JP2014220670

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DESCRIPTION JP2014220670
Abstract: An object of the present invention is to provide a speaker system capable of
suppressing an internal temperature rise. According to the present invention, in order to solve
this problem, a speaker system includes a case made of resin, a heat radiating body made of
metal, and an electrodynamic speaker. The heat radiating body 103 includes a first heat radiating
portion 103A and a heat receiving portion 103B. The first heat radiating portion 103 </ b> A is
formed to protrude out of the case 102. The heat receiving portion 103 </ b> B is provided to be
exposed to the inside of the case 102. The heat sink 103 is implanted at a position above the
magnetic circuit 112 such that the gap 104 is formed between the heat receiving portion 103B
and the magnetic circuit 112. With this configuration, the heat due to the heat generation of the
magnetic circuit 112 can be dissipated to the outside of the case 102 from the first heat
radiating portion 103A via the heat radiating body 103. Therefore, the temperature rise inside
the case 102 can be well suppressed. [Selected figure] Figure 1
Speaker system and mobile device using the same
[0001]
The present invention relates to a speaker system in which a speaker is mounted in a resin case,
and a mobile device using the same.
[0002]
Hereinafter, a conventional speaker system will be described.
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The conventional speaker system includes a case made of resin, an electrodynamic speaker, and
an electronic circuit for driving the speaker. The speaker includes a magnetic circuit. The case is
provided with a hole, and the speaker is attached to the case so as to close the hole. The speaker
is attached to the case in a direction in which the magnetic circuit is disposed inside the case in
order to output sound to the outside of the case. Furthermore, an electronic circuit is also housed
in the case.
[0003]
As prior art document information related to the invention of this application, for example,
Patent Document 1 is known.
[0004]
Unexamined-Japanese-Patent No. 2006-287312
[0005]
However, in the conventional speaker system, it is difficult to release the heat generated by the
magnetic circuit to the outside of the case, and the temperature in the case rises.
And it had the subject that the temperature of an electronic circuit also rose by this temperature
rise.
[0006]
Therefore, the present invention solves this problem, and an object thereof is to suppress an
increase in temperature of an electronic circuit.
[0007]
In order to achieve this purpose, the speaker system includes a resin case, an electrodynamic
speaker, and a metal radiator.
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The speaker is configured to include a magnetic circuit.
Furthermore, the radiator is embedded in the case.
[0008]
The heat dissipating member is provided with a first heat dissipating portion formed to protrude
out of the case and a heat receiving portion provided so as to be exposed to the inside of the
case. The radiator is disposed at a position above the magnetic circuit, and a gap is formed
between the heat receiving portion and the magnetic circuit. This can achieve the intended
purpose.
[0009]
As described above, according to the present invention, since the metal radiator is disposed at a
position above the magnetic circuit, it is possible to dissipate the heat from the heat generation of
the magnetic circuit from the radiator to the outside of the case. Therefore, the temperature rise
inside the case can be well suppressed.
[0010]
The sectional view which looked at the speaker system of an embodiment of the present
invention from the back direction The outline figure of the mobile device which carries the
speaker system of an embodiment of the present invention The speaker system of an
embodiment of the present invention is attached to a mobile device Of the speaker system
according to the other embodiment of the present invention viewed from the back direction, and
the cross sectional view of the speaker system viewed from the side, according to another
embodiment of the present invention Cross-sectional view of the speaker system using the body
as viewed from the rear direction Cross-sectional view of the loudspeaker system using the heat
dissipating member according to the still another example of the embodiment of the present
invention as viewed from the rear direction Loudspeaker system equipped with a heat sink
having an example heat receiving section as viewed from the rear direction A speaker system
equipped with a heat sink having a heat receiving section according to still another example of
the embodiment of the present invention The cross-sectional view viewed from the rear direction,
cross-sectional view of the speaker system of still another example embodiment of a crosssectional view the present invention in which the speaker system seen from the side from the
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side
[0011]
Hereinafter, a speaker system according to an embodiment of the invention will be described
with reference to the drawings.
FIG. 1 is a cross-sectional view of a speaker system 101 according to an embodiment of the
present invention as viewed from the rear direction. The speaker system 101 includes a case 102
made of resin, a heat radiating body 103 made of metal, and a speaker 111 of an electrodynamic
type. The speaker 111 is configured to include the magnetic circuit 112. Furthermore, the heat
sink 103 is implanted in the case 102.
[0012]
The heat radiating body 103 includes a first heat radiating portion 103A and a heat receiving
portion 103B. The first heat radiating portion 103 </ b> A is formed to protrude out of the case
102. The heat receiving portion 103 </ b> B is provided to be exposed to the inside of the case
102. The heat sink 103 is disposed at a position above the magnetic circuit 112, and a gap 104
is formed between the heat receiving portion 103B and the magnetic circuit 112.
[0013]
Thus, the heat transmitted from the magnetic circuit 112 to the air in the gap 104 can be
dissipated from the first heat radiating portion 103A to the outside of the case 102 through the
heat radiating body 103. Therefore, the temperature rise inside the case 102 can be well
suppressed.
[0014]
Hereinafter, the speaker system in the present embodiment will be described in more detail. First,
a mobile device equipped with the speaker system according to the embodiment of the present
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invention will be described. FIG. 2 is a schematic view of a mobile device equipped with the
speaker system according to the embodiment of this invention. FIG. 3 is a schematic view of the
speaker system according to the embodiment of the present invention attached to a mobile
device.
[0015]
The mobile device 201 includes an apparatus main body unit 202, a drive unit 203, a fixing unit
204, and a speaker system 301. In the present embodiment, an electric car is described as an
example of the mobile device 201. However, the mobile device 201 is not limited to the electric
car. For example, the mobile device 201 may be a vehicle driven by an engine or a hybrid vehicle
equipped with an engine and a motor. Furthermore, the mobile device 201 is not limited to a car.
For example, a motorcycle, an electric bicycle, a forklift, etc. may be used.
[0016]
The device body 202 includes a riding space 202A and an engine room 202B or a motor room
202C. When the mobile device 201 is an electric vehicle, the device body 202 includes a motor
room 202C. When the mobile device 201 is an engine car, the device body 202 includes an
engine room 202B. When the mobile device 201 is a hybrid type vehicle, an electric motor is also
accommodated in the engine room 202B.
[0017]
The drive unit 203 is mounted in the apparatus main body unit 201 and drives the mobile device
201. The drive unit 203 may include a tire or the like. Furthermore, when the mobile device 201
is an electric vehicle, the drive unit 203 includes an electric motor. In this case, the motor is
installed in the motor room 202C. Alternatively, when the mobile device 201 is an engine car or
a hybrid car, both the engine and the motor are stored in the engine room 202B. On the other
hand, when the mobile device 201 is an engine car or a hybrid car, the drive unit 203 includes an
engine. In this case, the engine and the motor are accommodated in the engine room 202B.
[0018]
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The speaker system 301 in the present embodiment is a vehicle approach warning device. The
speaker system 301 is housed in the engine room 202B or the motor room 202C. In this case,
the speaker system 301 is installed facing the front of the mobile device 201 in order to notify
the pedestrian or the like of the approach of the vehicle. Therefore, the speaker system 301
operates in a state of being exposed to a bad environment such as heat emitted from an engine
or the like, sand and dust, and even rain water. As described above, it is preferable that the
speaker system 301 be housed in the engine room 202B or the motor room 202C and used as an
apparatus that outputs a sound.
[0019]
The speaker system 301 is not limited to the vehicle approach warning device. For example, the
speaker system 301 may be used as a pseudo engine sound generator or an active noise
reduction device. In addition, it is preferable to arrange the speaker system 301 at a position
forward of the drive unit 203 in the engine room 202B or the motor room 202C. By arranging at
this position, a pedestrian or the like can easily notice the alarm sound output from the speaker
system 301. Furthermore, the installation location of the speaker system 301 is not limited to the
engine room 202B and the motor room 202C. For example, it may be installed in the housing of
the door mirror, in the bumper, or in the trunk room.
[0020]
In the apparatus main body portion 202, a fixing portion 204 is provided. The speaker system
301 is fixed to the fixing unit 204 by a screw or the like. Fixing part 204 of the present
embodiment is made of metal. The speaker system 301 is provided with an attachment portion
302D. For this purpose, the mounting portion 302D is formed to protrude from the outer
peripheral surface of the case 302 of the speaker system 301. And it is fixing to the fixing ¦ fixed
part 204 by attaching part 302D, metal screw 205 grade ¦ etc.,. Therefore, the speaker system
301 is firmly fixed to the fixing unit 204. As a result, even if the vibration due to the movement
of the mobile device 201 or the like is applied to the speaker system 301, it is possible to
suppress the speaker system 301 from being detached from the fixed unit 204 and the like.
[0021]
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Next, the speaker system 301 will be described. FIG. 4 is a cross-sectional view of the speaker
system 301 according to the embodiment of the present invention as viewed from the rear
direction. FIG. 5 is a cross-sectional view of the speaker system 301 as viewed from the side. FIG.
4 is a view of the speaker system 301 taken along the section line 4-4 shown in FIG. FIG. 5 is a
view of the speaker system 301 taken along the section line 5-5 shown in FIG.
[0022]
The speaker system 301 includes a case 302, a radiator 303, an electronic circuit 304, and an
electrodynamic speaker 311. The speaker 311 and the electronic circuit 304 are housed in a
case 302 made of resin.
[0023]
The case 302 preferably includes a box portion 302A and a lid portion 302B. The inside of the
box portion 302A is a hollow space, and an opening portion 302C is formed on one side of the
box portion 302A. The lid 302B is attached to the box 302A so as to close the opening 302C.
According to this configuration, it is possible to suppress the intrusion of rainwater or the like
into the speaker system 301. The speaker system 301 needs to emit the sound output from the
speaker 311 to the outside of the case 302. Therefore, a through hole is provided in the lid
portion 302B to emit a sound out of the case 302. Then, in order to prevent rainwater from
entering the speaker system 301 from the through hole, a louver is provided in the lid portion
302B so as to hide the through hole.
[0024]
The electronic circuit 304 supplies an audio signal to the speaker 311. The speaker 311 converts
an audio signal input from the electronic circuit 304 into a sound and outputs the sound. The
electronic circuit 304 is housed in the space between the bottom 302 E of the case 302 and the
magnetic circuit 313. The bottom portion 302E is a side surface of the case 302 on the side
opposite to the side on which the speaker 311 is attached.
[0025]
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The electrodynamic speaker 311 includes a frame 312, a magnetic circuit 313, a diaphragm 314,
a voice coil 315, and a magnetic gap 316. The magnetic circuit 313 is mounted at the center of
the frame 312. On the other hand, the diaphragm 314 is coupled to the outer peripheral portion
of the frame 312. A voice coil 315 is connected to the center of the diaphragm 314. The tip of
the voice coil 315 is inserted into a magnetic gap 316 formed in the magnetic circuit 313. For
example, an external magnet type can be used for the magnetic circuit 313. In this case, when
the magnetic circuit 313 is viewed from the back direction of the speaker 311, the outer shape of
the magnetic circuit 313 is, for example, substantially circular. Although the magnetic circuit 313
uses an external magnet type, it is not limited to this. For example, the magnetic circuit 313 may
be of the inner magnet type or a combination of the inner magnet type and the outer magnet
type.
[0026]
In the mobile device 201, a heating element such as an engine is present in the vicinity of the
case 302. Therefore, the heat generated by them causes the temperature in the case 302 to rise.
Therefore, it is preferable to use a resin for the case 302. With such a configuration, the heat
conductivity of the case 302 can be reduced, so heat outside the case 302 can be less easily
conducted to the inside of the case 302. As a result, the temperature rise of the electronic circuit
304 can be suppressed.
[0027]
As described above, since the case 302 is made of resin, the ingress of heat from the outside of
the case 302 is suppressed. However, the case 302 hardly dissipates the heat generated in the
voice coil 315 to the outside of the case 302.
[0028]
Therefore, the speaker system 301 is provided with a metal radiator 303. It is preferable to use a
heat conductive material for the heat sink 303. For example, copper, aluminum or the like can be
used as the heat dissipating member 303. Copper has a very high thermal conductivity value, so
it can dissipate heat well. Alternatively, since aluminum has a small specific gravity, it can
contribute to weight reduction of the speaker system 301. The heat sink 303 is embedded in the
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case 302. The heat dissipating member 303 is disposed above the magnetic circuit 313. The heat
radiating body 303 includes a first heat radiating portion 303A and a heat receiving portion
303B. The first heat radiating portion 303A protrudes to the outside of the case 302 and radiates
the heat inside the case 302 to the outside of the case 302. On the other hand, the heat receiving
portion 303 B is exposed from the inner surface of the case 302. In addition, it is preferable to
arrange the heat receiving portion 303 B at a position above the magnetic circuit 313.
[0029]
With the above configuration, the heat generated in the voice coil 315 can be dissipated to the
outside of the case 302 through the heat dissipating member 303. Therefore, the temperature
rise inside the case 302 can be well suppressed.
[0030]
Further, a gap 305 is formed between the heat receiving portion 303 B and the magnetic circuit
313. Therefore, it can suppress that the heat receiving part 303B and the magnetic circuit 313
are hit. It is possible to suppress abnormal noise generated when the heat receiving portion 303B
and the magnetic circuit 313 hit each other. In addition, since the vibration of the magnetic
circuit 313 is not directly transmitted to the heat dissipator 303, the resonant vibration of the
heat dissipator 303 can be suppressed. Therefore, it can also be suppressed that the heat sink
303 generates a resonance sound.
[0031]
Then, as shown in FIG. 3, the speaker system 301 is installed in the mobile device 201 in the
direction in which the heat sink 303 side is up. As a result, the heat of the air in the gap 305
heated by the heat generated by the magnetic circuit 313 is transferred to the heat dissipator
303 by the heat receiving portion 303B. Then, the heat that has reached the heat receiving
portion 303B is conducted to the first heat radiating portion 303A. As a result, the heat
generated in the magnetic circuit 313 is transmitted from the first heat radiating portion 303A to
the air outside the case 302, and is dissipated to the outside of the case 302.
[0032]
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The electronic circuit 304 includes, for example, an amplification circuit, and generates heat. The
heat generated by the electronic circuit 304 can also be dissipated by the heat sink 303.
Therefore, the temperature rise of the electronic circuit 304 can be further suppressed.
[0033]
In this case, it is preferable that the heat receiving portion 303B extend to a position above the
electronic circuit 304. Thereby, the heat generated by the electronic circuit 304 can be
transmitted to the heat receiving portion 303B well. Furthermore, it is preferable that the first
heat radiating portion 303A be extended to a position above the electronic circuit 304. As a
result, the heat generated in the electronic circuit 304 can be dissipated well to the outside from
the first heat radiating portion 303A.
[0034]
With the above configuration, heat generated outside the speaker system 301 can be prevented
from entering the inside of the speaker system 301, and heat generated inside the speaker
system 301 can be released to the outside of the speaker system 301. . Therefore, since the rise
in the temperature inside the case 302 can be well suppressed, the rise in the temperature of the
electronic circuit 304 can also be suppressed. As a result, it is possible to suppress the
occurrence of a malfunction such as an abnormal operation of the electronic circuit 304 due to
heat or a stop of the operation.
[0035]
The heat sink 303 is preferably formed by bending a metal plate. With this configuration, the
heat dissipating member 303 can be easily manufactured by press processing, so the heat
dissipating member 303 is inexpensive. Moreover, since the heat sink 303 is lightweight, the
speaker system 301 can be reduced in weight. The weight reduction of the speaker system 301
can contribute to the reduction of the consumption of fuel and electricity of the mobile device
201.
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[0036]
The first heat radiating portion 303A is hollow. By this configuration, processing in press
processing is easy. Furthermore, since the inner side of the first heat radiating portion 303A also
acts as a heat receiving portion, the heat can be dissipated more favorably. Note that the heat
dissipating member 303 may be folded at the end of the first heat dissipating portion 303A.
Moreover, the thermal radiation body 303 is not restricted to manufacturing by bending process
of a metal plate. The radiator 303 may be manufactured by forging or die casting, for example.
[0037]
The air in the case 302 is reduced in specific gravity by the heat generated in the magnetic
circuit 313 and moves upward in the case 302. Therefore, it is preferable to provide the heat
receiving portion 303B with an inclination in the direction in which the width narrows from the
bottom to the top. With this configuration, the heat generated in the magnetic circuit 313 is
concentrated to the first heat radiating portion 303A, so the heat generated in the magnetic
circuit 313 from the first heat radiating portion 303A can be favorably dissipated. When the
shape of the magnetic circuit 313 is substantially circular, in the heat receiving portion 303B, the
shape of the surface facing the magnetic circuit 313 is substantially circular. The surface facing
the magnetic circuit 313 is preferably shaped so as to be concentric with the magnetic circuit
313. With this configuration, the heat generated by the magnetic circuit 313 can be dissipated
more favorably.
[0038]
In addition, when the case 302 is viewed from the front direction of the speaker system 301, it is
preferable to provide the case 302 with an inclination such that the width thereof widens as it
goes downward from the position where the heat sink 303 is implanted. That is, the first heat
radiating portion 303A is disposed at the uppermost position of the case 302. Therefore, the heat
generated in the magnetic circuit 313 is concentrated on the heat dissipator 303, so the heat
generated in the magnetic circuit 313 can be favorably dissipated by the heat dissipator 303.
Therefore, when the case 302 is viewed from the front direction of the speaker system 301, the
shape of the case 302 is, for example, substantially circular. However, the shape of the case 302
is not limited to a circle. For example, it may be a substantially triangle, a substantially trapezoid,
an ellipse or a track.
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[0039]
When the shape of the case 302 when the speaker system 301 is viewed from the front direction
is substantially circular, it is preferable that the external shape of the loudspeaker 311 when the
speaker 311 is viewed from the diaphragm 314 is also substantially circular. . That is, when the
frame 312 is viewed from the front direction of the speaker system 301, the outer shape of the
frame 312 is also substantially circular. In this case, the frame 312 can be configured to be fitted
to the inner periphery of the case 302. As a result, since the adhesive can be easily filled in the
gap between the outer periphery of the frame 312 and the inner periphery of the case 302,
intrusion of rain water or the like into the speaker system 301 can be easily suppressed. Further,
the outer periphery of the frame 312 and the inner periphery of the case 302 can be easily fixed
by an adhesive.
[0040]
Furthermore, it is preferable that the first heat radiating portion 303A be formed integrally with
the case 302. Since the case 302 is made of resin, the first heat radiation portion 303A can be
easily integrally molded in the process of injection molding the case 302. For example, the first
heat radiating portion 303A can be integrated with the case 302 by insert molding. Alternatively,
the first heat radiating portion 303A may be integrated with the case 302 by outsert molding. In
this case, since no gap is generated between the first heat radiating portion 303A and the case
302, it is possible to easily prevent rainwater from entering the speaker system 301.
[0041]
Of course, the case 302 may be configured to have a through hole for mounting the heat
dissipating member 303. In this case, a gap is generated between the through hole and the first
heat radiating portion 303A. Therefore, an adhesive is filled in the gap between the case 302 and
the first heat radiating portion 303A. With this configuration, the adhesive fixes the case 302
and the heat sink 303, and suppresses the intrusion of rainwater into the speaker system 301.
[0042]
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Furthermore, the heat radiating body 303 is provided with a second heat radiating portion 303C.
The second heat radiating portion 303C is preferably formed, for example, by extending from the
first heat radiating portion 303A. With this configuration, the heat dissipation area of the heat
dissipation member 303 can be increased, and thus the heat generated by the magnetic circuit
313 can be dissipated well.
[0043]
Then, as shown in FIG. 3, in a state where the speaker system 301 is attached to the fixing
portion 204, the second heat radiating portion 303C is formed so as to be held between the
attaching portion 302D and the fixing portion 204. There is. With this configuration, the heat
transferred to the heat dissipation body 303 can be dissipated also through a path that dissipates
heat to the fixing portion 204 via the second heat dissipation portion 303C. Therefore, the heat
generated by the magnetic circuit 313 can be dissipated well. In this case, the fixing portion 204
is preferably made of metal. Furthermore, in this case, the mounting portion 302D is also
preferably made of metal.
[0044]
FIG. 6 is a cross-sectional view of a speaker system 401 using a heat sink of another example as
viewed from the back. The loudspeaker system 401 of this example is different from the radiator
303 shown in FIG. 4 in that the radiator 403 is used. The heat dissipating member 403 is
provided with two first heat dissipating parts 403A. In addition, although 1st thermal radiation
part 403A is made into two places, it does not restrict to this. For example, three or more first
heat radiating portions 403A may be provided. According to this configuration, since the
plurality of first heat radiating portions 403A are formed in the heat radiating body 403, the area
in which the first heat radiating portion 403A is in contact with the outside air can be increased.
Therefore, the heat generated by the magnetic circuit 313 can be dissipated well.
[0045]
In addition, the heat receiving part 403B has connected between 1st thermal radiation part
403A. That is, the heat receiving part 403B is also a connection part which connects 1st thermal
radiation part 403A. The heat receiver 403 B is disposed at a position immediately above the
magnetic circuit 313. With this configuration, the heat generated by the magnetic circuit 313 can
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be well transferred to the heat receiving portion 403B, and thus the heat generated by the
magnetic circuit 313 can be dissipated well.
[0046]
FIG. 7 is a cross-sectional view of a speaker system using a heat sink 413 according to still
another example. The loudspeaker system 411 of this example is different from the radiator 303
shown in FIG. 4 in that a radiator 413 is used. The heat sink 413 is provided with an unevenness
413D. In this case, the unevenness 413D is preferably formed on the first heat radiation portion
413A. With this configuration, the area of the first heat radiating portion 413A in contact with
the outside air can be increased, so that the heat generated by the magnetic circuit 313 can be
dissipated well. Furthermore, it is preferable to form the unevenness 413D in the heat receiving
portion 413B. With this configuration, the area of the heat receiving portion 413B in contact
with the air in the case 302 can be increased, so that the heat generated by the magnetic circuit
313 can be dissipated well. In this example, although the unevenness 413D is provided on both
the first heat radiating portion 413A and the heat receiving portion 413B, the present invention
is not limited to this. The unevenness 413D may be formed on only one of the first heat radiating
portion 413A and the heat receiving portion 413B.
[0047]
Furthermore, in the case where the heat sink 413 and the case 302 are integrally formed, it is
preferable to provide the unevenness 413 D also in the portion embedded in the case 302 of the
heat sink 413. With this configuration, the area in which the case 302 and the heat sink 413 are
in contact can be increased. Therefore, the heat transmitted to the case 302 can also be
dissipated through the heat sink 413. Furthermore, the radiator 413 can be firmly fixed to the
case 302.
[0048]
FIG. 8 is a cross-sectional view of a speaker system mounted with a heat dissipating body having
a heat receiving portion of another example as viewed from the back. The speaker system 511 of
this example is different from the heat dissipator 303 shown in FIG. 4 in that a heat dissipator
513 is used. The heat receiving portion 513 B of the heat radiating body 513 may be formed to
protrude into the case 302. With this configuration, the distance between the heat receiving
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portion 513 B and the magnetic circuit 313 can be shortened. Therefore, the heat generated by
the magnetic circuit 313 can be dissipated well.
[0049]
FIG. 9 is a cross-sectional view of a speaker system mounted with a heat dissipating member
having a heat receiving portion 523B according to still another example, as viewed from the
back. FIG. 10 is a cross-sectional view of the speaker system of this example as viewed from the
side. FIG. 9 shows a cross section in a state of being cut along the section line 9-9 in FIG. The
speaker system 521 of this example is different from the heat dissipator 303 shown in FIG. 4 in
that a heat dissipator 523 is used. The heat dissipating body 523 has a heat receiving portion
523 B in addition to the heat dissipating body 303 shown in FIG. 4. The heat receiving unit 523
B is disposed between the electronic circuit 304 and the magnetic circuit 313. With this
configuration, the heat generated by the magnetic circuit 313 can be dissipated well. Further,
since the heat receiving portion 523B can be disposed in the vicinity of the electronic circuit
304, the heat generated in the electronic circuit 304 can be conducted to the first heat radiating
portion 303A favorably. Therefore, the heat generated in the electronic circuit 304 can be
dissipated to the outside well. In addition, in the heat radiating body 523 in this example, since
the heat receiving part 523B is provided, it is not necessary to necessarily provide the heat
receiving part 303B.
[0050]
However, in this case, since the heat receiving portion 523B is disposed at a position between the
electronic circuit 304 and the magnetic circuit 313, it is difficult to insert the electronic circuit
304 from the opening 302C side. Therefore, the speaker system 521 of this example is further
different from the case 302 shown in FIG. 4 in that a case 522 is used. The case 522 is formed of
a lid 302B and a box 522A. The box 522A is configured by connecting the frame 522F and the
bottom 522E with, for example, an adhesive. The connection between the frame portion 522F
and the bottom 522E is not limited to the adhesive. For example, they may be connected by
welding. With the above configuration, the electronic circuit 304 can be easily stored in the box
522A even if the heat sink 523 is disposed at a position between the electronic circuit 304 and
the magnetic circuit 313.
[0051]
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FIG. 11 is a cross-sectional view of a speaker system according to still another example as viewed
from the side. The speaker system 531 of this example is different in that a case 532 is used
instead of the case 302 shown in FIG. 4. A vent 532F is formed in the case 532. The vent 532F is
formed penetrating the bottom 532E of the case 532. With this configuration, when the
magnetic circuit 313 generates heat, the air in the case 532 can flow out. Therefore, since the
pressure increase in the case 532 can be suppressed, the operation of the diaphragm 314 is not
hindered. As a result, particularly low-range sound can be reproduced well.
[0052]
Furthermore, the speaker system 531 of this example is different in that a radiator 533 is used
instead of the radiator 303 shown in FIG. 4. The heat dissipating body 533 has an exposed
portion 533D and a connecting portion 533E in addition to the heat dissipating body 303 shown
in FIG. The exposed portion 533D is exposed at the inner wall of the vent 532F. The connecting
portion 533E connects the first heat radiating portion 533A and the exposed portion 533D.
[0053]
With such a configuration, the exposed portion 533D can dissipate or receive heat. For example,
when the temperature of air passing through the vent 532F is lower than the temperature of the
exposed portion 533D, the heat conducted to the first heat radiating portion 533A is dissipated
to the outside through the exposed portion 533D. Conversely, when the temperature of the air
passing through the vent 532F is higher than the temperature of the exposed portion 533D, part
of the heat of the air passing through the vent 532F is transferred to the exposed portion 533D.
As a result, the heat transferred to the exposed portion 533D is dissipated to the outside of the
case 532 from the connecting portion 533E or the first heat radiating portion 533A. Therefore,
the heat generated by the magnetic circuit 313 can be dissipated well.
[0054]
The speaker system according to the present invention has the effect of suppressing the
temperature rise inside the speaker system, and is useful when mounted on a mobile device or
the like.
[0055]
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DESCRIPTION OF SYMBOLS 101 Speaker system 102 Case 103 Heat radiating body 103 A 1st
heat radiating part 103 B Heat receiving part 104 Clearance 111 Speaker 112 Magnetic circuit
201 Moving body device 202 Device main body part 202 A Ride space 202 B Engine room 202
C Motor room 203 Drive part 204 Fixing part 205 Screw 301 Speaker System 302 case 302A
box 302B lid 302C opening 302D attachment 302E bottom 303 heat radiator 303A first radiator
303B heat receiver 303C second radiator 304 electronic circuit 305 gap 311 speaker 312 frame
313 magnetic circuit 314 diaphragm 315 voice 315 Coil 316 Magnetic gap 401 Speaker system
403 Radiator 403A First radiator 403B Heat receiver 411 Speaker system 413 Heat dissipation
413A first heat radiating part 413B heat receiving part 413D unevenness 511 speaker system
513 heat radiating body 513B heat receiving part 521 speaker system 522 case 522A box part
522E bottom part 522F frame body part 523 heat sink 523B heat receiving part 531 speaker
system 532 case 532E bottom part 533F vent hole Radiator 533A First radiator 533D Exposed
part 533E Connection part
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