Patent Translate Powered by EPO and Google Notice This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate, complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or financial decisions, should not be based on machine-translation output. DESCRIPTION JP2011035537 A microphone unit in which a microphone jack and a built-in microphone can be easily mounted on a substrate in an assembly process, and a recording device provided with the microphone unit. A microphone unit 2 according to the present invention includes a unit main body 20 configured by integrating a microphone jack 3 and a built-in microphone 4 by a housing 21, and an input pin should be inserted into the microphone jack 3. The insertion hole 30 penetrates from the front to the back of the microphone jack 3, and the built-in microphone 4 is disposed on the back side of the microphone jack 3 so as to be close to the back. A connection wiring 23 is provided to connect the ground terminal 41 of the second embodiment to the ground terminal 31 of the microphone jack 3. [Selected figure] Figure 3 Microphone unit and recording device [0001] The present invention relates to a microphone unit comprising a microphone jack and a built-in microphone, and a recording device comprising the microphone unit. [0002] In this type of recording device, as shown in FIG. 8, the microphone unit (101) has a substrate for the microphone jack (103) into which the input pin (102) of the external microphone device is to be inserted and the built-in microphone (104). (105) is mounted on top and configured. 01-05-2019 1 Then, when the input pin (102) is inserted into the microphone jack (103), the audio signal from the external microphone device is recorded by the recording device, and the input pin (102) is removed from the microphone jack (103). If so, the audio signal from the built-in microphone (104) is recorded by the recording device. Patent Document 1 discloses a microphone unit in which the arrangement of the microphone jack (103) and the built-in microphone (104) is different from the arrangement shown in FIG. [0003] Unexamined-Japanese-Patent No. 2000-152361 [0004] However, in the conventional microphone unit (101), since the microphone jack (103) and the built-in microphone (104) must be separately mounted on the substrate (105) in the assembly process, the microphone on the substrate (105) Installation of the jack (103) and the built-in microphone (104) was complicated. [0005] In addition, on the substrate (105), a wire for connecting the ground terminal and the output terminal of the microphone jack (103), and a wire for connecting the ground terminal and the output terminal of the built-in microphone (104) are provided. Since it was necessary, there was a problem that the area of the wiring on the substrate (105) was increased. [0006] SUMMARY OF THE INVENTION An object of the present invention is to provide a microphone unit in which the microphone jack and the built-in microphone can be easily mounted on a substrate in an assembly process, and a recording apparatus provided with the microphone unit. [0007] The microphone unit according to the present invention comprises a microphone jack into which an input pin of an external microphone device is to be inserted and a built-in microphone, and a ground terminal and an output terminal are provided in the microphone jack and the built-in microphone, respectively. 01-05-2019 2 Here, the microphone unit includes a unit main body configured by integrating the microphone jack and the built-in microphone by an exterior member, and an insertion hole for inserting an input pin in the microphone jack is from the front surface of the microphone jack It penetrates to the back, and the built-in microphone is disposed on the back side of the microphone jack and is close to or in contact with the back, and the ground terminal of the built-in microphone is connected to the ground terminal of the microphone jack inside the unit body Wiring to connect is provided. [0008] In the microphone unit, since the unit body is configured by integrating the microphone jack and the built-in microphone, the microphone jack and the built-in microphone are disposed on the substrate only by mounting the microphone unit on the substrate. It will be. Therefore, as compared with the conventional configuration in which the microphone jack and the built-in microphone are separately mounted on the substrate, the mounting of the microphone jack and the built-in microphone on the substrate in the assembly process is simplified. . [0009] Also, in the above microphone unit, the ground terminal of the built-in microphone is connected to the ground terminal of the microphone jack inside the unit body, so the number of terminals of the microphone unit to be connected to the wiring on the substrate is the built-in microphone It will decrease by the amount of the ground terminal. Therefore, it is not necessary to provide a wire for connecting the ground terminal of the built-in microphone on the substrate, and therefore the area of the wire on the substrate is reduced. [0010] In the specific configuration of the microphone unit, the unit main body includes a housing that accommodates the microphone jack and the built-in microphone as the exterior member, and a 01-05-2019 3 vibration-proof member is provided between the inner surface of the housing and the built-in microphone. It intervenes. According to the specific configuration, even when vibration is applied to the microphone unit and the case vibrates due to the vibration, the vibration is absorbed by the vibration isolation member. Therefore, the vibration imparted to the microphone unit is less likely to propagate to the built-in microphone, and hence the sound signal output from the built-in microphone is less likely to contain vibration noise. [0011] In another specific configuration of the microphone unit, the unit main body is obtained by molding the microphone jack and the built-in microphone with an exterior resin. According to the specific configuration, even when vibration is applied to the microphone unit, the vibration is absorbed by the exterior resin. Therefore, the vibration imparted to the microphone unit is less likely to propagate to the built-in microphone, and hence the sound signal output from the builtin microphone is less likely to contain vibration noise. [0012] A recording apparatus according to the present invention comprises the above-mentioned microphone unit and an apparatus main body incorporating a substrate on which the microphone unit is mounted. [0013] In the specific configuration of the recording device, the recording device selectively records an audio signal from the microphone jack or the built-in microphone, and an electrical connection between the recording means and the microphone jack or the built-in microphone. And switching means for determining whether or not an input pin is inserted in the microphone jack to control switching operation of the switching means, the control means including an input pin inserted in the microphone jack When it is determined that the recording means and the microphone jack are electrically connected by controlling the switching operation of the switching means, and when it is determined that the input pin is not inserted into the microphone jack, the switching of the switching means Control the operation to electrically connect the recording means and the built-in microphone To connect to. 01-05-2019 4 [0014] According to the above specific configuration, when the input pin is inserted into the microphone jack, the audio signal from the external microphone device is recorded by the recording means, and when the input pin is not inserted into the microphone jack, The audio signal from the builtin microphone is recorded by the recording means. [0015] According to the microphone unit and the recording device of the present invention, the microphone jack and the built-in microphone can be easily mounted on the substrate in the assembly process. [0016] FIG. 1 is a view for explaining a state in which an input pin of an external microphone device is not inserted into a microphone jack in a recording apparatus according to an embodiment of the present invention. FIG. 2 is a view for explaining a state in which the input pin of the external microphone device is inserted into the microphone jack in the above-mentioned recording apparatus. FIG. 3 is an enlarged view of a microphone unit provided in the above-mentioned recording device. FIG. 4 is a circuit diagram showing a circuit configuration on a substrate on which the microphone unit is mounted. FIG. 5 is a circuit diagram showing the circuit configuration on the board when the input pin (51) is inserted into the microphone jack. FIG. 6 is a flow chart showing a control procedure of a microcomputer disposed on a substrate. FIG. 7 is a plan view showing an example of a modification of the microphone unit. FIG. 8 is a plan view showing a conventional microphone unit. [0017] 01-05-2019 5 An embodiment of the present invention will be specifically described below with reference to the drawings. A recording apparatus according to an embodiment of the present invention includes an apparatus body (1) incorporating a substrate (10) as shown in FIG. 1, and a microphone unit (2) is mounted on the substrate (10). . [0018] FIG. 3 is an enlarged view of the microphone unit (2). As shown in FIG. 3, the microphone unit (2) comprises a unit body (20), which is inserted as the input pin (51) (see FIG. 1) of the external microphone device is shown in FIG. The microphone jack (3) to be integrated and the built-in microphone (4) are integrated by being accommodated in the housing (21). [0019] In the microphone jack (3), an insertion hole (30) into which the input pin (51) of the external microphone device is to be inserted penetrates from the front to the back of the microphone jack (3). The built-in microphone (4) is disposed on the back side of the microphone jack (3) at a position close to the back side. Specifically, the built-in microphone (4) has its sound collecting surface (43) directed to the microphone jack (3) and the sound collecting surface (43) is inserted into the microphone jack (3) insertion hole (30). It is arranged in piles. [0020] In the built-in microphone (3), the peripheral portion of the sound collecting surface (43) and the outer peripheral surface other than the sound collecting surface (43) are covered with the antivibration rubber (6), and a part of the anti-vibration rubber (6) Is interposed between the inner surface of the housing (21) and the outer peripheral surface of the built-in microphone (3). In addition, another part of the anti-vibration rubber (6) is interposed between the back surface of the microphone jack (3) and the peripheral portion of the sound collecting surface (43) of the built-in microphone (4). Thereby, the gap between the back of the microphone jack (3) and the peripheral portion of the sound collecting surface (43) of the built-in microphone (4) is closed by the anti-vibration rubber (6). 01-05-2019 6 [0021] The microphone jack (3) includes a ground terminal (31), a pair of left and right output terminals (32, 33), and a detection terminal (34) used to detect insertion of the input pin (51). The four terminals (31) to (34) are deployed and drawn out to the outer peripheral surface of the housing (21). [0022] The built-in microphone (4) is provided with a ground terminal (41) and an output terminal (42), and the output terminal (42) is an external terminal (22) provided on the outer peripheral surface of the housing (21). It is connected to the. The ground terminal (41) of the built-in microphone (4) is connected to the ground terminal (31) of the microphone jack (3) by the connection wiring (23) provided inside the unit body (20). [0023] FIG. 4 is a circuit diagram showing a circuit configuration on the substrate (10). As shown in FIG. 4, on the substrate (10), a ground wire (111) to which the ground terminal (31) of the microphone jack (3) should be connected, and a pair of left and right output terminals of the microphone jack (3) 32) A first voice output wiring (112) to which (33) is to be connected, a detection wiring (113) to which the detection terminal (34) of the microphone jack (3) is to be connected, and an external terminal ( 22) is provided with a second audio output line (114) to be connected. Then, by mounting the microphone unit (2) on the substrate (10) as shown in FIG. 4, the ground terminal (31) is connected to the ground wiring (111), and the first audio output wiring (112) The left and right output terminals (32) and (33) are connected to each other, the detection terminal (34) is connected to the detection wiring (113), and the external terminal (22) is connected to the second audio output wiring (114). ) Will be connected. [0024] FIG. 5 is a circuit diagram showing a circuit configuration on the substrate (10) when the input pin (51) is inserted into the microphone jack (3). As shown in FIG. 5, the detection pin (34) and 01-05-2019 7 the ground terminal (31) are electrically connected to the input pin (51) when the input pin (51) is inserted into the insertion hole (30). The external microphone device (between the shorting wire (511) to be inserted and the pair of left and right output terminals (32, 33) when the input pin (51) is inserted into the insertion hole (30). 5) A connection wiring (512) to which the left and right pair of microphones (52) (53) in the inside are to be connected is provided. [0025] Further, on the substrate (10), a recording means (12) for recording an audio signal from the microphone jack (3) of the microphone unit (2) or the built-in microphone (4), the recording means (12) and the first Switching means (13) for selectively switching the electrical connection with the audio output wiring (112) or the second audio output wiring (114), and whether the input pin (51) is inserted in the microphone jack (3) And control means (14) for controlling the switching operation of the switching means (13) by determining whether or not it is present. Incidentally, the ground side of the recording means (12) is connected to the ground wiring (111). [0026] The control means (14) is connected between the microcomputer (141) connected to the detection wire (113) and the voltage application terminal (115) to which the predetermined positive voltage Vcc is to be applied. And a pull-up resistor (142) electrically connected thereto. [0027] As shown in FIG. 4, the input pin (51) is not inserted into the microphone jack (3), and the connection between the detection terminal (34) of the microphone jack (3) and the ground terminal (31) is electrically disconnected. If it is, the voltage level of the detection terminal (34) becomes the same level (high level) as the predetermined positive voltage Vcc applied to the voltage application terminal (115), and the microcomputer (141) The positive voltage Vcc is to be applied. On the other hand, as shown in FIG. 5, the input pin (51) is inserted into the microphone jack (3), and the detection terminal (34) of the microphone jack (3) and the ground terminal (31) are electrically connected. If it is, the voltage level of the detection terminal (34) is a level (low level) lower than the predetermined positive voltage Vcc applied to the voltage application terminal 01-05-2019 8 (115), and the microcomputer (141) has a predetermined level. A voltage smaller than the positive voltage Vcc will be applied. [0028] The microcomputer (141) determines which level the voltage level of the detection terminal (34) is set based on the voltage applied to the microcomputer (141), and thereby the microphone jack (3) Whether or not the input pin (51) is inserted is determined. Then, the microcomputer (141) controls the switching operation of the switching means (13) based on the judgment result. [0029] FIG. 6 is a flowchart showing the control procedure of the microcomputer (141). When the control procedure is started, first, in step S1, the microcomputer (141) causes the voltage level of the detection terminal (34) to be high level or low based on the voltage applied to the microcomputer (141). It is determined which level of the level is set. [0030] If the microcomputer (141) determines in step S1 that the voltage level of the detection terminal (34) is set to a high level, the microcomputer (141) inputs an input pin to the microphone jack (3) in step S2. By determining that (51) is not inserted, and then controlling the switching operation of the switching means (13) in step 3, the recording means (12) and the second voice output wiring (see FIG. 4) And 114) are electrically connected. As a result, the recording means (12) and the built-in microphone (4) are electrically connected via the external terminal (22). [0031] If the microcomputer (141) determines in step S1 that the voltage level of the detection terminal (34) is set to low level, the microcomputer (141) inputs an input pin to the microphone jack (3) in step S4. By determining that (51) is inserted, and then controlling the switching operation of the switching means (13) in step S5, as shown in FIG. 5, the recording means (12) and the first voice output wiring ( 112) and electrically connected. As a result, the recording means (12) and 01-05-2019 9 the microphone jack (3) are electrically connected via the pair of left and right output terminals (32) and (33), and as a result, the recording means (12) and the external microphone device (5) ) Are electrically connected via the microphone jack (3). [0032] According to the control procedure of the microcomputer (141), when the input pin (51) is inserted into the microphone jack (3), the audio signal from the external microphone device (5) is recorded by the recording means (12) When the sound is recorded and the input pin (51) is not inserted into the microphone jack (3), the sound signal from the built-in microphone (4) is recorded by the recording means (12). [0033] In the microphone unit (2), since the unit body (20) is configured by integrating the microphone jack (3) and the built-in microphone (4), the microphone unit (2) is mounted on the substrate (10). Only by mounting, the microphone jack (3) and the built-in microphone (4) will be disposed on the substrate (10). Therefore, as shown in FIG. 8, compared to the configuration in which the microphone jack (103) and the built-in microphone (104) are separately attached on the substrate (105), the assembly process is performed on the substrate (10) in the assembly process. The installation of the microphone jack (3) and the built-in microphone (4) will be simplified. [0034] In the microphone unit (2), the ground terminal (41) of the built-in microphone (4) is connected to the ground terminal (31) of the microphone jack (3) inside the unit body (20). (10) The number of terminals of the microphone unit (2) to be connected to the upper wiring is reduced by the amount of the ground terminal (41) of the built-in microphone (4). Therefore, it is not necessary to provide a wire for connecting the ground terminal (41) of the built-in microphone (4) on the substrate (10), and the area of the wire on the substrate (10) is reduced. [0035] 01-05-2019 10 Furthermore, in the microphone unit (2), a part of the vibration-proof rubber (6) is interposed between the inner surface of the housing (21) and the outer peripheral surface of the built-in microphone (3). Even when vibration is applied to (2) and the case (21) vibrates due to the vibration, the vibration is absorbed by the anti-vibration rubber (6). Therefore, the vibration imparted to the microphone unit (2) hardly propagates to the built-in microphone (4), and hence the voice signal outputted from the built-in microphone (4) hardly contains vibration noise. [0036] Furthermore, in the microphone unit (2), another part of the vibration-proof rubber (6) is the back surface of the microphone jack (3) and the peripheral portion of the sound collecting surface (43) of the built-in microphone (4). Since the sound is transmitted between the built-in microphone (4) and the sound collecting surface (43), the sound transmitted from the back side of the built-in microphone (4) is prevented from entering the sound collecting surface (43). The signal is less likely to contain audio noise from the back side. [0037] FIG. 7 is a plan view showing an example of a modification of the microphone unit (2). As shown in FIG. 7, the unit body (20) of the microphone unit (2) may be one in which the microphone jack (3) and the built-in microphone (4) are molded with an exterior resin (24). In the improved embodiment, no vibration-proof rubber (6) is provided, and the built-in microphone (4) has an outer peripheral surface other than the peripheral portion of the sound collecting surface (43) and the sound collecting surface (43). It will be covered by (24). The other various configurations and arrangement relations are the same as those of the microphone unit (2) shown in FIG. [0038] In the microphone unit (2) of the improved embodiment, the external resin (24) absorbs the vibration applied to the microphone unit (2). Further, the external resin (24) prevents the sound propagating from the back side of the built-in microphone (4) from being caught in the sound collecting surface (43). 01-05-2019 11 [0039] The configuration of each part of the present invention is not limited to the above embodiment, and various modifications can be made within the technical scope described in the claims. The unit body (20) of the microphone unit (2) is not limited to one configured by integrating the microphone jack (3) and the built-in microphone (4) by the housing (21) or the exterior resin (24), The microphone jack (3) and the built-in microphone (4) may be integrally configured by the exterior member. [0040] The built-in microphone (4) may be in close contact with the back of the microphone jack (3). In this case, no vibration damping rubber (6) or exterior resin (24) intervenes between the peripheral portion of the sound collecting surface (43) of the built-in microphone (4) and the back surface of the microphone jack (3). However, since the built-in microphone (4) is in close contact with the microphone jack (3), the sound propagating from the back side of the built-in microphone (4) is prevented from being caught around the sound collecting surface (43) become. [0041] Further, the control means (14) which determines whether or not the input pin (51) is inserted into the microphone jack (3) and controls the switching operation of the switching means (13) includes a microcomputer (141) and a pull Not only the means constituted by the up resistance (142) but various control means can be applied. [0042] (1) Device body (10) Substrate (111) Ground wiring (112) First voice output wiring (113) Wiring for detection (114) Second voice output wiring (12) Recording means (13) Switching means (14) ) Control means (2) Microphone unit (20) Unit body (21) Case (22) External terminal (23) Connection wiring (24) Exterior resin (3) Microphone jack (30) Insertion hole (31) Ground terminal (32) ) Output terminal (33) Output terminal (34) Detection terminal (4) Internal microphone (41) Ground terminal (42) Output terminal (5) External microphone device (51) Input pin (6) Anti-vibration rubber ) 01-05-2019 12
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