temperature
or hydrogen reduction. It is a method of depositing on top. Here, the base material is, for
example, a nickel ternary net-like structure. The case where aluminum is used as the light metal
(7) to be deposited will be described as an example. A nickel ternary network (1) forming a thin
plate (5) continuous on one side is heated to about 900 ° C. and subjected to hydrogen
reduction treatment, then aluminum trichloride is vaporized at around 130 ° C. to make
hydrogen gas By flowing the aluminum gas for about 3 minutes as a carrier, aluminum (7) having
a thickness of 30 μ can be deposited on the surface of the nickel base material (1). At this time,
since the nickel base material has continuous pores (2) in the ternary network structure (1),
aluminum (7) is also covered on the entire metal surface covering the pores (2). It will be worn.
Another embodiment of the present invention is shown in FIG. In this example, it is clear from the
figure (the light metal (7) is deposited on the surface of the thin plate (5) of the structure (1) with
the ternary network (1) shown in FIG. 2 as the base material) It is The degree is reasonable. Even
in this structure (1), the specific elastic modulus E / P can be easily increased without using the
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bonding means (4) which is the intended purpose of the present invention. As is apparent from
the above description (the speaker diaphragm of the present invention is a thin plate having a
continuous surface on one side and at the same time a porous metal structure having pores) by
vapor deposition or chemical vapor plating. Since it is not necessary to form a closure, and there
is no need to use an adhesive material as compared with the conventional structure, the weight is
reduced, and the specific modulus and the bending rigidity which directly affect the speaker
characteristics are greatly increased. Do.
In addition, a light metal is used for the deposited metal to suppress the increase in weight due to
the deposition. Therefore, the speaker composed of this structure can reproduce the sound
faithfully over a wide frequency band to provide a reproduced sound with high sound quality.
4. Brief description of the drawings. FIG. 1 is a cross-sectional view showing a conventional
example, FIG. FIG. 4 is a sectional view showing another embodiment, wherein (1) is a metal
porous structure, (2) is a hole, (3) is a reinforcing plate, EndPage: 2 ( 4) shows a bonding means,
(5) shows a thin plate, (6) shows a ternary net-like portion, and (7) shows a light metal. Patent
applicant Sanyo Electric Co., Ltd., representative representative Ige Kei; · · · '-1 outside 91EndPage: 3
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