JP2013098581

Patent Translate
Powered by EPO and Google
Notice
This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
financial decisions, should not be based on machine-translation output.
DESCRIPTION JP2013098581
Abstract: The present invention provides an ultrasonic unit 30 that is easy to manufacture. An
ultrasonic unit (30) comprises a plurality of ultrasonic elements (60), a hollow member (70)
having a plurality of ultrasonic elements (60) joined to the outer peripheral surface, a relay
wiring board (59) and a cable (80). . The relay wiring board 59 is composed of a central wiring
board 50 and a plurality of rectangular flexible wiring boards 40 radially extending from the
outer peripheral portion of the central wiring board 50. An element connection electrode portion
41S disposed at an end portion of the bent flexible wiring board 40 is connected to the external
connection electrode portion 62S of the ultrasonic element 60. [Selected figure] Figure 4
ULTRASONIC UNIT, ULTRASONIC ENDOSCOPE, AND METHOD FOR MANUFACTURING
ULTRASONIC UNIT
[0001]
The present invention relates to an ultrasound unit having a plurality of ultrasound elements, an
ultrasound endoscope equipped with the ultrasound unit, and a method of manufacturing the
ultrasound unit.
[0002]
Ultrasonic diagnostic methods are in widespread use in which ultrasonic waves are applied to the
inside of the body, and an internal state of the body is imaged and diagnosed from echo signals.
04-05-2019
1
An ultrasound endoscope is one of the ultrasound diagnostic apparatuses used for ultrasound
diagnosis. In the ultrasonic endoscope, an ultrasonic transducer unit is disposed at the distal end
rigid portion of the insertion portion introduced into the body. The ultrasonic transducer unit has
a function of converting an electric signal into an ultrasonic wave and transmitting it to the body,
and receiving an ultrasonic wave reflected in the body to convert it into an electric signal.
[0003]
The plurality of ultrasonic transducers constituting the ultrasonic unit may be an ultrasonic cell
using a piezoelectric ceramic material (for example, PZT: lead zirconate titanate), or a capacitive
ultrasonic wave manufactured using MEMS technology. An ultrasonic cell consisting of a
transducer (Capacitive Micro-machined Ultrasonic Transducer, hereinafter referred to as "cMUT") is used.
[0004]
By applying a voltage between the lower electrode layer and the upper electrode layer, the cMUT vibrates a membrane (vibrator) including the upper electrode layer by electrostatic force to
generate an ultrasonic wave.
Moreover, since the space ¦ interval of both electrodes will change when an ultrasonic wave
injects from the outside, an ultrasonic wave is converted into an electric signal from the change
of an electrostatic capacitance.
[0005]
Since c-MUT does not use lead etc., the environmental load is smaller than an ultrasonic
transducer using piezoelectric ceramics.
[0006]
Here, it is not easy to connect a large number of ultrasonic cells with the drive cables.
Therefore, for example, JP-A-2006-87708 discloses an ultrasonic transducer using an FPC board
as a relay wiring board.
04-05-2019
2
[0007]
Further, Japanese Laid-Open Patent Publication No. 2011-23134 discloses a collective cable that
collectively connects a large number of drive cables.
[0008]
However, the ultrasonic transducer unit has been miniaturized and reduced in diameter, and its
manufacture has not been easy.
[0009]
JP 2006-87708 A JP 2011-23134 A
[0010]
A.
Caronti et al., "Capacitive ultrasound transducer array for medical imaging", August 2006,
"Microelectronics Journal", Vol. 37, No. 8, pp. 770-777.
[0011]
Embodiments of the present invention aim to provide an ultrasonic unit that is easy to
manufacture, an ultrasonic endoscope that is easy to manufacture, and a method of
manufacturing an ultrasonic unit that is easy to manufacture.
[0012]
An ultrasonic unit according to an embodiment of the present invention includes: a plurality of
ultrasonic elements each having a transmitting / receiving unit for transmitting / receiving an
ultrasonic wave disposed on a rectangular first main surface; an external connection electrode
unit; A cylindrical or semi-cylindrical hollow member in which the second main surface of the
ultrasonic element is joined to the outer peripheral surface, a circular or semicircular central
portion, and radially extending from the outer peripheral portion of the central portion A
plurality of rectangular flexible portions, and an element connection electrode portion disposed
at each end of the bent flexible portion is connected to the external connection electrode portion
04-05-2019
3
of each of the ultrasonic elements A plurality of cable connection electrodes connected to the
rear surface of the hollow member at the central portion connected to the end face of the hollow
member via respective internal wires; A relay circuit board, inserting the interior of said hollow
member, and a cable having a plurality of conductors which are connected to each of the cable
connecting the electrode portions comprises.
[0013]
An ultrasound endoscope according to another embodiment of the present invention comprises
the above-mentioned ultrasound unit.
[0014]
In the method of manufacturing an ultrasonic unit according to another embodiment of the
present invention, a plurality of ultrasonic elements each having an ultrasonic wave transmitting
/ receiving unit and an external connection electrode unit disposed on the rectangular first main
surface are used. An element connection electrode portion is formed at each end portion of the
flexible portion, comprising a process of manufacturing, a circular or semicircular central
portion, and a plurality of rectangular flexible portions extending radially from the outer
peripheral portion of the central portion. Manufacturing a relay wiring board having a plurality
of cable connection electrodes each connected to the element connection electrode via a wire on
the back surface of the central portion; and each of the plurality of ultrasonic elements Bonding
the external connection electrode portion and the element connection electrode portion of the
flexible portion of each of the relay wiring boards; and the case of the rear surface of the relay
wiring board Connecting each of a plurality of lead wires of the cable to each of the loop
connection electrode portions; bonding an end face of a cylindrical or semi-cylindrical hollow
member to the back surface of the central portion of the relay wiring board; Bending the flexible
portion to bond the second main surface of the ultrasonic element to the outer peripheral surface
of the hollow member.
[0015]
According to an embodiment of the present invention, it is an object of the present invention to
provide an ultrasonic unit easy to manufacture, an ultrasonic endoscope easy to manufacture,
and a method of manufacturing an ultrasonic unit easy to manufacture.
[0016]
It is an external view for demonstrating the ultrasound endoscope of 1st Embodiment.
04-05-2019
4
It is a perspective view for demonstrating the front-end ¦ tip part of the ultrasound endoscope of
1st Embodiment.
It is a perspective view for demonstrating the ultrasound unit of the front-end ¦ tip part of the
ultrasound endoscope of 1st Embodiment.
It is an exploded view for demonstrating the structure of the ultrasound unit of 1st Embodiment.
It is sectional drawing for demonstrating the structure of the ultrasound unit of 1st Embodiment.
It is a flowchart for demonstrating the manufacturing method of the ultrasound unit of 1st
Embodiment.
It is a top view of the ultrasound element of the ultrasound unit of 1st Embodiment.
It is sectional drawing of the ultrasonic cell of an ultrasonic element in the ultrasonic unit of 1st
Embodiment. It is a figure for demonstrating the relay wiring board of the ultrasonic unit of 1st
Embodiment, FIG. 9 (A) has shown the front surface, and FIG. 9 (B) has shown the back surface. It
is a perspective view of the flexible substrate of the relay wiring board of the ultrasonic unit of
1st Embodiment. It is a figure for demonstrating the manufacturing method of the relay wiring
board of the ultrasonic unit of 1st Embodiment, FIG. 11 (A) has shown the front surface, and FIG.
11 (B) has shown the back surface. It is a top view for demonstrating the bonding method of the
relay wiring board of the ultrasonic unit of 1st Embodiment, and an ultrasonic element. It is
sectional drawing for demonstrating the connection with the relay wiring board of the ultrasonic
unit of 1st Embodiment, a cable, and a hollow member. It is sectional drawing for demonstrating
bending of the relay wiring board of the ultrasonic unit of 1st Embodiment, and joining with the
hollow member of an ultrasonic element. It is a top view for demonstrating the relay wiring
board of the ultrasonic unit of 2nd Embodiment. It is sectional drawing for demonstrating the
connection with the relay wiring board of the ultrasonic unit of 3rd Embodiment, and a cable. It
is a figure for demonstrating the manufacturing method of the relay wiring board of the
ultrasonic unit of 3rd Embodiment, FIG. 17 (A) has shown the front surface, FIG. 17 (B) has
shown the back surface. It is a top view of the ultrasonic element of the ultrasonic unit of 4th
Embodiment. It is sectional drawing for demonstrating the structure of the ultrasound unit of 4th
04-05-2019
5
Embodiment. It is a perspective view for demonstrating the ultrasound unit of 4th Embodiment.
It is a perspective view for demonstrating the ultrasound unit of 5th Embodiment. It is a
perspective view for demonstrating the manufacturing process of the ultrasonic unit of 5th
Embodiment. It is a figure for demonstrating the hollow member of the ultrasonic unit of
embodiment.
[0017]
Hereinafter, ultrasound units 30 to 30D and ultrasound endoscopes 2 to 2D having ultrasound
units 30 to 30D according to the embodiment will be described with reference to the drawings.
[0018]
<Configuration of Ultrasonic Endoscope> As shown in FIG. 1, the ultrasonic endoscopes 2 to 2D
constitute ultrasonic endoscope systems 1 to 1D together with the ultrasonic observation device
3 and the monitor 4.
Hereinafter, since the ultrasound endoscopes 2 to 2D are similar to each other, the ultrasound
endoscope 2 will be described as an example. The ultrasonic endoscope 2 includes an elongated
insertion portion 21 inserted into the body, an operation portion 22 disposed at a proximal end
of the insertion portion 21, and a universal cord 23 extending from the side portion of the
operation portion 22; Equipped with
[0019]
At the proximal end of the universal cord 23, a connector 24A connected to a light source device
(not shown) is disposed. From the connector 24A, a cable 25 detachably connected to the camera
control unit (not shown) via the connector 25A, and a cable 26 detachably connected to the
ultrasonic observation apparatus 3 via the connector 26A It is extended. A monitor 4 is
connected to the ultrasonic observation apparatus 3.
[0020]
The insertion portion 21 is positioned and operated from the distal end side to the distal end
04-05-2019
6
rigid portion (hereinafter referred to as the distal end ) 37, the curved portion 38 located at
the rear end of the distal end 37, and the rear end of the curved portion 38 A flexible tube
portion 39 having a small diameter, a long length and flexibility up to the portion 22 is
continuously provided. The ultrasonic unit 30 is disposed on the distal end side of the distal end
portion 37.
[0021]
The operation unit 22 includes an angle knob 22A that performs bending control of the bending
unit 38 in a desired direction, an air / water supply button 22B that performs air supply and
water supply operations, a suction button 22C that performs suction operation, and a body to be
described later A treatment instrument insertion port 22D or the like which is an entrance of a
treatment instrument having a puncture needle or the like is disposed.
[0022]
Then, as shown in FIG. 2, at the tip end portion 37 where the ultrasonic unit 30 is disposed, an
illumination lens cover 31 constituting the illumination optical system, an observation lens cover
32 of the observation optical system, and Thus, a forceps port 33 from which a treatment tool
such as the puncture needle 5 (see FIG. 21) protrudes and an air / water supply nozzle (not
shown) are disposed.
[0023]
Next, the configuration of the ultrasound unit 30 will be described using FIGS. 3 to 5.
The ultrasonic array 60S of the ultrasonic unit 30 is a radial transducer group in which the long
sides of a plurality of generally rectangular ultrasonic elements 60 in plan view are connected
and curved in a cylindrical shape.
The figures are all schematic diagrams for explanation, and the number of components, the size,
the ratio of the size, etc. are different from the actual ones.
[0024]
For example, in the actual ultrasonic array 60S, 200 or more ultrasonic elements 60 with a short
side of 0.1 mm or less are arranged in a 360 degree direction on the outer peripheral surface
04-05-2019
7
70SA of the hollow member 70 with an outer diameter of 2 mm. It is a radial type transducer
group.
[0025]
At the end of the cylindrical ultrasonic array 60S, a pair of external connection electrodes 62A,
62B constituting the external connection electrodes 62S of the plurality of ultrasonic elements
60 are arranged, and the respective external connection electrodes are arranged. 62A and 62B
are connected to a plurality of conducting wires 81A and 81B of the cable 80 via the relay wiring
board 59.
The external connection electrode 62A is a drive potential electrode, and the external connection
electrode 62B is a ground potential electrode. In addition, in the code ¦ symbol of an electrode,
wiring, or conducting wire, "A" has shown that a drive potential and "B" are ground potentials.
[0026]
The ultrasonic unit 30 includes an ultrasonic array 60S composed of a plurality of ultrasonic
elements 60, a cylindrical hollow member 70, a relay wiring board 59, and a cable 80.
[0027]
The ultrasonic element 60 has a substantially rectangular first main surface 60SA, and a second
main surface 60SB opposite to the first main surface 60SA.
Then, a transmitting / receiving unit 61 for transmitting / receiving an ultrasonic wave is
disposed on the first main surface 60SA of the ultrasonic element 60, and a set of external
connection electrode units 62S is formed at the end of the first main surface 60SA. External
connection electrodes 62A and 62B are provided. The second major surfaces 60SB of the
plurality of ultrasonic elements 60 are joined to the outer peripheral surface of the hollow
member 70.
[0028]
The relay wiring board 59 is composed of a circular central wiring board 50 and a plurality of
04-05-2019
8
rectangular flexible wiring boards 40 radially extending from the outer peripheral portion of the
central wiring board 50.
[0029]
The respective flexible wiring boards 40 bent approximately 90 degrees connect the ultrasonic
elements 60 and the central wiring board 50.
[0030]
The cable 80 is inserted into the distal end portion 37, the curved portion 38, the flexible tube
portion 39, the operation portion 22, the universal cord 23, and the ultrasonic cable 26, and the
ultrasonic connector 26A is used to It is connected to the sound wave observation device 3.
[0031]
Next, the configuration and manufacturing method of the ultrasonic unit 30 will be described
using the flowchart of FIG.
<Step S11> As shown in FIG. 7, a transmitting / receiving unit 61 for transmitting / receiving an
ultrasonic wave disposed on a substantially rectangular first main surface 60SA, and an external
disposed on an end portion of the first main surface 60SA The plurality of capacitive ultrasonic
elements 60 each having the connection electrode portion 62S are manufactured using the
MEMS technology.
[0032]
In the ultrasonic element 60, a plurality of capacitive ultrasonic cells 10 are arranged in a matrix.
Note that only a part of the ultrasonic cells 10 are schematically shown in FIG. 7 for the purpose
of explanation.
The arrangement of the ultrasonic cells 10 may be a regular lattice arrangement, a staggered
04-05-2019
9
arrangement, a triangular mesh arrangement or the like, or may be a random arrangement.
[0033]
As shown in FIG. 8, the ultrasonic cell 10 has a lower electrode layer 12 connected to the
external connection electrode 62A, a lower insulating layer 13, and a cylindrical shape, which are
sequentially stacked on a silicon substrate 11 as a base. It has upper insulating layer 15 in which
cavity 14 is formed, upper electrode layer 16 connected to external connection electrode 62 B,
and protective layer 17.
[0034]
Each ultrasonic cell 10 has a lower electrode portion 12A and an upper electrode portion 16A
disposed opposite to each other with the cavity 14 therebetween.
The cavity 14 is a space for the membrane 18 to vibrate.
[0035]
The lower electrode layer 12 has a plurality of lower electrode portions 12A circular in plan
view, and a lower wiring portion 12B extending from an edge portion of the lower electrode
portion 12A. The lower wiring portion 12B connects the lower electrode portions 12A of other
ultrasonic cells of the same ultrasonic element 60. The lower wiring portion 12B is connected to
the external connection electrode 62A.
[0036]
The upper electrode layer 16 has a plurality of upper electrode portions 16A circular in plan
view, and an upper wiring portion 16B extending from an edge portion of the upper electrode
portion 16A. The upper wiring portion 16B connects the upper electrode portions 16A of the
other ultrasonic cells of the same ultrasonic element 60. The upper wiring portion 16B is
connected to the external connection electrode 62B.
04-05-2019
10
[0037]
すなわち。 All lower electrode parts 12A of a plurality of ultrasonic cells 10 arranged in the
same ultrasonic element 60 are connected to each other, and all upper electrode parts 16A are
also connected to each other.
[0038]
In the ultrasonic cell 10 having the above structure shown in FIG. 8, the upper insulating layer
15, the upper electrode layer 16, and the protective layer 17 in the region immediately above the
cavity 14 constitute a membrane 18 which is a vibrating portion.
[0039]
Here, the method of manufacturing the ultrasonic cell 10 will be described in detail.
The silicon substrate 11 is a substrate in which silicon thermal oxide films 11B and 11C are
formed on the surface of silicon 11A.
[0040]
In the formation of the lower electrode portion 12A and the upper electrode portion 16A, a
conductive material made of conductive silicon or metal, for example, copper, gold or aluminum,
is formed on the entire surface of the silicon substrate 11 by sputtering or the like. Then, after
the mask pattern by photolithography is formed and partially removed by etching, the lower
electrode layer 12 having the lower electrode portion 12A and the lower wiring portion 12B, for
example, is formed.
[0041]
In the formation of the lower insulating layer 13, the lower insulating layer 13 made of an
insulating material such as SiN is formed, for example, by the CVD method so as to cover the
lower electrode layer 12.
04-05-2019
11
[0042]
The cavity 14 is formed using a material that can be removed by etching.
The height of the cavity 14 is, for example, 0.05 to 0.3 μm, preferably 0.05 to 0.15 μm.
[0043]
The upper insulating layer 15 is formed on the upper surface of the sacrificial layer pattern, for
example, by the same method and the same material as the lower insulating layer 13. The
sacrificial layer pattern is etched away by the etchant introduced through the opening (not
shown) formed in the upper insulating layer 15, whereby the cavity 14 is formed.
[0044]
The cavity 14 is not limited to a cylindrical shape, and may have a polygonal shape or the like.
When the cavity 14 has a polygonal prism shape, it is preferable that the shapes of the upper
electrode portion 16A and the lower electrode portion 12A in plan view also be polygonal.
[0045]
The upper electrode layer 16 having the upper electrode portion 16A and the upper wiring
portion 16B is formed by the same method and the same material as the lower electrode layer
12.
[0046]
The surface of the ultrasonic element 60 is covered with a protective layer 17.
The protective layer 17 has not only a protective function but also an acoustic matching layer
function and further a function to connect the ultrasonic element 60.
04-05-2019
12
[0047]
Although the description is omitted, the external connection electrode 62A is also formed in the
lower electrode formation step, and the external connection electrode 62B is also formed in the
upper electrode formation step. The protective layer 17 is formed so as not to cover the external
connection electrode 62A and the external connection electrode 62B.
[0048]
The protective layer 17 is made of a flexible resin such as polyimide, epoxy, acrylic or
polyparaxylene, and is particularly preferably polyimide because it has high chemical resistance,
flexibility, and easy processing. . The protective layer 17 may have a two-layer structure in which
a biocompatible second insulating layer is further formed on the first insulating layer.
[0049]
<Step S12> The relay wiring board 59 includes a circular central portion, and a plurality of
rectangular flexible portions radially extended from the outer peripheral portion of the central
portion. Each flexible portion has an element connection electrode portion 41S at an end. The
central portion has a plurality of cable connection electrode portions 52S connected to the
element connection electrode portion 41S via the internal wiring 53 on the back surface.
[0050]
In the ultrasonic unit 30, in the process of producing the relay wiring board 59, the process (step
S13) of producing the circular central wiring board 50 which constitutes the central portion, and
the rectangular flexible wiring board 40 which constitutes the flexible portion. And a step of
connecting the central wiring board 50 and the plurality of flexible wiring boards 40 (step S15).
[0051]
<Step S13> As shown in FIGS. 9A and 9B, central wiring board 50 is disposed in an arc shape on
the outer peripheral portion of front surface 50SA, and each of which is a set of flexible wiring
04-05-2019
13
board connections A plurality of sets of flexible wiring board connection electrode parts 51S
consisting of electrodes 51A and 51B are provided, and in the central region of the back surface
50SB, the flexible wiring board connection electrodes 51A and 51B each via the respective
internal wiring 53S It has cable connection electrode part 52S which consists of a plurality of
cable connection electrodes 52A and 52B connected with 51B.
That is, although not shown, the internal wiring 53S has a through wiring portion that connects
the front surface 50SA and the back surface 50SB of the central wiring board 50.
[0052]
The central wiring board 50 is made of a known rigid wiring board.
[0053]
<Step S14> As shown in FIG. 10, each of the substantially rectangular flexible wiring boards 40
has an element connection electrode portion 41S at one end and a central wiring board
connection electrode 42S at the other end. .
The element connection electrode 41A and the central wiring board connection electrode 42A
are connected by the internal wiring 43A, and the element connection electrode 41B and the
central wiring board connection electrode 42B are connected by the internal wiring 43B. In the
flexible wiring board 40 shown in FIG. 10, a region other than the internal wiring 43B is used as
the internal wiring 43A in order to reduce the electrical resistance.
[0054]
The flexible wiring board 40 is made of, for example, a known flexible wiring board whose base
is polyimide.
[0055]
<Step S15> As shown in FIGS. 11A and 11B, the central wiring board connecting electrode
portions 42S of the plurality of flexible wiring boards 40 are on the outer peripheral portion of
the front surface 50SA of the central wiring board 50. The relay wiring board 59 is manufactured
04-05-2019
14
by being connected to the plurality of flexible wiring board connection electrodes 51S arranged
in an arc shape.
For connection between the central wiring board 50 and the flexible wiring board 40, for
example, solder bonding is used.
[0056]
<Step S16> As shown in FIG. 12, the external connection electrode portions 62S of the ultrasonic
element 60 are connected to the element connection electrode portions 41S of the plurality of
flexible wiring boards 40 on the outer peripheral portion of the relay wiring board 59. For
connection between the flexible wiring board 40 and the ultrasonic element 60, for example,
solder bonding is used.
[0057]
<Step S17> As shown in FIG. 13, the lead 81 of the cable 80 is connected to the cable connection
electrode portion 52S of the back surface 50SB of the relay wiring board 59. For connection
between the cable connection electrode portion 52S and the conducting wire 81, for example,
solder bonding is used. As the cable 80, the known collective cable described above may be used.
[0058]
<Step S18> As shown in FIG. 13, the end face of the cylindrical hollow member 70 is bonded to
the back surface 50SB of the relay wiring board 59 using an adhesive or the like.
[0059]
In addition, after bonding to the relay wiring board 59, the inner peripheral portion of the hollow
member 70 may be filled with a filler.
Alternatively, the cable 80 may be connected after the hollow members 70 are joined.
04-05-2019
15
Furthermore, the hollow member 70 and the cable 80 may be integrated with a filler and
simultaneously joined to the relay wiring board 59.
[0060]
<Step S19> As shown in FIGS. 13 and 14, flexible wiring board 40 of relay wiring board 59 is
bent substantially at right angles, and second main surface 60SB of ultrasonic element 60 is on
outer peripheral surface 70SA of hollow member 70. The basic structure of the ultrasonic unit
30 is completed by bonding using an adhesive or the like.
[0061]
The main surface (front surface, back surface) of the relay wiring board 59 and the main surface
of the ultrasonic element 60 face each other at a right angle, and the manufacturing process of
electrically connecting between them is not easy.
However, in the ultrasonic unit 30, the step of connecting the ultrasonic element 60 to the relay
wiring board 59 is easy because bonding is performed between the flat surface and the flat
surface. Further, the bending work of the flexible wiring board 40 is easy because it is performed
along the shape of the hollow member 70. For this reason, the ultrasound unit 30 and the
ultrasound endoscope 2 have a high manufacturing yield.
[0062]
<Operation of Ultrasonic Unit> Next, the operation of the ultrasonic unit 30 will be briefly
described. The lower electrode portion 12A of each ultrasonic cell 10 is connected to the drive
potential side through the external connection electrode 62A and the like. On the other hand, the
upper electrode portion 16A of each ultrasonic cell 10 is connected to the ground potential side
through the external connection electrode 62B and the like.
[0063]
At the time of ultrasonic wave generation, a voltage signal generation unit (not shown) of the
ultrasonic observation apparatus 3 applies a drive voltage signal to the lower electrode unit 12A.
04-05-2019
16
When a voltage is applied to the lower electrode portion 12A, the upper electrode portion 16A of
the ground potential is attracted to the lower electrode portion 12A by electrostatic force, so the
membrane 18 including the upper electrode portion 16A is deformed. When the voltage applied
to the lower electrode portion 12A disappears, the membrane 18 recovers to its original shape
by the elastic force. The deformation / recovery of the membrane 18 generates an ultrasonic
wave.
[0064]
On the other hand, at the time of ultrasonic wave reception, the membrane 18 including the
upper electrode portion 16A is deformed by the received ultrasonic energy. Then, since the
distance between the upper electrode portion 16A and the lower electrode portion 12A changes,
the capacitance between them changes. Then, a current flows in the capacitance signal detection
unit (not shown) of the ultrasonic observation apparatus 3 due to the capacitance change. That
is, the received ultrasonic energy is converted into a capacitive signal.
[0065]
As described above, in the ultrasonic unit 30, the plurality of flexible wiring boards 40 of the
relay wiring board 59 in which the plurality of ultrasonic elements 60 are radially disposed on
the outer peripheral portion are formed on the outer peripheral surface 70 SA of the hollow
member 70. It can be produced by bending along. Therefore, the ultrasound unit 30 and the
ultrasound endoscope 2A are easy to manufacture. Moreover, the manufacturing method of the
ultrasound unit 30 is easy to manufacture.
[0066]
Second Embodiment Next, a method of manufacturing the ultrasonic unit 30A, the ultrasonic
endoscope 2A, and the ultrasonic unit 30A according to the second embodiment will be
described. The ultrasonic units 30A and so forth are similar to the ultrasonic units 30 and so, so
the same components are denoted by the same reference numerals and the description thereof
will be omitted.
[0067]
04-05-2019
17
As shown in FIG. 15, the relay wiring board 59A of the ultrasonic unit 30A has a circular central
portion 50A made of a rigid substrate and a plurality of rectangular flexible portions 40A
extending radially from the outer peripheral portion of the central portion 50A. And a so-called
rigid flexible wiring board. The entire relay wiring board 59 may be a flexible wiring board, and
may be joined to a doughnut-shaped holding board having an outer diameter substantially equal
to the outer diameter of the central portion 50A.
[0068]
The ultrasonic unit 30A and the ultrasonic endoscope 2A have the effect of the ultrasonic unit 30
etc. Further, the relay wiring board 59A is easier to manufacture than the relay wiring board 59.
Similarly, the method of manufacturing the ultrasonic unit 30A has the effects of the method of
manufacturing the ultrasonic unit 30, and is further easier to manufacture.
[0069]
Third Embodiment Next, a method of manufacturing the ultrasound unit 30B, the ultrasound
endoscope 2B, and the ultrasound unit 30B of the third embodiment will be described. The
ultrasonic unit 30B and the like are similar to the ultrasonic unit 30 and the like, so the same
components are denoted by the same reference numerals and the description thereof will be
omitted.
[0070]
As shown in FIG. 16, in the ultrasonic unit 30B, the connector 83 connected to the cable
connection electrode 52SB is joined to the back surface of the relay wiring board 59B, and the
cable 80B is relay wiring board via the connector 83. Connected with 59
[0071]
The cable connection electrode portion 52SB is connected to the connector 83 by soldering or
the like.
04-05-2019
18
The ultrasonic unit 30B connecting the cable 80B and the relay wiring board 59B via the
connector 83 is easier in connection process than the ultrasonic unit 30 and the like. When the
connector 83 is used, the cable 80B can be connected to the connector 83 after the hollow
member 70 is joined to the relay wiring board 59. That is, although the handling of the relay
wiring board 59 to which the long cable is connected may not be easy in some cases, it is easy to
use the connector 83 in the ultrasonic unit 30B.
[0072]
That is, the ultrasound unit 30B and the ultrasound endoscope 2B have the same effects as the
ultrasound unit 30 and the like, and are further easier to manufacture. Similarly, the method of
manufacturing the ultrasonic unit 30B has the effects of the method of manufacturing the
ultrasonic unit 30, and is further easier to manufacture.
[0073]
Also, in the ultrasonic unit 30B, the buffer member 71 is disposed in the hollow member 70. The
ultrasonic element 60 is disposed on the hollow member 70 via the buffer member 71. The
buffer member 71 is made of a backing material that absorbs unnecessary ultrasonic waves to
improve the efficiency of transmission and reception. That is, the buffer member 71 restricts the
free vibration of the membrane when emitting ultrasonic waves, and improves the resolution in
the traveling direction of the ultrasonic waves. For the buffer member 71, various materials
capable of absorbing vibration can be used, and both inorganic materials and organic materials
can be applied. In particular, epoxy resins and rubber materials are preferable because they have
small acoustic impedance and can absorb vibrations without lowering sensitivity.
[0074]
Therefore, the ultrasonic unit 30B and the like have the effect of the ultrasonic unit 30 and the
like, and the sensitivity is further high. By disposing the buffer member 71 also on the ultrasonic
units 30 and 30A, it is possible to improve the efficiency of transmission and reception in the
same manner as the ultrasonic unit 30B.
04-05-2019
19
[0075]
Further, as shown in FIGS. 17A and 17B, in the relay wiring board 59B, the plurality of element
connection electrodes 41B, which are ground potential electrodes, have one cable connection
electrode at the center of the back surface by the internal wiring 53BB. (Second electrode) 52BB
is connected. The element connection electrodes 41A, which are drive potential electrodes, are
connected to the respective cable connection electrodes (first electrodes) 52AB by the internal
wiring 53AB. That is, the number of cable connection electrode portions (second electrodes)
52BB of the ground potential is one, which is smaller than the number of cable connection
electrodes (first electrodes) 52AB of the drive potential. In other words, the cable connection
electrode portion 52SB includes one cable connection electrode (second electrode) 52BB and a
plurality of cable connection electrodes (first electrodes) 52AB.
[0076]
Therefore, only one lead 81B of the ground potential connected to the cable connection electrode
(second electrode) 52BB of the cable 80B is disposed at the center. The conductor of the ground
potential may be a common shield wire of the cable 80B, and the number of second electrodes
and the conductor of the ground potential may be two or more.
[0077]
The ultrasonic unit 30B and the ultrasonic endoscope 2B have the same effect as the ultrasonic
unit 30, and further, the number of connection points between the cable 80B and the relay
wiring board 59B is small, so that manufacture is easier. Similarly, the method of manufacturing
the ultrasonic unit 30B has the effects of the method of manufacturing the ultrasonic unit 30,
and is further easier to manufacture.
[0078]
The whole of the relay wiring board 59B of the ultrasonic unit 30B is made of a flexible substrate
in the same manner as the relay wiring board 59A of the ultrasonic unit 30A, and is bonded to
the donut shaped holding plate 53 by an adhesive or the like.
[0079]
04-05-2019
20
Also, in the ultrasonic units 30, 30A and the ultrasonic endoscopes 2, 2A, the same effect can be
obtained by using the same structure as the ultrasonic unit 30B and the like.
[0080]
Fourth Embodiment Next, an ultrasonic unit 30C, an ultrasonic endoscope 2C, and a method of
manufacturing the ultrasonic unit 30C according to a fourth embodiment will be described.
The ultrasonic unit 30C and the like are similar to the ultrasonic unit 30 and the like, so the same
components are denoted by the same reference numerals and the description thereof is omitted.
[0081]
As shown in FIG. 18, the ultrasonic element 60C of the ultrasonic unit 30C has an external
connection electrode 62A which is a driving potential electrode at one end of the first main
surface 60SA, and has the ground potential at the other end. It has an external connection
electrode 62B which is an electrode.
The relay wiring board 59C is composed of a flexible wiring board 40C (40CS) and a central
wiring board 50C.
[0082]
As shown in FIGS. 19 and 20, each external connection electrode 62B is connected to one
common ground line 84 arranged in an arc along the outer peripheral portion of the ultrasonic
array 60SC. The common ground line 84 is connected to the conductor 81E of the ground
potential of the cable 80C.
[0083]
As described above, the ultrasonic unit 30C and the ultrasonic endoscope 2C have the same
04-05-2019
21
effects as the ultrasonic unit 30, and furthermore, the number of connection points between the
cable 80C and the relay wiring board 59 is small. It is easy. Similarly, the method of
manufacturing the ultrasonic unit 30C has the effects of the method of manufacturing the
ultrasonic unit 30, and is further easier to manufacture.
[0084]
The arrangement of the external connection electrode 62A and the external connection electrode
62B in the ultrasonic element 60 or the like is not limited to the form described above. For
example, the ultrasonic element 60 or the like may have the external connection electrode 62A
on the first main surface and the external connection electrode 62B on the second main surface.
[0085]
The two electrodes 41A and 41B of the element connection electrode portion 41S of the flexible
wiring board 40 or the flexible portion of the relay wiring board are arranged on different main
surfaces depending on the arrangement of the external connection electrode portion 62S of the
ultrasonic element 60. It is also good.
[0086]
Fifth Embodiment Next, a method of manufacturing an ultrasound unit 30D, an ultrasound
endoscope 2D, and an ultrasound unit 30D according to a fifth embodiment will be described.
The ultrasonic unit 30D and the like are similar to the ultrasonic unit 30 and the like, so the
same components are denoted by the same reference numerals and the description thereof is
omitted.
[0087]
As shown in FIG. 21, the ultrasound unit 30D disposed at the distal end portion 37 of the
ultrasound endoscope 2D has an ultrasound array 60SD which is a convex-type transducer
group. The ultrasound unit 30D scans a plane including the puncture needle 5 protruding from
the forceps port 33.
04-05-2019
22
[0088]
As shown in FIGS. 21 and 22, the ultrasonic array 60SD of the ultrasonic unit 30D comprises a
plurality of ultrasonic elements 60 joined to the outer peripheral surface of a substantially semicylindrical hollow member 70D. The end face of the hollow member 70D is joined to a
substantially semi-cylindrical central wiring board 50D. The method of manufacturing the
ultrasonic unit 30D is the same as that of the ultrasonic unit 30 and the like described above.
That is, by bending the flexible wiring board 40 to which the ultrasonic element 60 is connected
at approximately 90 degrees, the ultrasonic element 60 is joined to the outer peripheral surface
of the hollow member 70D.
[0089]
That is, the hollow member 70D of the ultrasonic unit 30D constituting the convex type vibrator
is substantially semi-cylindrical, and the central wiring board 50D is also substantially semicircular as the end face of the hollow member 70D.
[0090]
The ultrasound unit 30D and the ultrasound endoscope 2D have the same effects as the
ultrasound unit 30 and the like.
Similarly, the method of manufacturing the ultrasonic unit 30D has the effects of the method of
manufacturing the ultrasonic unit 30, and the like.
[0091]
The end faces of the relay wiring board and the hollow member of the embodiment may be
circular as shown in FIG. 23 (A), or may be semicircular as shown in FIG. 23 (B). As shown in FIG.
23C, it may be substantially semicircular. That is, in the present invention, the circular or
semicircular shape may be a shape including a substantially circular shape or a substantially
semicircular shape and further having a circular arc in part. Similarly, the cylindrical and semicylindrical shapes may have a shape in which the end face has an arc in part. That is, the shapes
04-05-2019
23
of the relay wiring board and the hollow member can be changed according to the scanning
range of the ultrasonic unit.
[0092]
In addition, as the ultrasound unit of the embodiment, the ultrasound array 60S of the radial type
transducer group described in the first embodiment and the like, and the ultrasound array 60SD
of the convex type transducer group described in the fifth embodiment, May be included.
[0093]
The above embodiment has been described by taking an ultrasonic unit and an ultrasonic
endoscope manufactured by the capacitive MEMS technology as an example.
This is because the capacitive ultrasonic unit is particularly suitable for miniaturization, and the
effects of the present invention are remarkable. However, it is apparent that the present
invention has the same effect in piezoelectric ultrasonic units and ultrasonic endoscopes using
PZT and other piezoelectric ceramics.
[0094]
The present invention is not limited to the above-described embodiment, and various changes,
modifications, for example, combinations of components of the embodiment, and the like are
possible without departing from the scope of the present invention.
[0095]
DESCRIPTION OF SYMBOLS 1 ... Ultrasonic endoscope system 2 ... Ultrasonic endoscope 3 ...
Ultrasonic observation apparatus 10 ... Ultrasonic cell 30 ... Ultrasonic unit 40 ... Flexible wiring
board 41S ... Element connection electrode part 42S ... Central wiring board connection electrode
part 43A, 43B: Internal wiring 50: Central wiring board 51S: Flexible wiring board connection
electrode part 52S: Cable connection electrode part 53A, 53B ... Internal wiring 59 ... Relay wiring
board 60 ... Ultrasonic element 60S ... Ultrasonic array 61 ... Transmission / reception part 62S
External connection electrode portion 70 Hollow member 71 Buffering member 80 Cable
04-05-2019
24