JP2013236238

Patent Translate
Powered by EPO and Google
Notice
This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
financial decisions, should not be based on machine-translation output.
DESCRIPTION JP2013236238
Abstract: An object of the present invention is to provide an inexpensive headset with good
quality and a method of assembling the same by reducing the process of attaching components
to a circuit board and reducing the defect rate. A switch has a control box portion consisting of
an ECM (123) having a circuit board (121) integrated with the land (127) to which a wire (129)
is connected and a contact pattern (125) for a switch. The switch 131 has a contact portion
corresponding to the contact pattern 125, and is mounted on the contact pattern 125 of the
circuit board 121. [Selected figure] Figure 4
Headset and method of assembling the same
[0001]
The present invention relates to a headset for use in a mobile phone, and more specifically, a
control box unit having an earphone unit, a switch and an electret condenser microphone
(hereinafter referred to as ECM), and a connector unit connected to an apparatus. The present
invention relates to a headset having the cord between the earphone unit and the control box
unit, and the cord connecting the control box unit and the connector unit, and a method of
assembling the same.
[0002]
When using the hands-free function of the mobile phone, for example, a headset (earphone
microphone) 1 as shown in FIG. 10 is used.
[0003]
01-05-2019
1
As shown in FIG. 10, the headset 1 includes an earphone unit 3, a control box unit 5, a connector
unit 9 connected to a mobile phone 7, a space between the earphone unit 3 and the control box
unit 5, and a control box unit 5. It consists of a cord 11 and a cord 13 which connect between
the connector parts 9.
An ECM 15 used for a call is attached from the inside to the upper opening of the control box 5,
and a switch (calling / receiving switch) 17 is provided under the control box 5.
[0004]
Here, the ECM 15 will be described with reference to FIG.
FIG. 11 is a cross-sectional perspective view of the ECM 15. As shown in FIG.
[0005]
A small diameter hole 15b is formed at the center of one end face of the hollow cylindrical case
15a, and a large diameter hole 15c is formed at the center of the other end face. A disk-shaped
diaphragm 15d having a central portion thinner than the peripheral portion is disposed on one
end face side inside the case 15a. A ring-shaped insulating spacer 15e and a disk-shaped back
electret 15f having a diameter smaller than that of the diaphragm 15d are stacked on the
diaphragm 15d.
[0006]
In addition, one end face of a cylindrical, insulating first base 15g is provided on the spacer 15e
so as to abut on the spacer 15e. Further, in the spacer 15e, there is disposed a second base 15h
which is cylindrical and has electrical conductivity, and one end face is in contact with the back
electret 15f to be electrically connected.
01-05-2019
2
[0007]
On the other end face of the first base 15g and the second base 15h, a circuit board 15i that is in
contact with the inner wall of the other end face of the case 15a is provided.
[0008]
Then, when the sound (air vibration) reaches the diaphragm 15d via the small diameter hole 15b,
the diaphragm 15d vibrates.
Since the distance between the electrodes (the distance between the diaphragm 15d and the back
electret 15f) changes according to the vibration, a change in capacitance proportional to the
audio signal occurs. This change in capacitance is transmitted to the circuit board 15i via the
second base 15h, and converted to a change in voltage by an EFT (field effect transistor) 15j
provided on the circuit board 15i. The change in voltage is output from the lead wires
(electrodes) 15k and 15l provided on the circuit board 15i.
[0009]
When the ringing tone of the mobile phone 7 is sounded, the switch 17 can make a call between
the earphone unit 3 and the ECM 15 provided at the upper opening of the control box unit 5 by
pressing the switch 17 for a fixed time. By pressing the time, you can hang up the phone. In
addition, by pressing for a fixed time during standby, it is possible to dial the number set in
advance in the mobile phone 7 and a call can be made between the earphone unit 3 and the ECM
15 provided at the upper opening of the control box unit 5. You can hang up the phone by
pressing for a certain period of time. Further, when the mobile phone 7 incorporates an FM
radio, the code 11 and the code 13 are also used as an antenna (see, for example, Patent
Document 1).
[0010]
The mounting method of ECM etc. to the circuit board provided in the control box part 5 is
assembled ¦ attached at the process as shown to FIGS. 12-14.
[0011]
01-05-2019
3
First, as shown in FIG. 12, the switch 17 and other components 19 are mounted on the circuit
board 21.
Further, the circuit board 21 is formed with lands 23 for cord connection and holes 25 through
which the lead wires 15k and 15l of the ECM 15 are inserted.
[0012]
Next, as shown in FIG. 13, the lead wires 15 k and 15 l of the ECM 15 are inserted into the holes
25 formed on the surface of the circuit board 21 opposite to the surface on which the switch 17
and other components 19 are mounted. The lead wires 15k and 15l of the ECM 15 inserted
through the holes 25 are electrically connected to the conductor patterns formed on the circuit
board 21 by soldering.
[0013]
JP 2007-110503
[0014]
As shown in FIG. 12 to FIG. 14, mounting of the switch 17 and other parts 19 on the circuit
board 21 and mounting of the ECM 15 are performed by a headset assembling company.
Therefore, there are the following problems.
[0015]
(1) In order to mount the switch 17 and other components 19 on the circuit board 21, dedicated
equipment such as a solder printer, a chip mounter, a reflow furnace, an insert machine, a solder
tank, etc. is required, and the assembly cost becomes high.
[0016]
(2) The operation of soldering an electronic component having lead wires (electrodes) 15 a such
01-05-2019
4
as ECM 15 to the circuit board 21 is difficult and the incidence of defective products is high.
[0017]
The present invention has been made in view of the above problems, and an object thereof is to
reduce the process of attaching parts to a circuit board and to reduce the defective rate to
provide an inexpensive headset with good quality and a method of assembling the same. It is.
[0018]
In order to realize at least one of the above problems, a headset reflecting one aspect of the
present invention includes an earphone unit, a control box unit having a switch, an ECM (electret
condenser microphone), and a connector connected to an apparatus , A cord connecting the
earphone part and the control box part, and a cord connecting the control box part and the
connector part, and the circuit board of the ECM is a land to which the electric wire is connected,
for the switch The switch is provided with a contact portion corresponding to the contact pattern,
and is mounted on the contact pattern of the circuit board.
[0019]
Further, in order to realize at least one of the above problems, a method of assembling a headset
reflecting one aspect of the present invention includes: an earphone unit; a control box unit
having a switch and an ECM (electret condenser microphone); A method of assembling a headset
having a connector unit connected to the connector unit, a cord connecting the earphone unit
and the control box unit, and a cord connecting the control box unit and the connector unit, the
circuit board of the ECM, The land to which the electric wire is connected, a contact pattern for
the switch is formed, the switch has a contact portion corresponding to the contact pattern, and
the assembly of the control box portion is performed on the land of the circuit board of the ECM
While connecting the electric wire, the contact pattern of the circuit board of the ECM It is
intended to place the switch up.
[0020]
According to the present invention, since the ECM has a circuit board integrated with the ECM,
the process of soldering the ECM to the circuit board is not necessary.
[0021]
In addition, a contact pattern for the switch is formed on the circuit board of the ECM, and the
01-05-2019
5
switch has a contact portion corresponding to the contact pattern, and is mounted on the contact
pattern of the circuit board. Thus, the switch can be mounted simply by mounting the switch on
the circuit board, and the operation of soldering the switch to the circuit board is unnecessary.
Therefore, dedicated equipment such as a solder printer for mounting the switch on the circuit
board, a chip mounter, a reflow furnace, an insert machine, a solder bath and the like is not
necessary.
[0022]
For this reason, the process of mounting components on the circuit board is unnecessary, the
process is simplified, and the defect rate can be reduced. As a result, the quality is good, the cost
reduction can be expected, and the cost is low.
[0023]
It is a front view of the circuit board provided in the microphone part of the headset of 1st
Embodiment.
It is a right view of FIG.
It is a rear view of FIG.
It is a figure explaining the assembly method of the circuit board of FIG.
FIG. 5 is a cross-sectional view taken along line V-V of FIG.
It is a figure explaining the headset of 1st Embodiment.
It is a figure explaining the example of a 2nd embodiment. It is sectional drawing in the cutting
plane line VIII-VIII of FIG. It is a figure explaining 3rd Embodiment. It is a figure explaining an
example of a headset. It is a cross-sectional perspective view of ECM. It is a figure explaining the
01-05-2019
6
assembly method of the circuit board provided in the microphone part of FIG. It is a figure
explaining the assembly method of the circuit board provided in the microphone part of FIG. It is
a figure explaining the assembly method of the circuit board provided in the microphone part of
FIG.
[0024]
First Embodiment First, the overall configuration of a headset according to the present
embodiment will be described with reference to FIG. As shown in the figure, the headset 100
includes an earphone unit 103, a control box unit 105, a connector unit 109 connected to a
mobile phone 107, an earphone unit 103, a control box unit 105, a control box unit 105, and a
connector. It consists of a code 111 and a code 113 which connect between the units 109. Of the
two opposing faces of the control box unit 105, a microphone used for a call is provided on one
face side, and a switch (call origination / reception switch) 117 is provided on the lower side of
the other face side.
[0025]
A microphone used in the control box unit 105 is an ECM (electret condenser microphone) 123
in which a circuit board 121 is integrated as shown in FIGS. 1 to 3.
[0026]
A contact pattern 125 consisting of a circular inner contact 125a and an outer contact 125b
formed around the inner contact 125a on the back surface (surface opposite to the surface on
which the ECM 123 is provided) of the circuit board 121, and a wire And the lands 127 to which
are connected are formed.
Further, in the present embodiment, on the surface of the circuit board 121 (the surface on
which the ECM 123 is provided), components and the like for driving the ECM 123 are mounted
in advance.
[0027]
Next, as shown in FIG. 4, the wire 129 of the land 127 is soldered, and the rubber switch 131 is
placed on the contact pattern 125.
01-05-2019
7
[0028]
The rubber switch 131 includes a switch main body portion 131a made of conductive rubber
and a key top portion 131b.
As shown in FIG. 5 which is a cross-sectional view taken along the cutting line V-V in FIG. 4, the
switch body 131a has a hollow conical base 131c mounted on the outer contact 125b and a top
of the base 131c. It consists of a cylindrical key portion 131d connected to the side. When the
key top portion 131b is pressed, the key portion 131d of the switch body portion 131a abuts on
the inner contact 125a, and the inner contact 125a and the outer contact 125b are shorted.
Therefore, in the rubber switch 131, the base 131c mounted on the outer contact 125b of the
contact pattern 125 and the key portion 131d in contact with the inner contact 125a of the
contact pattern 125 form a contact portion corresponding to the contact pattern 125.
[0029]
According to such an assembling method, the following effects can be obtained.
[0030]
(1)
By using the circuit board 121 integrated with the ECM 123, the control box unit 105 does not
require an operation of soldering the ECM 123 to the circuit board 121.
The rubber switch 131 only needs to be mounted on the contact pattern 125 on the circuit board
121, so the operation of soldering the switch to the circuit board 121 is unnecessary.
[0031]
Therefore, dedicated equipment such as a solder printer, a chip mounter, a reflow furnace, an
insert machine, and a solder bath for mounting the switch on the circuit board 121 is not
necessary. Further, since the work of soldering the ECM 123 and the switch becomes
01-05-2019
8
unnecessary, the incidence rate of defective products can be reduced at low cost.
[0032]
(2)
By using the rubber switch 131, cost reduction can be achieved. Second Embodiment The
difference between this embodiment and the first embodiment is the switch, and the other parts
are the same, so only the switch will be described.
[0033]
Although the rubber switch is used as the switch in the first embodiment, as shown in FIG. 7, it
may be a metal dome switch 151 obtained by processing a thin metal plate into a dome shape.
The metal dome switch 151 has its periphery mounted on the outer contact 125 b of the contact
pattern 125 as shown by the cutting line VIII-VIII in FIG. 7. Then, when the central portion is
depressed, the central portion abuts on the inner contact 125a, and the inner contact 125a and
the outer contact 125b are shorted.
[0034]
Therefore, in the metal dome switch 151, the circumferential portion placed on the outer contact
125b of the contact pattern 125 and the central portion contacting the inner contact 125a of the
contact pattern 125 form a contact portion corresponding to the contact pattern 125.
[0035]
Even if such a switch is used, the same effect as that of the first embodiment can be obtained.
[0036]
The contact pattern is not limited to that shown in the first embodiment or the second
embodiment.
There is a pattern contact plated or a carbon contact pattern, etc., and the contact material
01-05-2019
9
(surface treatment is not limited).
[0037]
Further, the switches are not limited to the rubber switches and the metal dome switches of the
first and second embodiments.
For example, instead of the metal dome, it may be an embossed sheet switch made of insulating
resin and provided with a conductive member on the inner surface of the dome formed by
embossing. Third Embodiment The circuit board integrated with the ECM in the first and second
embodiments is disposed outside the ECM, but may be disposed inside the ECM.
[0038]
A pattern as shown in FIG. 9 may be formed on the circuit board of the ECM described in FIG. In
the figure, on the circuit board 201 provided inside the ECM 211 and integrated with the ECM
211, a contact pattern 225 consisting of a circular inner contact 225a and an outer contact 225b
formed around the inner contact 225a, and a wire And the lands 227 to which are connected are
formed.
[0039]
Even with the headset having such a configuration, the same effects as in the first embodiment
can be obtained.
[0040]
121 circuit board 123 ECM 125 contact pattern 127 land 129 wire 131 switch
01-05-2019
10