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BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram of a conventional pickup, FIG.
2 is an explanatory view of a pressure-sensitive element used for this pickup, and FIG. 3 is for
explaining a conversion element of the present invention. The figure is a view in which an
electrode is formed on one side of a piezoelectric material, and the figure opening is a completed
view of a conversion element. Description of major drawing numbers, 10: piezoelectric material,
10a: one electrode, 12: conductive adhesive layer, 11: conductive buffer. Fig. 1 Fig. 2-7-5278404 (2) Fig. 3 mouth 2 i 0 a (b) (mouth)-8-
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the structure of a
graduation conversion element suitable for use in video disk pickups. FIG. 1 shows a known pickup, where (1) is a stylus, (? Is a pressure-sensitive element, (3 is a buffer, (4) is a support, 15i is a
base, (6) is connected to one of the ionization of the pressure-sensitive element or shows a
dashed line 前 記 the pressure-sensitive element (2), the buffer (31 and the support (4) are
respectively held by the conductive adhesive and sequentially stacked and fixed. The other of the
pressure sensitive elements is also electrically connected to the support (4). An electrode (2bX2c)
is provided on the ^ 2 surface of a piezoelectric material, for example, a piezoelectric ceramic
element (2a) as shown in FIG. 2, and a DC voltage is applied between the electrodes (so-called
polarization treatment) In the element body itself, no piezoelectric property is exhibited and nine
elements are made to have piezoelectric property permanently. The electrodes are usually
formed by silver or gold based high temperature baking and metallization. As described above, in
the conventional pickup, the configuration in which the conductive buffer is bonded to the one
electrode of the pressure sensitive element with both electrodes gold biased by the conductive
adhesive is completely naked. A new structure that simplifies the assembly by bonding a
conductive buffer to the other surface of the piezoelectric material provided with a conductive
adhesive layer and making the buffer substantially the other electrode. To provide a conversion
element of An embodiment of the present invention will be described with reference to FIG. 5. In
FIG. 6, the electrode (IOa) is formed only on one side of the piezoelectric material (10), and the
electrode is used to bake silver or gold paste. It is provided using a conventional method
(piezoelectricity is not applied at this stage). This piezoelectric material is expanded, and then, as
shown in FIG. 2B, the piezoelectric buffer is connected by a conductive buffer ut) t-conductive
adhesive to the surface opposite to the surface on which the electrode is already provided. The
key material and the shock absorbing body are formed into an integral form 1f-. In this state, a
DC voltage is applied between the electrode (10a) and the buffer body (+1) in order to provide
piezoelectricity. In the figure, (+ @ indicates a conductive adhesive layer. The conversion element
of this structure can be viewed as a state in which one of the element electrodes shown in FIG. 2
is replaced with a conductive adhesive J @ t + 2), and this adhesive layer has the function of an
electrode and a buffer. It also has the function of joining together. As described above, when
assembling the pickup shown in FIG. 1, it is necessary to prepare each component and to bond it
to the bonding agent separately, and it is necessary to have six parts, which is a problem. In this
case, one person for forming the conversion element electrode is simplified, and since the buffer
is already provided, the assembly to the stylus or the support is facilitated.
When the conversion element of FIG. 5 is to be produced, a buffer plate is first bonded to a
ceramic wafer with a four-character adhesive, polarized stone wall is applied in that state, and
then a desired shape and dimension ( The 3 m cube) has an advantage that the work is
significantly simplified since it is sufficient to cut the buffer plate and the wafer simultaneously.
Since the conversion element thus polarized is equivalent to the conventional one in piezoelectric
characteristics, it can sufficiently serve its purpose as a pickup conversion element.