JP2013055693

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DESCRIPTION JP2013055693
Abstract: An ultra-thin package of an electroacoustic sensor chip of a micro-electro-mechanical
system is provided. An ultra-thin package of an electroacoustic sensor chip of a micro-electromechanical system is provided. The substrate has a first substrate surface and a second substrate
surface opposite the first substrate surface. At least one conductive protrusion is formed on the
second substrate surface. An electroacoustic sensor chip is provided having a first chip surface
and a second chip surface opposite the first chip surface. The first chip surface is electrically
connected to the conductive protrusion. The conductive protrusions are located between the
second substrate surface and the first chip surface to form a space. The conductive protrusions
transmit signals from the sensor chip to the substrate. An acoustic aperture is formed through
the substrate. [Selected figure] Figure 1
Ultra-thin package of electro-acoustic sensor chip of micro-electromechanical system
[0001]
The present invention relates to a package of a micro-electro-mechanical system, and more
particularly to an ultra-thin package of an electroacoustic sensor chip of a micro-electromechanical system.
[0002]
Due to the tendency of electronic products to have multiple functions and the volume becoming
lighter and smaller, the correlated device volume and packaging technology also tend to be
smaller and smaller.
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With the miniaturization of integrated devices, packaging technology has an important
correlation with manufacturing cost, size and performance characteristics. At present,
microelectromechanical systems (MEMS) technology is used in order to achieve the purpose of
chip packaging technology being highly diversified, product diversification, and reduction in size
and size. Microelectricity is a method of manufacturing integrated devices at the wafer level. The
goal of micro-electricity is to align electronic and mechanical systems within the wafer. The
manufacturing and packaging process of mechanical systems is considerably more complicated
than electrical systems. Furthermore, MEMS technology is used in the manufacture and
packaging of electronic devices such as mobile phone microphones. Due to the limitations of the
known MEMS packaging process, there is a lack of quality and stability in the manufacture of
mobile phone microphones.
[0003]
In particular, because the substrate of the known MEMS package is thick and the selection
material is concerned, the microphone package of the mobile phone can not be automated,
preventing miniaturization and cost reduction. Furthermore, large-sized electronic devices
interfere with the effect of the microphone of a mobile phone because the time for signal
transmission is long and electromagnetic interference phenomenon is likely to occur. Thus, there
is a need for a low cost, ultra-thin package of micro-electro-mechanical system that prevents
electromagnetic interference.
[0004]
The present invention is to provide an ultra-thin package of an electroacoustic sensor chip of a
micro-electro-mechanical system and to remedy the above mentioned problems.
[0005]
The present invention provides an ultra-thin package of an electroacoustic sensor chip of a
micro-electro-mechanical system.
An example of an ultra-thin package of an electroacoustic sensor chip of a micro-electromechanical system is formed on a second substrate surface, a substrate having a first substrate
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surface, a second substrate surface opposite to the first substrate surface, and The first chip
surface is electrically connected to the conductive protrusion, the conductive protrusion having
the second substrate surface and the at least one conductive protrusion, and the second chip
surface opposite to the first chip surface and the first chip surface. An electrical acoustic sensor
chip located between the first chip surface to form a space, the conductive protrusion
transmitting a signal to the substrate, an acoustic opening through the substrate, and between
the second substrate surface and the first chip surface And a chamber positioned and in
communication with the acoustic opening and sealing the perimeter of the space by the packed
bed.
[0006]
Another embodiment of the ultra-thin package of the electroacoustic sensor chip of the microelectro-mechanical system of the present invention is a substrate having a first substrate surface,
a second substrate surface opposite to the first substrate surface, and a second substrate And at
least one conductive protrusion formed on the surface, and a first chip surface and a second chip
surface opposite to the first chip surface, the first chip surface being electrically connected to the
conductive protrusion, the conductive protrusion being An electro-acoustic sensor chip
positioned between the second substrate surface and the first chip surface to form a space, and
the conductive protrusion transmitting a signal to the substrate, an acoustic aperture penetrating
the substrate, and the second substrate surface A chamber located between the first chip surface,
in communication with the acoustic opening, and sealed by the filling layer, formed on the
second substrate surface outside the electro-acoustic sensor chip and electrically sealed at the
system point Contact Is, at least one conductive ball for transmitting signals from the substrate to
the system point, consists.
[0007]
Yet another embodiment of the ultra-thin package of the electroacoustic sensor chip of the
micro-electro-mechanical system of the present invention is a substrate having a first substrate
surface and a second substrate surface opposite to the first substrate surface; A conductive
protrusion having at least one conductive protrusion formed on a substrate surface, and a first
chip surface and a second chip surface opposite to the first chip surface, the first chip surface
being electrically connected to the conductive protrusion Is positioned between the second
substrate surface and the first chip surface to form a space, and the conductive protrusions
transmit the signal to the substrate, an electroacoustic sensor chip, an acoustic aperture through
the substrate, and the second substrate surface And the first chip surface, which is in
communication with the acoustic opening, and the filling layer seals the outer periphery of the
space through the chamber, and the outer stretched layer of the electroacoustic sensor chip, and
electrically connected to the second substrate surface. Connected, Transmitting a signal from the
plate to the system point, a conductive plug that connects the substrate and the system point,
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consists.
[0008]
According to the present invention, the application range and process technology can be
extended in a low cost and simple process, electromagnetic interference can be prevented, and
problems such as reduction in signal strength and signal interference can be avoided.
[0009]
The present invention provides an ultra-thin package of an electroacoustic sensor chip of a
micro-electro-mechanical system.
The manufacturing method and use method of each embodiment will be described in detail
below and will be described in the form of a diagram.
The symbols of homology used in the schematic and in the specification indicate homologous or
similar elements.
In the drawings, the shapes and thicknesses of the examples differ from the actual situation in
order to simplify the description. The following depiction is in particular a description of each
element or alignment of the device according to the invention, but it should be noted that the
elements described above are by no means limited to what has been shown and described, said
art In addition, when one layer of material is located on another material layer or on the
substrate, it is directly located on the surface or other mediating agent. Layers can be inserted.
[0010]
FIG. 1 is a diagram showing an example of a micro-electro-mechanical system. In the specific
example, the micro-electro-mechanical system comprises a substrate 40 having a first substrate
surface 4 and a second substrate surface 6. The micro-electro-mechanical system comprises an
electroacoustic sensor chip 10 having a first chip surface 12 and a second chip surface 14. An
acoustic chamber plate 9 is formed on the second chip surface 14. A conductive protrusion 8 is
formed between the second substrate surface 6 of the substrate 40 and the first chip surface 12
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of the electroacoustic sensor chip 10. Thus, the substrate 40 is electrically connected to the
electroacoustic sensor chip 10. In one embodiment, the electroacoustic chip 10 and the substrate
40 are connected by flip chip technology or wire bonding technology. The electro-acoustic
sensor chip 10 is formed by aligning integrated circuits of switch function, microelectronic
function, software or correlation on a single chip by CMOS process and microelectronic
technology. The electroacoustic chip 10 senses and responds to sounds from the surrounding
environment. In one embodiment, a polymer sensor membrane is formed on the first chip surface
12 of the electroacoustic chip 10.
[0011]
Referring to FIG. 1, the substrate 40 is a multilayer structure having a substrate material 2, a
metal layer 24 and at least one shielding layer 22. The substrate material 2 is a rigid substrate
material or a flexible substrate material. In a preferred embodiment, the rigid substrate material
is a copper foil substrate. The copper foil substrate is formed by immersing the reinforcing
material in viscose resin. The reinforcement is dried, cut and stacked, then foiled with copper and
molded with a steel mold in the high temperature and pressure environment of the press. The
flexible substrate material used for the multilayer layer is usually a semi-finished product of
copper-clad laminate (mostly made by dipping glass fiber in viscose resin and drying). There are
various methods for classifying copper foil substrates. Copper-clad laminates are classified into
paper laminates, glass fiber laminates, composite laminates (CEM series), multilayer laminates,
and special material laminates (ceramics, metal cores, etc.) according to the type of reinforcing
material. Paper lamination is classified into phenol / formaldehyde resin (XPC, XXXPC, FR-1, FR2 etc.), epoxy resin (FE-3), polyester resin etc. according to the type of viscose resin adopted. A
commonly used glass fiber laminate is an epoxy resin (FE-4 or FE-5), which is the most widely
used type at present. Other special resins (glass fiber, polyamide, and reinforced with reinforcing
materials such as non-woven fibers) are bismaleimide triazine resin (BT), polyamide (PI),
polyphenylene oxide (PPO), styrene anhydride And maleic acid copolymers, polycyanurate
polyolefins, and the like. Glass fiber laminates are classified into flame retardant types (UL94-VO
or UL94-V1) and non-flame retardant types (UL94-HB). In consideration of the environment,
some novel glass fibers do not contain bromine elements of flame-retardant glass fiber laminates,
and are referred to as environmentally-friendly flame-retardant glass fiber laminates. With the
rapid development of electronic product technology, it is required that the glass fiber lamination
function has a higher function. Thus, glass fiber laminates are generally classified as low K, high
heat resistance, thermal expansion coefficient glass fiber laminates, or others.
[0012]
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Referring to FIG. 1, the substrate 40 has a metal layer 24 as an intermediary structure. The
substrate 40 has at least one shielding layer 22 extending to the substrate 40 to prevent
electromagnetic interference. The shielding layer 22 is made of a conductive polymer such as
silver epoxy, or a metal such as copper or gold.
[0013]
In one embodiment, substrate 40 is a multilayer structure. The substrate material 22 is silicon.
The substrate material 22 may be a flexible flexible substrate material, thus extending the
application range and process technology. The multilayer structure 40 is thinner than known
silicon substrates, thus providing a thinner package thickness. Shielding layers 22 that prevent
electromagnetic interference improve the effectiveness of the microphone. Since the metal layer
24 is formed and functions as an electrical connection, there is no need to etch the substrate to
form an electrical connection during the packaging process, providing a low cost simple process.
[0014]
The conductive protrusions 8 are tin (Sn), tin-zinc alloy (SnZn alloy), tin-silver alloy (SnAg alloy),
tin-gold alloy (SnAu alloy), tin-bismuth alloy (SnBi alloy), tin-silver-copper alloy (SnAgCu alloy),
tin Lead alloy (SnPb alloy) or other material. The substrate 40 is electrically connected to the
electroacoustic sensor chip 10 by the conductive protrusions 8. The conductive protrusions 8
transmit the signal from the electroacoustic sensor 10 to the substrate 40.
[0015]
Referring to FIG. 1, a chamber 18 is provided. Since the conductive protrusions 8 located
between the second substrate surface 6 of the substrate 40 and the first chip surface 12 of the
electroacoustic sensor chip 10 have a height, the second substrate surface 6 of the substrate 40
and the second of the electroacoustic sensor chip 10 A space can be formed between one chip
surface 12. The chamber 18 is formed by sealing the outer periphery of the space by the filling
layer 20. An acoustic opening 16 is formed through the substrate and in communication with the
chamber 18. The acoustic aperture 16 receives an external sound wave. The acoustic aperture 16
prevents dust and moisture from entering the chamber 18 and affecting the effectiveness and
quality of the microphone. In the embodiment, the shielding layer 22 is formed on the first
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substrate surface 4 (not shown), and the shielding layer 22 has at least one hole on the acoustic
aperture 16. The exemplary shielding layer 22 can prevent electromagnetic interference and
prevent dust and moisture from entering the chamber 18 and affecting the effectiveness and
quality of the microphone.
[0016]
The conductive balls 26 are formed on the outer second substrate surface 6 of the
electroacoustic sensor chip 10. The conductive balls 26 are electrically connected to the system
point 28 to transmit the signal from the substrate 40 to the system point 28. In a preferred
embodiment, after the signal from the electroacoustic sensor chip 10 is transmitted to the
substrate 40, as shown in FIG. 1, by the conductive protrusions 8 on the second substrate surface
6 and the metal layer 24 in the substrate 40, Furthermore, the metal layer 24 on the second
substrate surface 6 and the conductive balls 26 transmit the signal transmitted to the substrate
40 to the system point 28. The signal does not have to be transmitted by means of known
conductive metals which penetrate the silicon substrate. Thus, the transmission path is shorter
than in the prior art, avoiding problems such as reduction in signal strength and signal
interference. In another embodiment, a thin flexible laminate is connected to the outer second
substrate surface 6 of the electroacoustic sensor chip 10 by means of a tape carrier package or
chip on film (COF) technology and pulled out laterally by means of gold fingers (as illustrated do
not do).
[0017]
FIG. 2 shows another embodiment of a micro-electro-mechanical system. The same parts as FIG.
1 will not be described. In the specific example, the chamber 18 ′ is formed by sealing the outer
periphery of the space 18 b between the second substrate surface 6 and the first chip surface 12
by the filling layer 20, and the space 18 b below the second substrate surface 6. It has a cavity
18a. The cavity 18a is located between the acoustic aperture 16 and the space 18b. In one
embodiment, a shielding layer 22 is formed on the first substrate surface 4 (not shown), and the
shielding layer 22 has at least one hole on the acoustic aperture 16. The exemplary shielding
layer 22 prevents electromagnetic interference and prevents dust and moisture from entering
the chamber 18 'and affecting the effectiveness and quality of the microphone.
[0018]
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In the specific example, a cavity 18a penetrating the entire substrate 40 is formed (not shown).
Thus, in this case, the formed chamber 18 'penetrates the entire substrate 40 (not shown). A
fiber layer with micropores is located on the chamber 18 'in a horizontal position with the first
substrate surface 4. The fiber layer with micropores and located above the chamber 18 'receives
external sound waves, prevents electromagnetic interference, dust and moisture can enter the
chamber 18' and affect the effectiveness and quality of the microphone To prevent. In one
embodiment, a shielding layer 22 is formed on the first substrate surface 4 (not shown) and has
at least one hole on the chamber 18 '. The shielding layer 22 in this case prevents
electromagnetic interference and prevents dust and moisture from entering the chamber 18 'and
affecting the effectiveness and quality of the microphone.
[0019]
FIG. 3 illustrates another embodiment of a micro-electro-mechanical system. The same parts as
FIG. 1 will not be described. In the specific example, the filling layer 20 has an extending portion
20 a extending outward and filling an area on the second substrate surface 6 close to the
electroacoustic sensor chip 10. The conductive plug 26 ′ penetrates the extension 20 a on the
outside of the electroacoustic sensor chip 10 and is electrically connected to the second
substrate surface 6 to transmit the signal from the substrate 40 to the system point 28.
Therefore, after the signal is transmitted from the electroacoustic sensor chip 10 to the substrate
40 as shown in FIG. 3 by the conductive bumps 8 on the second substrate surface 6 and the
metal layer 24 in the substrate 40, the second The metal layer 24 on the substrate surface 6 and
the conductive plug 26 ′ transmit the signal transmitted to the substrate 40 to the system point
28. Thus, the signal does not have to be transmitted by means of known conductive metals which
penetrate the silicon substrate. Thus, the transmission path is shorter than in the prior art,
avoiding problems such as reduction in signal strength and signal interference.
[0020]
FIG. 4 illustrates another embodiment of a micro-electro-mechanical system. The same parts as
FIG. 3 will not be described. In the specific example, the chamber 18 ′ is formed by sealing the
outer periphery of the space 18 b between the second substrate surface 6 and the first chip
surface 12 by the filling layer 20, and the space 18 b below the second substrate surface 6. It has
a cavity 18a. The cavity 18a is located between the acoustic aperture 16 and the space 18b. In
one embodiment, the cavity 18a penetrates the entire substrate 40 (not shown), and thus the
formed chamber 18 'penetrates the entire substrate 40 (not shown). A fiber layer with
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micropores is located on the chamber 18 'in a horizontal position with the first substrate surface
4. The fiber layer with micropores and located above the chamber 18 'receives external sound
waves and prevents dust and moisture from entering the chamber 18' and affecting the
effectiveness and quality of the microphone.
[0021]
FIG. 5 is a view showing a chamber formed by sealing the outer periphery of the space 18 b
between the second substrate surface 6 and the first chip surface 12 by the filling layer 20. A
plurality of conductive protrusions are formed on the surface of the electroacoustic sensor chip
10. There are a small annular arrangement and a large annular arrangement in the arrangement
of conductive protrusions. The annular arrangement may be circular, triangular, square or other
enclosed arrangement. In the packing material, the macrocyclic conductive projections 8b fill the
outer periphery of the space 18b from the outside by the capillary effect, and the conductive
material 8a of the small annular array is used as a stop layer, whereby the packing material is
filled with the space 18b. A chamber 18 or 18 'is formed between the second substrate surface 6
and the first chip surface 12 because the outer periphery is sealed and the spacer is not
completely filled.
[0022]
The advantages of the micro-electro-mechanical system are as follows. The substrate is a
multilayer structure consisting of a substrate material, a metal layer and at least one shielding
layer. The substrate material is a flexible flexible substrate material, thus extending the
application range and process technology. The multilayer structure is thinner than known silicon
substrates, thus providing a thinner package thickness. Shielding layers that prevent
electromagnetic interference improve the effectiveness of the microphone. Because the metal
layer is formed and functions as an electrical connection, there is no need to etch the substrate to
form a connection during the packaging process, providing a low cost simple process. The
openings or fine holes in the fiber layer located above the chamber receive external sound waves
and prevent dust and moisture from entering the chamber 18 'and affecting the effectiveness and
quality of the microphone. After the signal is transmitted from the electroacoustic sensor chip to
the substrate by the conductive protrusions on the second substrate surface and the metal layer
in the substrate, the signal is transmitted from the substrate to the system by the metal layer and
conductive balls on the second substrate surface Transmitted to the point. Thus, the signal does
not have to be transmitted by means of known conductive metals which penetrate the silicon
substrate. Thus, the transmission path is shorter than in the prior art, avoiding problems such as
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reduction in signal strength and signal interference.
[0023]
Although the preferred embodiments of the present invention have been disclosed as described
above, they are by no means limited to the present invention, and any person skilled in the art
can make various changes without departing from the spirit and scope of the present invention.
Variations and tints can be added, so the scope of protection of the present invention is based on
the subject matter specified in the claims.
[0024]
It is sectional drawing which shows the example of a micro electro mechanical system.
It is sectional drawing which shows the example of a micro electro mechanical system. It is
sectional drawing which shows the example of a micro electro mechanical system. It is sectional
drawing which shows the example of a micro electro mechanical system. It is a figure which
shows the example of a chamber.
[0025]
2 ... substrate material 4 ... first substrate surface 6 ... second substrate surface 8 ... conductive
protrusion 9 ... chamber plate 10 ... electric acoustic sensor chip 12 ... first chip surface 14 ...
second chip surface 16 ... acoustic aperture 18 ... chamber 18a ... Cavity 18b ... Space 18 '...
Chamber 20 ... Filled layer 20a ... Stretched portion (stretched layer) 22 ... Shielding layer 24 ...
Metal layer 26 ... Conductive ball 28 ... System point 26' ... Conductive plug 40 ... Substrate
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