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Description 杏 1, Name of Invention
How to pull out the terminal part of the speaker
3. Detailed Description of the Invention The present invention relates to a method for producing
a terminal portion of a speaker, which is mechanically strong from a vibration 1-4 having a
twigul path which is inconvenient on a solder village such as 1 leminiquem. The purpose is to
drive out a chemically cheap terminal. A flexible vJ film as a flexible vJ film of a front-44 pinicker
of a system in which a conductor circuit is formed and a large vibration first knitting is driven in
the boundary to drive the whole surface of the vibrating film is a flexible soft polyester,
polyimide, etc. In general, a thin polymer film formed with an aluminum conductor circuit is
used. This is for the purpose of lightening * 曾 of the sway Wh yarn. As a method of laminating
aluminum and a polymer film, a method of laminating aluminum 6 and a polymer film using an
adhesive, a method of vapor-depositing aluminum on a polymer film, and after coating an
aluminum suspension with a polymer film Although there is a method to form a film, the peel
resistance is weak in either case, and for example, the lead wire (2) is directly soldered to the
terminal portion (3) of the conductor circuit (l) as in the conventional example shown in FIG. In
this case, the terminal portion (3) of the equivalent idiom (1) is easily peeled off from the
polymer film (4) due to the deformation of the lead wire tel which can be treated when the sheet
is handled. (5) is the soldering of the lead wire (2) and the terminal part (3) of the four-body
circuit (1, 1), and the solder used for soldering the crucible is aluminum solder. The latex is
oxidative and soldering requires a later washing with water. In the drying step after the water
washing and the water washing, peeling of the terminal portion (3) also frequently occurs
EndPage: 1j, t '+ H. Again! The 111J film curved net (6) is adhered to the frame (7) with a doublesided adhesive tape, and if the water-washing and drying are not performed at a low temperature
of about 50 ° C., the double-sided conductive tape is softened and the net (6) Wrinkles). Because
of this it takes more than 2 hours to dry. The present invention has been made to solve the
problems of the prior art, and the present invention will be described with reference to the
drawings showing the embodiments. First, an @ 1 embodiment shown in FIG. 211r and v13 will
be described. That is, after forming 4 body parts (81 + 9 + baked and formed on a glass epoxy
etc. insulating plate (10) like a printed circuit board) that loses from 1 foil, through holes 111'l [1
通 る] pass through conductor parts (8). The inner surface of the insulating plate tld) K 設 f 貞 ii
hole + Ill 02+ is a through hole, and the four body parts + 81 + 91 are also positioned on the
inner surface of the through hole (11) α 21 in advance. Then, the insulation # 1ilO is bonded to
the polymer film wJ film α ship so that the terminal 6113 of the conductor circuit of the ijJ film
comes under the through hole (111α2), and it is located on the inner surface of the drill hole
(1111 u21) In order to electrically connect the four body parts (81 + 91 and the conductor part
5- of the vibration wh 襖), the ultrasonic through-hole (11) is also soldered in 2 by ultrasonic
Hemorrhage is its ultrasonic solder 1 叶. After that, as described in Japanese Patent Application
Laid-Open No. 54-7613 rJ (the insulating plate (the conductor of +01 (al (91 (91) the lead wire
α6 is conductively soldered by soldering). -Indicates that the soldering is a part. Before
ultrasonic soldering does not use flux, the method does not need to be rinsed with water. By the
way, although it is conceivable to use a filling paste instead of the method for bending ultrasonic
soldering, in the case of a speaker, it has a flow resistance of 1 Å or more. Because the paste is
heated and destroyed, it is not practical. Also, in many cases, the four-renal paste infiltrates into a
slight gap between the contact portion of the insulating plate (] Oj and the polymer film 1 暎 α
4) and shorts the conductor circuit. As mentioned above, the method of fcv, Fig. 2 and Fig. 6 does
not require washing with water, no ditching process, and is mechanically strong and airy
connection method, or ultrasonic soldering is not suitable for ultrasonic soldering. A connection
failure of the terminal portion α3 may easily occur. That is, the ultrasonic soldering of the
soldering iron of the device is about 1.5 to 2 mm to the X through hole of the insulating plate
(lO) (inner diameter 2 to 3a + of the opening 1α2), the iron tip of the conductor circuit terminal
portion t13) There is little freedom in rubbing, so it is easy to become a so-called potato. This
potato usually ingests a sufficient electrical connection in fiA wet, but in high temperature and
high humidity, the contact point force is oxidized; it immediately becomes smooth. Further
improvement on this is shown in Figure 4 ˜ '#! This is an example of JI J2 shown in FIG. That is,
in the figure, the weir is a vibrating membrane having a conductor circuit of al reminiquem, (the
sieve 241 is a body turn w! It is both @ terminals of r □. □□□ is a frame, 0 is a double-sided
adhesive tape (net on value, cl! η is an insulating plate. Conductor portion CI connected to
terminal 123 of front r conductor circuit @ (support) 1 on insulating plate η. 81 n is provided,
and the insulating plate □□□ has four recessed portions ta11 recessed from the side surface at
the position of the X-ray area (29). Said shaking 41] a! i1 @ 11 and net (a) are bonded to the
front and back sides of the frame □□□ on the front, and then the wall is recessed on the front
of the membrane 1)) force; Bond the insulating plate (B) so that it is located at After that,
ultrasonic soldering is carried out by the method of soldering on both ends of the front 11c14
body FMI-. t3Z1331 is a part of the soldering process. This soldering process is performed by
applying ultrasonic soldering from diagonal to the recess-13 of insulating plate-by applying the
soldering iron and the soldering iron of the device. -M child 1231 (can take enough area to stick
to 241).
Further, since soldering is performed using no flux, it is very clear whether or not the φ211B3 +
is sufficiently soldered in 椙 and sonic soldering. That is, in the case of the solder, according to
the figure J11 of the front depression concave portion, the solder is viscose only by twisting with
tweezers and so on in part 4 3), and it is easy to carry out the inspection. it can. In the soldering,
when the portion 13z (33) is a solder, this soldering is performed by soldering the portion IJ
(131 and the insulating plate and conductor portion (hashing 9) of η). This soldering may be
ultrasonic soldering or ordinary soldering. E134j35J is a part of this soldering. This soldering is
after 81% introductory part 81%! ! ! 9) Lead wire (C) force ultrasonic soldering is soldering
method or ordinary soldering is soldering method. d61にi! j) this soldering is done in parts.
The method of picking up dumplings of the speaker of the present invention can be applied as
described above, and a mechanically strong, moisture-proof and reliable non-electrically high
electrical connection can be obtained. For ultrasonic soldering, complete reliability against
moisture can be obtained by resin molding the part Q 51%. However, in the case of the
embodiment shown in Fig. 4 to stone 6, even without resin mold is sufficient, During an
atmosphere of 55 ° C., 95 RH, EndPage: no change in resistance or resistance was detected at
22000 hr or more. Also lead? There was no abnormality in the electrical connection even if LM
(3 (d1), 3 強 く) was strongly projected.
4. Brief description of the drawings-Fig. 1 is a cross sectional view showing a conventional
example, Fig. 2 is a cross sectional view showing a first embodiment of the present invention, and
Fig. 6 is an insulation used for the missing example shown in the second flash FIG. 4 is a
perspective view showing a% 2 embodiment of the present invention, FIG. 5 is an exploded
perspective view of the same, and FIG. 4 is an enlarged sectional view of a main part of FIG. (&)
(91 ... body part, (101 ... insulation tut 021-, through hole, (13 ... terminal part, 041 ... vibration
replacement, α 6) ... ultrasonic solder Attached part: αC ··· Lead wire (I71 ··· Soldered part, D · · · ·
· · · · · · · · conductor circuit, e23! Sugawa Akebono, 鑓 ・ ・ ・ frame, 諧 ・ ・ ・) ct71 ・ ・ ・
Insulating plate, (J-S9) ・ ・ ・ 4 body parts, (30 υ · · 9 recessed parts, us + 331 · · ·・ Ultrasonic
soldered parts, for example ・ custom-made soldered parts, (あ 9 river lead wire, 關 9) ・ ・ ・
soldered parts, ... double-sided adhesive tape agent Yoshihiro Morimoto Figure 1 Second plan Fig.
1 〃 first 1 '!! J East JV Figure 5 EndPage: 3