Patent Translate Powered by EPO and Google Notice This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate, complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or financial decisions, should not be based on machine-translation output. DESCRIPTION JPS5227521 ■ Pick-up cartridge ■ Japanese Patent Application No. 45-88432 [Phase] Application No. 45 (1970) October 7 @ inventor exit Shin-Imon true type large letter cross-head 1006 Matsushita Electric Industrial Co. Industry Co., Ltd. Kadoma city Ozamon 10060 agent patent attorney Toshio Nakao 1 person outside BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing the principle of the unit mechanical / electrical converting portion of the pickup cartridge according to the present invention, FIG. 2 is a diagram showing the main parts of another embodiment of the rotating portion, and FIG. 4 is a perspective view showing an embodiment of the present invention, and FIG. 5 is a sectional view of the same. DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pickup cartridge in which a semiconductor thin film piezoresistive element is embedded in rubber or attached between rubbers and configured by an electromechanical transducer. An embodiment of the present invention will be described below with reference to the drawings. First, FIG. 1 shows the basic construction of the unit mechanical / electrical converting portion 6 of the pickup cartridge according to the present invention, in which 1 is a rubber such as butyl rubber having a relatively large compliance. CJ =] 3 in which the element 2 is embedded or sandwiched is its lead wire, 4 is a pressure needle, and 5 is a substrate-in the electromechanical transducer thus configured: DC power supply 6 and load resistance T Is connected in series to the single conductor thin film piezoresistive element 2 and when pressure is applied from above the rubber 1 to the semiconductor thin film piezoresistive element 2 by the pressure needle 4, the resistance change of the piezoresistive element 2 is the voltage at the load resistor 7 end It is converted into a change, and its alternating current component [111111] is obtained at the terminal 9 through the capacitor 8. The load by the pressure needle 4 and the output characteristic in this case are 04-05-2019 1 shown in FIG. Incidentally, in order to easily apply concentrated stress to the semiconductor thin film piezoresistive element 2, a recess 10 may be provided in the lower portion of the piezoresistive element 2 of the rubber 1. A pickup cartridge is configured as shown in FIGS. 4 and 5 using the electromechanical transducer having such a principle configuration. That is, in FIGS. 4 and 5, 11 is a needle tip, 12 is a cantilever made of a light alloy material or the like, and 13 and 14 are the semiconductor thin film piezoresistive elements shown in FIG. 1 and FIG. It is a mechanical-electrical conversion unit made of rubber, and 15 and 16 are its base. 17 and 18 are armatures for transmitting vibration of the needle tip 11 to the electromechanical transducer 13.14, and 19 and 20 for pressurizing the electromechanical transducer 13.14 attached to the tip of the armature 17.18. Not a pressure needle. The reference numeral 21 denotes a housing made of metal or synthetic resin, the reference numeral 22 denotes a terminal, and the reference numeral 23 denotes an extremely thin wire serving as a fulcrum of vibration when the needle tip 11 and the cantilever 12 vibrate according to the sound groove of the record. As described above, according to the present invention, the semiconductor thin film piezoresistive element is embedded in the rubber or sandwiched between the rubbers to constitute the electromechanical transducer, and therefore the semi-integral thin film with large compliance of the rubber by the load from the pressure needle. The piezoresistive element receives pressure, so that, for example, when the element resistance is IK.OMEGA. And a current of 1 mA is applied, a large output of about 10 mV can be obtained for a load of 11. In addition, since the semiconductor thin film piezoresistive element is mounted in the rubber, it is stable in terms of humidity resistance and heat resistance, has a long life, and has a simple structure, and can be manufactured at low cost, and at the same time The part does not contain any inductance or capacitance, and because it is composed of pure [111111] EndPage: 1 resistance, it does not receive any harmful induction, and it is easy to make it a small resistance value. It has excellent features such as simplicity, and its industriality is great. 04-05-2019 2
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