JPS5511632

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DESCRIPTION JPS5511632
1 、 Name of invention
Bonding method between flat diaphragm and edge member
3. Detailed Description of the Invention The present invention relates to a method of bonding a
flat diaphragm and an edge member in a flat speaker or the like. In general, the flat diaphragm is
cut in the thickness direction to form a desired vibration surface shape such as a circle or a
square, and the periphery thereof is formed, for example, by a bonding structure as shown in the
longitudinal sectional view of FIG. An edge member is used by bonding to the end face. In FIG. 1,
the plane diaphragm 1 has a honeycomb sandwich structure including the honeycomb core layer
2 and the skin layers 3a and 3b, which can achieve good acoustic characteristics by increasing
the bending rigidity and lowering the surface density. doing. The flat diaphragm 1 is bonded so
as to form a desired vibrating surface shape by cutting its peripheral portion in the thickness
direction, that is, perpendicular to the vibrating surface. By the way, in the case of bonding the
flat diaphragm and the edge member by such a bonding structure, when the flat diaphragm is
inserted into the edge member, the adhesive is stuck at an unnecessary position, Since the
adhesive is pushed out from the predetermined bonding portion by the sliding contact between
the peripheral end face of the flat diaphragm and the inner peripheral surface of the edge
member, the edge member may be expanded or stuck. There is no need to use a special adhesive.
Also, since there is a section of the EndPage: 1 honeycomb core layer at the peripheral edge
portion of the planar diaphragm of the honeycomb sand inch structure as described above, it is
necessary to ensure adhesion between the planar diaphragm and the edge member, When the
diaphragm vibrates, there is a possibility that a so-called buzzing sound may be generated by the
section of the above-mentioned nick core layer. Furthermore, in general, the adhesive needs to
press the bonding surface between the edge member and the diaphragm with a sufficient
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pressure in order to cause so-called thinning phenomenon during solidification. In the case
where the edge member 6 is bonded to the peripheral end surface 4 of the flat diaphragm 1 by
the bonding structure as shown in FIG. 1 of the prior art, as shown in FIG. The configuration is
such that the configuration is such that the suppression portions 7 on the four sides of the mass
to be pressed against the peripheral end face 4 of 1 and the pressure portion 8 for the mass to
press the flat diaphragm 1 from the thickness direction are disposed on the base 9 There is a
need to simplify the bonding tool and to improve the working efficiency, which must be
performed using the large bonding tool 10 or manually. Therefore, according to the present
invention, the bonding jig and tool can be simplified and the working efficiency can be improved
so that the bonding operation between the flat diaphragm and the edge member can be
performed reliably and efficiently without the need for the extension step of the edge member. It
is an object of the present invention to provide a method of bonding a new flat diaphragm and an
edge member to be obtained.
Hereinafter, the present invention will be described in detail with reference to FIGS. 3 and 4
showing one embodiment to which the method of the present invention is applied. In this
embodiment, the plane vibration plate 11 has a honeycomb sand-inch structure including the
honeycomb core layer 12 and the skin layers 13a and 13b, and the peripheral end face 14 is
formed to be inclined with respect to the thickness direction. The peripheral end surface 14 of
the planar diaphragm 11 is formed by cutting the peripheral edge portion of the planar
diaphragm 11 having a vibration surface shape such as a circle or a square at a cutting surface
inclined with respect to the thickness direction. Further, the edge member 16 is an elastic
supporting portion having a semicircular longitudinal cross section continuous with the bonding
portion 16A having the bonding portion 16A having the inner peripheral surface 16a inclined
corresponding to the peripheral end surface 14 of the flat diaphragm 11. 16B and a flange
portion 163-C sandwiched by the frame of the speaker device (not shown). The space between
the peripheral end surface 14 of the flat diaphragm 11 and the inner peripheral surface 16 a of
the bonding portion 16 A of the edge member 16 is bonded by an adhesive 15. FIG. 3 shows an
enlarged cross-sectional view of the main part of such a bonding structure. In order to bond the
flat diaphragm 11 and the edge member 16 by the bonding structure as described above, for
example, as shown in FIG. 4, the longitudinal cross section where the edge member 16 and the
flat diaphragm 11 can be fitted is substantially An adhesive tool 20 having a suppression
member 19 for forming the inverted trapezoidal concave portion 17 on the base 18 and pressing
the flat diaphragm 11 from the thickness direction toward the base 18 is used. That is, the
adhesive 15 is coated on at least one of the peripheral end surface 14 formed inclined with
respect to the thickness direction of the flat diaphragm 11 or the inner peripheral surface 16 a of
the adhesive portion 16A of the edge member 16. The adhesive portion 16A of the edge member
16 is fitted into the concave portion 17 and placed, and the flat diaphragm 11 is dropped from
above the inner peripheral surface 16a of the adhesive portion 16A so as to be flat on the inner
peripheral surface 16a. When the peripheral end surface 14 of the diaphragm 11 is abutted and
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the planar diaphragm 11 is pressed toward the base 18 by the pressing member 19, the planar
diaphragm 11 and the edge member 16 can be bonded. . In the embodiment as described above,
the flat diaphragm 11 having the peripheral end surface 14 formed to be inclined with respect to
the thickness direction is inserted into the edge member 16 having the inner peripheral surface
16 ae corresponding to the peripheral end surface 14. The flat diaphragm 11 f can be easily
dropped to the correct position without requiring the expansion step of the edge member 16 at
the time of the drop operation of the flat diaphragm 11.
Further, since the peripheral end face 14 of the planar diaphragm 11 can be brought into
pressure contact with the inner peripheral surface 16H of the bonding portion 16A of the edge
member 16 simply by pressing the planar diaphragm 11 toward the base 18, An adhesive is
applied to at least one of the peripheral end surface formed at an angle with respect to the
structure of the jig 20 or the inner peripheral surface of the edge member bonded to the
EndPage: 2 peripheral end surface, and the inner peripheral surface of the edge member is The
flat diaphragm divided end member along the circumferential end face of the flat diaphragm? It
is characterized in that the flat diaphragm is placed on the base and pressed against the flat plate
to bond the flat plate and the edge member, so that the bonding between the flat plate and the
edge member is performed. While being able to improve the efficiency, it is possible to simplify
the bonding tool used in the bonding operation, and the desired purpose can be sufficiently
achieved.
4. Brief Description of the Drawings FIG. 1 is an enlarged vertical cross-sectional view of the main
part showing a bonding structure of a plane diaphragm and an edge member, which is
conventionally known. FIG. 2 is a longitudinal sectional view showing a conventional bonding
tool used to perform the bonding operation by the above-mentioned conventional bonding
structure. FIG. 3 is an enlarged vertical cross-sectional view of an essential part showing an
embodiment of a bonded structure to which the method of the present invention is applied. FIG.
4 is a longitudinal sectional view showing an embodiment of the bonding tool used to perform
the bonding work by the bonding structure to which the method of the present invention is
applied. 11 · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · ·
adhesive 16 · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · ·
Patented patent application applicants Sony Corporation Attorney Attorney Koike Satoshi
EndPage: 3
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