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JPWO2014119319

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DESCRIPTION JPWO2014119319
Abstract A speaker (10) is provided with a voice coil wiring (60), and a drive circuit (58)
supplying an acoustic signal to a vibration circuit section (59) functioning as a flat plate type
acoustic conversion element and a voice coil wiring (60). And a housing (20) for housing the
flexible substrate (50), and magnet plates (31) and (32) disposed so as to sandwich the vibrating
circuit portion (59). . The flexible substrate (50) further includes a slit (55) formed between the
vibration circuit (59) and the drive circuit (58).
Device having a flexible substrate
[0001]
The present invention relates to an apparatus having a flexible substrate.
[0002]
In Japanese Patent No. 3192372, a permanent magnet plate, a vibrating membrane disposed to
face the permanent magnet plate, a buffer member interposed between the vibrating membrane
and the permanent magnet plate, and the vibration And a support member for restricting the
relative position of the film to the permanent magnet plate, wherein the permanent magnet plate
is a parallel stripe-shaped multi-stripe in which strip-like N and S poles alternately appear on
almost the entire surface of the vibrating membrane facing surface. It has an integral structure in
which a pole magnetized pattern is formed and a large number of exhaust through holes are
arranged at the position of the neutral zone in the magnetized pattern, and the vibrating
membrane is made of a thin and flexible resin film And the linear portion of the conductor
pattern is provided at a position corresponding to the neutral zone of the permanent magnet
plate, and is not fixed at the peripheral portion by the support member. The displacement in the
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inward direction is regulated, but is supported so as to be freely displaced in the thickness
direction, and the buffer member is soft and air-permeable, and has a plurality of sheets of the
same size as the vibrating membrane. A thin electromagnetic transducer is described, which has
a stacked structure and is disposed so as to have a gap between the sheet and the permanent
magnet plate or the vibrating film.
[0003]
There is a need for a device having a simple configuration in which an acoustic conversion
functional component such as a speaker or a microphone and an electronic circuit for driving the
same are integrated.
[0004]
One embodiment of the present invention is a device including a flexible substrate including a
vibration circuit unit functioning as a flat plate type acoustic conversion element, a housing for
housing the flexible substrate, and a magnet plate disposed to face the vibration circuit unit. It is.
The flexible substrate further includes a drive circuit unit that supplies an audio signal to the
voice coil wiring, and the drive circuit unit and the voice coil wiring are connected by a
connection wiring formed on the flexible substrate.
In this device, a part of the flexible substrate is used as a flat acoustic transducer, typically a
diaphragm of a flat loudspeaker.
At the same time, a drive circuit unit that outputs an acoustic signal to another portion of a
common (same) flexible substrate, and a voice coil wiring and a drive circuit unit that cause the
common flexible substrate to function as a diaphragm, is a common flexible It connects in a
board ¦ substrate by the connection wiring formed in the board ¦ substrate. In this flexible
substrate, the drive circuit unit and the voice coil wiring can be manufactured in the same
process, and it is not necessary to connect the drive circuit unit and the voice coil wiring in
another process. Therefore, not only can the number of steps required for manufacturing the
device be reduced significantly, but also the wiring length for connecting the drive circuit and the
voice coil can be shortened. Therefore, it is possible to provide a device that can suppress noise,
is low in cost, is highly reliable, and has good acoustic performance.
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[0005]
The flexible substrate preferably includes a slit formed between the vibration circuit portion and
the drive circuit portion, and a bridge portion formed to a narrow width by the slit, and the
connection wiring is preferably disposed in the bridge portion. The vibration characteristics of
the vibration circuit portion functioning as a flat plate type acoustic conversion element can be
improved, and the acoustic characteristics can be improved.
[0006]
The vibration circuit portion and the drive circuit portion may be disposed on either the front or
back of the flexible substrate or in the middle of lamination, and may be provided on a common
flexible substrate. It is desirable that the vibration circuit unit and the drive circuit unit be
juxtaposed on a common flexible substrate, and these circuit units can be connected by a
relatively short connection circuit, and noise can be easily suppressed.
[0007]
One form of the oscillating circuit portion is a polygon such as a triangle or a square, and
preferably, a slit and a bridge portion are arranged along one side of the polygon, and the other
side of the polygon vibrates freely. It is easy to improve the vibration characteristics of the
vibration circuit unit functioning as a flat plate type acoustic conversion element. Furthermore, it
is desirable that the voice coil wiring include either a wiring pattern orthogonal to or parallel to
one side of a polygon provided with a slit. The wiring pattern is formed such that the vibrating
circuit portion of the flexible substrate vibrates in the thickness direction of the substrate, but
even if a force is generated in the direction along the surface of the substrate, the wiring pattern
orthogonal to the slit Alternatively, in the case of parallel wiring patterns, non-uniform distortion
is less likely to occur around the slits, and acoustic characteristics can be improved. In order to
suppress the generation of force in the direction along the surface, it is desirable that the wiring
pattern extend along the magnetization boundary of the multipolarly magnetized surface of the
magnet plate. Therefore, it is desirable that the magnet plate include a magnetization pattern
perpendicular or parallel to one side on which the polygonal slit is formed. The typical shape
(outline) of the vibrating circuit part is a square.
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[0008]
One of the other aspects of the present invention is a flexible circuit board including a vibration
circuit section on which a voice coil wiring is formed and which functions as a flat plate type
acoustic conversion element, and a drive circuit section for supplying an acoustic signal to the
voice coil wiring. And the voice coil wiring is connected by a connection wiring formed on the
flexible substrate. The flexible substrate may be provided with a concave or convex bridge
portion between the vibration circuit portion and the drive circuit portion, or the thickness of the
bridge portion may be adjusted by etching or the like to reduce the rigidity. The movement of the
vibration circuit can be made to be closer to free vibration, and the sound quality can be easily
improved. In addition, the influence of vibration on the drive circuit unit can be suppressed.
[0009]
The figure which shows the external appearance of a speaker. The figure which expand ¦ deploys
and shows the structure of a speaker. The figure which shows the structure of the front and back
of a flexible substrate. Sectional drawing which shows arrangement ¦ positioning of wiring.
[0010]
FIG. 1 shows the appearance of a flat (flat) type speaker as an example of a device having an
electro-acoustic conversion function according to the present invention. FIG. 2 shows a schematic
configuration of the flat speaker 10 by a developed view. The speaker 10 includes a plate-like
housing 20, plate-like magnet plates 31 and 32 disposed on the upper and lower sides (front and
rear or left and right) inside the housing 20, and shock absorbers (buffer members) 41. And a
flexible circuit board (a flexible printed circuit board, a flexible printed wiring board, a membrane
wiring board) 50 in which the vibration circuit section (vibration film section) 59 is disposed so
as to be sandwiched therebetween. The vibration circuit portion 59 of the flexible substrate 50
functions as a flat plate (flat) acoustic conversion element.
[0011]
The housing 20 is made of metal, plastic or wood, and may be made of other materials such as
ceramic, glass or the like. The housing 20 includes an upper housing 21 and a lower housing 22
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each having a plurality of openings 23. The shape of the opening 23 is not limited to a circle, and
may be a polygon, a mesh, a slit, or the like. Also, the housing 20 may constitute the speaker 10
alone, or may be part of a television, personal computer, smart phone or other appliance or
furniture. Furthermore, the housing 20 may be part of the interior of a vehicle or of the interior
of a room, and the housing 20 may be part of other moving or real estate.
[0012]
The magnet plates 31 and 32 housed in the inside of the housing 20 are permanent magnet
plates having a common configuration, and stripe-like N poles 35 n and S poles 35 s are parallel
stripes on the magnetized surfaces 33 of the front and back surfaces by magnetization. Appear
alternately in the form. Furthermore, a plurality of through holes 34 are provided along the
boundary (magnetization boundary) 36 of the strip-like N pole 35 n and the S pole 35 s (which
may hereinafter be referred to as the magnetizing region 35 regardless of the pole). .
[0013]
The magnet plates 31 and 32 may be sintered magnet plates, non-sintered magnet plates, flexible
magnet plates, or magnet plates of solid structure, or may be any of magnet plates of other
known structures. The material to which magnetism is added may be a ferrite magnet, a rare
earth magnet, a neodymium-iron-boron magnet, or the like. The thickness and shape of the
magnet plate 31 (square, rectangle, circle, oval, etc.) and structure (whether it is a single
permanent magnet plate or a structure in which a plurality of permanent magnet plates are
laminated) are arbitrary. In terms of design, it can be selected as appropriate according to the
characteristics, cost, manufacturing needs, usage conditions, and the like. Further, the size (size
of magnetization) of the magnetic pole (magnetic field), the pole pitch, and the like are also
arbitrary, and can be selected based on factors such as the size of the housing 20 and the
required volume.
[0014]
Hereinafter, the speaker 10 having a structure in which the vibration circuit portion 59 of the
flexible substrate 50 is sandwiched between the two magnet plates 31 and 32 will be described
as an example, but one magnet plate is used and one side of the flexible substrate 50 (one side
Only) may be opposed to the magnet plate. Further, the flexible circuit 50 may be provided with
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the vibration circuit section 59 on both sides, or the vibration circuit section 59 may be provided
on only one side. Further, instead of sandwiching the flexible substrate 50 by the magnet plates
31 and 32, the flexible substrate 50 may be disposed on both sides of one magnet plate, or a
plurality of magnet plates and a vibrating film may be laminated. .
[0015]
The buffer members 41 and 42 disposed between the magnet plates 31 and 32 and the vibration
circuit portion 59 of the flexible substrate 50 are soft and have sufficient air permeability to
allow sound waves to freely pass through. Is a sheet-like member having substantially the same
size as the vibration circuit portion 59 functioning as an acoustic conversion area (sound
conversion element). One example of the buffer members 41 and 42 is a plurality of thin sheet
non-woven fabrics stacked one on another. When the buffer members 41 and 42 are configured
by stacking a plurality of sheet-like members, it is desirable to arrange them so as to be
separately vibrated (displaced) without adhering them. The buffer members 41 and 42 prevent
the vibration circuit unit 59 from colliding with the magnet plates 31 and 32 to emit abnormal
noise (noise that is not normal vibration sound) during operation, and prevent generation of
divided vibration of the vibration circuit unit 59 itself. It includes the action of controlling the
generation of sound waves other than the sound waves that are faithful to the sound source, such
as preventing the generation of chattering sounds.
[0016]
The flexible substrate 50 is a flexible substrate made of a thin resin film, and for example, a
polyimide film (aromatic polyimide film), a polyethylene terephthalate film, or the like is adopted.
The flexible substrate 50 preferably has a thickness of about 10 to 50 μm. The flexible substrate
50 may be a laminate of a plurality of films. The flexible substrate of the present example is
entirely rectangular (rectangular), and 50 to 90% of the entire area is a square vibrating circuit
portion (vibrating film portion) 59. The vibration circuit unit 59 may be 50% or less of the whole.
In the vibration circuit portion 59, a plurality of wiring patterns to be voice coil wiring (wiring for
voice coil) 60 are formed on both surfaces 51 and 52.
[0017]
A portion 58 of the flexible substrate 50 excluding the vibration circuit portion 59 is a mounting
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area (drive circuit portion), and a circuit for supplying an acoustic signal to the vibration circuit
portion 59 and a processing unit 85 are mounted (mounted). The boundary 57 between the drive
circuit unit 58 and the vibration circuit unit 59 is a connection unit, and the voice coil wiring
(wiring pattern) 60 provided in the vibration circuit unit 59 is connected by the connection
wiring 69. The drive circuit portion 58 and the vibration circuit portion 59 do not connect
(solder) the lines from both separately at the connection portion 57, and are connection wiring
69 which is a print pattern provided on the surface of the common flexible substrate 50. Are
integrally connected. The connection portion 57 of the flexible substrate 50 has a low rigidity
structure. That is, most of the connection portion 57 of the flexible substrate 50 is a linearly
extending slit-like opening (slit) 55, and the portion left by the slit 55 becomes the bridge portion
54, and the processing unit in the bridge portion 54 A wire 69 connecting the 85 and the voice
coil wire 60 is disposed. The bridge portion 54 may be flat or may be a convex (concave) flexible
connection in cross section.
[0018]
That is, the flexible substrate 50 is a rectangular circuit, and the drive circuit for driving the drive
circuit circuit 59 is disposed on the other side of the vibration circuit section 59 which is an
acoustic element on one side in the long side direction (longitudinal direction). The portion 58 is
disposed, and the boundary between the vibration circuit portion 59 and the drive circuit portion
58 which are juxtaposed is the connection portion 57, and the connection portion 57 is formed
with the slit 55 extending in the short side direction. Therefore, the vibration circuit portion 59 is
entirely rectangular (rectangular or square), and one side of the square is connected to the drive
circuit portion 58 through the connection portion 57 in which the slit 55 is formed, and the
other three sides of the square are Although they are in contact with the buffer members 41 and
42, they are basically housed in the housing 20 in a freely vibrating state.
[0019]
The vibrating circuit portion 59 having a square (square) contour is high in space efficiency
when stored in the housing 20, or the square housing 20 can be easily installed at various places.
Therefore, the flexible substrate 50 having the square vibration circuit unit 59 can easily ensure
the performance as an acoustic element, and in the case of the speaker 10 of this example, the
acoustic output. The vibrating circuit unit 59 may be another polygon, for example, a triangle or
a pentagon, etc. The vibrating circuit unit 59 is disposed to include any end of the flexible
substrate 50, and the vibrating circuit unit 59 is Can be provided as the connection portion 57, it
is possible to provide the flexible substrate 50 including the vibration circuit portion 59 which is
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easily vibrated and has high acoustic performance. In addition, by arranging the slits 55 along
one side which is the connection portion 57 of the polygonal vibration circuit unit 59, it is
possible to provide the flexible substrate 50 provided with the vibration circuit unit 59 having
higher acoustic performance.
[0020]
FIGS. 3A and 3B show both surfaces (upper and lower surfaces, front and rear surfaces, front and
rear surfaces) 51 and 52 of the flexible substrate 50. Further, for reference, the arrangement of
the magnetized regions 35 n and 35 s of the magnetized surfaces 33 of the opposing magnet
plates 31 and 32 is shown.
[0021]
A wiring pattern (voice coil wiring) 60 including three wirings 61 a, 61 b and 61 c is formed on
the surface 51 of the vibration circuit portion 59 of the flexible substrate 50. On the back surface
52 of the vibrating circuit portion 59, a wiring pattern 60 including the three wiring lines 61d,
61e and 61f and having the same or symmetrical arrangement as the wiring pattern on the front
surface 51 is formed. In addition, on the surface 51 of the drive circuit unit 58 of the flexible
substrate 50, the processing units 85 connected to the respective wirings 61a to 61c and 61d to
61f via the connection wirings (relay wirings) 69 are mounted. A communication circuit
component 81 and a battery 82 are mounted on the back surface 52 of 58.
[0022]
The circuit elements mounted in the drive circuit unit 58 are not limited to these, and depending
on the application etc., a capacitor, a resistor, a chip for other application, and a wire connecting
them may be mounted. An example of the processing unit 85 is a digital speaker driving unit
including a driving circuit function, and the processing unit 85 supplies digital acoustic signals to
the respective wirings 61 a to 61 f of the vibrating circuit unit 59. The wirings provided on the
common flexible substrate 50 on which the drive circuit unit 58 and the vibration circuit unit 59
are mounted can be simultaneously formed by photoetching a flexible copper-clad print film,
including the wirings 61a to 61f for voice coil. .
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[0023]
A typical example of the processing unit 85 is a digital speaker driving device described in
Japanese Unexamined Patent Publication No. 2010-28785 or the like. This drive device is
composed of a ΔΣ modulator, a post filter, s drive circuits, a ΔΣ modulator, a power supply
circuit supplying power to the post filter and s drive elements, and the s The drive circuit of
corresponds to s digital signal terminals. This driving device is suitable for a digital speaker
device which outputs a plurality of digital signals by a ΔΣ modulator and a mismatch shaping
filter circuit and directly converts analog sound by a plurality of speakers driven by a plurality of
digital signals.
[0024]
Since the configuration of the wiring pattern 60 provided on the front surface 51 and the back
surface 52 of the vibration circuit portion 59 is common, the wiring pattern 60 on the front
surface 51 will be described hereinafter. A wiring pattern 60 including a plurality of independent
wirings 61a to 61c to which different electric signals are applied is a first arrangement pattern
extending along the magnetization boundary 36 of the magnetization surface 33 of the multipole
magnetized magnet plate 31. And 65, a second array pattern 66 disposed on the edge side of the
vibration circuit portion 59 and extending in a direction orthogonal to the magnetization
boundary. In the first arrangement pattern 65, the plurality of wires 61a to 61c are arranged at
symmetrical positions with the magnetization boundary 36 at the center. That is, since this first
array pattern 65 includes three interconnections 61a to 61c, interconnection 61b is disposed
along the magnetization boundary 36, and interconnections 61a and 61c are disposed in parallel
at equal intervals to interconnection 61b. ing.
[0025]
The adjacent first array pattern 65 is connected by the second array pattern 66, and the order of
the wirings 61a to 61c is reversed by the second array pattern 66. Therefore, in the adjacent first
arrangement pattern 65, the arrangement order of the interconnections 61a to 61c is reversed.
[0026]
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FIG. 4 is a cross-sectional view schematically showing a state in which the vibration circuit
portion (vibration portion) 59 of the flexible substrate 50 is sandwiched by the upper and lower
magnet plates 31 and 32 in the speaker 10. The buffer member is omitted. On the surfaces
(magnetization surfaces) 33 of the magnet plates 31 and 32, magnetization regions 35 (35n and
35s) magnetized in a stripe shape appear. The perpendicular magnetic field component (absolute
value) of the magnetized region 35 is the largest near the centers of the respective magnetized
regions 35n and 35s, and the boundary (magnetized boundary) between the magnetized regions
35n (N pole) and 35s (S pole) The smallest around 36). This is because the components of the
magnetizing magnetic field are viewed in the vertical direction and defined, and since there is no
magnetic field of the vertical component near the boundary 36, this region may be called a
neutral zone. On the other hand, the horizontal component (component parallel to the surface of
the permanent magnet plate) of the magnetic field 37 formed by these magnetized regions 35 is
the smallest near the centers of the respective magnetized regions 35n and 35s, and near the
magnetized boundary 36. The largest in This is because the magnetic force lines 37 pass in an
arc shape from the adjacent magnetization area 35 n (N pole) to the magnetization area 35 s (S
pole).
[0027]
When a current is passed through the wires 61a to 61c, according to Fleming's left-hand rule, a
force acts to move the vibration circuit unit 59 according to the direction of the magnetic field
37. The horizontal component of the magnetic field 37 is a component that contributes to
vibrating the vibrating circuit portion 59 in the thickness direction, and applying a signal
(current) to the wirings 61a to 61c vibrates the vibrating circuit portion 59 in the thickness
direction to generate acoustics. Can be converted to Therefore, the wires 61 a to 61 c are
arranged along the largest magnetization boundary 36 of the horizontal component by the first
arrangement pattern 65. On the other hand, the first arrangement pattern 65 includes a plurality
of interconnections 61a to 61c. Therefore, the plurality of interconnections 61 a to 61 c are
arranged with a certain width in the direction perpendicular to the magnetization boundary 36.
Therefore, when current flows through the wires 61a and 61c on both sides, not only the
horizontal component but also the vertical component of the magnetic field 37 acts to move the
vibration circuit 59 in the thickness direction (vertical direction in this figure) A force may act to
move 59 in a direction parallel to the flexible substrate 50 (a direction along a surface, in the
horizontal direction in this figure).
[0028]
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However, in the first arrangement pattern 65 of this example, the wires 61 a and 61 c on both
sides are arranged at symmetrical positions with respect to the magnetization boundary 36.
Therefore, when signals of the same phase are supplied to the wires 61a and 61c on both sides,
the force in the opposite direction is parallel to the flexible substrate 50 (horizontal direction) in
the wires 61a and 61c on both sides by the vertical component of the magnetic field 37. Occurs.
Therefore, the force for moving the flexible substrate 50 generated in the horizontal direction by
the wirings 61a and 61c is canceled, and the flexible substrate 50 can be vibrated up and down
in a stable state to generate a sound.
[0029]
In the flexible substrate 50, different electrical signals can be independently supplied to the
wirings 61a to 61c. Therefore, the same electrical signal is not necessarily supplied
simultaneously to the wires 61a and 61c on both sides. However, when the wires 61a to 61c are
used as a sound source, the signal strengths supplied to the wires 61a to 61c are often
substantially equal when time-averaged. Furthermore, by providing the processing unit 85 with a
function of selecting the wires 61a to 61c randomly or cyclically in units of clocks and
connecting them, the signal strengths supplied to the wires 61a to 61c can be further averaged.
A circuit or a chip may be disposed between the processing unit 85 and the connection wiring
69. The circuit or chip may have a function to select and connect the wirings 61a to 61c
randomly or cyclically in units of clocks.
[0030]
Furthermore, in the adjacent first arrangement pattern 65, the order of the wires 61a to 61c is
reversed. Further, in the adjacent first array pattern 65, the direction of the current flowing
through each of the wirings 61a to 61c is reversed. Therefore, in the same wiring, for example,
the wiring 61c, the direction of the vertical component of the magnetic field 37 is the same, and
the direction of the current is reversed. For this reason, the force for moving the vibrating circuit
portion 59 generated by the respective wires 61 a and 61 c in the horizontal direction is
canceled between the adjacent first array patterns 65. Therefore, even if electrical signals with
different phases or electrical signals with different polarities are supplied to the wires 61a to
61c, the vibrating circuit portion 59 is vibrated up and down in a stable state, and the electrical
signals are acoustically It can be converted to a signal and output. Further, the flexible substrate
50 including the vibration circuit portion 59 can be prevented from moving in the horizontal
direction.
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[0031]
Furthermore, the first arrangement pattern 65 is disposed in parallel to the long side of the
square vibration circuit portion 59, and can be arranged such that the lengths of the wirings 61a
to 61c become equal. Therefore, horizontal forces generated by the wires 61a and 61c can be
canceled because they are equal in magnitude but different in direction. In addition, the first
array pattern 65 extends in a direction orthogonal to the connection portion 57 which is one side
of the rectangular vibration circuit portion 59. Also in this point, the boundary of the magnetized
region which is the neutral zone The lengths of the wirings 61a and 61c arranged on both sides
of the) can be equal. At the same time, it is possible to cancel the horizontal force generated
particularly in the region near the connection portion 57, so that the horizontal force applied to
the connection portion 57 can be suppressed. Therefore, the force in the direction along the
surface around the slit 55 and in the bridge portion 54 can be suppressed. Therefore, the
vibration circuit unit 59 can be vibrated in the natural vibration mode in the vertical direction
with respect to the fixed drive circuit unit 58 by the force generated by the wiring pattern 60
which is the voice coil wiring. Thus, the flexible substrate 50 and the speaker 10 with excellent
acoustic characteristics can be provided.
[0032]
When the first array pattern 65 is disposed parallel to the short side direction of the rectangular
vibration circuit portion 59, the surface direction by the wires 61a and 61c arranged on both
sides of the magnetization boundary 36 as described above. It is easy to cancel the force
(horizontal force). In addition, since the lengths of the wires 61a and the wires 61c in the vicinity
of the connection portion 57 can be equalized, the horizontal force applied to the connection
portion 57 can be suppressed. Therefore, in the magnet plates 31 and 32 as well, it is desirable
that the magnetization boundary 36 be disposed parallel to the long side or the short side of the
rectangular vibration circuit portion 59. Further, it is desirable that the magnetization boundary
36 be disposed in a direction orthogonal to or parallel to the connection portion 57 which is one
side of the rectangular vibration circuit portion 59. In the other polygonal vibration circuit
portion 59, in order to suppress the horizontal force applied to the connection portion 57, the
wiring pattern 60 is in a direction orthogonal to or parallel to one side of the polygon which is
the connection portion 57. It is desirable to extend in the direction. Similarly, it is desirable that
the magnetized boundary 36 also extend in a direction perpendicular or parallel to one side of
the polygon which is the connection portion 57.
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[0033]
The acoustic signal output by the vibration circuit unit 59 of the flexible substrate 50 is output to
the outside through the through holes (penetration parts) 34 provided in the magnet plates 31
and 32. In addition, the movement of the vibration circuit portion 59 and the buffer members 41
and 42 in the horizontal direction (direction parallel to the surface) can be regulated by
providing the housing 20 with a configuration as an appropriate stopper. For example, the
movement of the flexible substrate 50 including the vibration circuit portion 59 can be restricted
by the side wall of the housing 20 or the movement of the flexible substrate 50 can be restricted
by making the shape of the corner of the housing 20 oblique. Furthermore, the horizontal
movement of the flexible substrate 50 can be restricted by a member such as a pin.
[0034]
Further, the vibrating circuit portion 59 of the flexible substrate 50 is housed in the housing 20
in a state where three edges (peripheral ends) can freely vibrate, and one edge is connected to
the drive circuit portion 58 via the connection portion 57. It is integrated. The connection
portion 57 has a slit-like opening 55 except for the bridge portion 54 where the connection
wiring 69 is disposed, and the bridge portion 54 is processed into a convex or concave flexible,
lower rigidity shape. May be By making the rigidity of the connection portion 57 very low, the
peripheral end (edge) of the vibration circuit portion 59 can be almost freely vibrated including
the connection portion 57, and the vibration circuit portion 59 is vibrated in the free end state. It
can be done. Therefore, the vibration corresponding to the electric signal supplied to the wirings
61a to 61f can be excited in the vibration circuit unit 59, and high quality sound can be output.
[0035]
In the flexible substrate 50, the drive circuit unit 58 and the vibration circuit unit 59 are
integrated via the connection unit 57. Therefore, the processing unit 85 mounted on the drive
circuit unit 58 and the wiring pattern (voice coil wiring) 60 of the vibration circuit unit 59 can be
connected by the print pattern (connection wiring) 69 formed on the flexible substrate 50.
Therefore, the acoustic signal output from the drive circuit of the processing unit 85 can be
supplied to the wiring pattern 60 for the voice coil in a short pattern, and the influence of
ambient noise can be suppressed. The wirings mounted on the flexible substrate 50, including
the drive circuit unit 58, the vibration circuit unit 59, and the connection circuit 69, are
manufactured collectively. For this reason, the manufacturing cost of the flexible circuit 50
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including the drive circuit unit 58, the vibration circuit unit 59, and the speaker 10 on which the
flexible substrate 50 is mounted can be reduced.
[0036]
Since the connection wiring 69 can be formed by the wiring printed on the flexible substrate 50,
even when different acoustic signals are supplied to the plurality of wirings 61a to 61f included
in the wiring pattern 60, the many connection wirings 69 are compared Can be concentrated on
the narrow bridge portion 54. Therefore, even if the amount of the acoustic signal increases, the
increase in the area of the bridge portion 54 can be suppressed, and the connection portion 57
can be maintained with low rigidity, so that the vibration circuit portion 59 can be vibrated in a
free state.
[0037]
For example, when the processing unit 85 has a drive circuit function with a processing capacity
of about 100 MHz or a digital signal processing function, a 24-bit digital audio signal is
converted to a reproduction signal of 6 circuits × 4 bits (16 divisions in the time direction). It is
possible to convert and supply the respective wirings 61a to 61f directly. The vibration circuit
unit 59 of the flexible substrate 50 vibrates up and down by digital signals (reproduction signals)
supplied independently to the wirings 61a to 61f, and a sound in which the vibration by the
reproduction signals is combined is output.
[0038]
As described above, in the above-described speaker 10, a part of the flexible substrate 50 is used
as the vibration circuit unit 59 to output sound. Therefore, in the above description, an apparatus
mainly exhibiting the function as a speaker has been described as an example, but in an
information processing apparatus such as an information terminal or a portable terminal, an
electric appliance such as a home appliance, an industrial machine, a vehicle, etc. It is not
necessary to mount the speaker unit on the flexible substrate 50 or to secure a space for housing
the speaker unit in the housing in addition to the flexible substrate 50 when it is necessary to
simply store the flexible substrate 50 in the housing It is possible to provide a device having a
function as a speaker with any configuration.
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[0039]
The vibration circuit unit 59 is made of a material and thickness suitable for acoustic output, and
the drive circuit unit 58 may be a multilayer structure or the like suitable for mounting of circuit
components and circuit formation.
[0040]
In the above, the speaker 10 having the flexible substrate 50 including the vibrating circuit
portion 59 in which three wires (three circuits) are formed on each of the front and back is
described as an example, but the wires provided in the vibrating circuit portion 59 The number
of is not limited to this, and may be two wires, four wires or more, and wires may be provided on
only one of the surfaces.
For example, in the case where the wiring pattern 60 is a double wiring, the two wirings are
arranged at symmetrical positions with the magnetization boundary 36 as the center. Further, in
the above description, the wiring pattern 60 is folded in the longitudinal direction (longitudinal
direction) of the rectangular vibration circuit portion 59, but may be folded in the width direction
(lateral direction). Further, the wiring pattern 60 for the voice coil is not limited to the above, and
may be a wiring pattern that functions as a voice coil for vibrating the vibration circuit unit 59.
[0041]
Furthermore, the shape of the vibration circuit unit 59 is not limited to a rectangle, and may be a
square or any other shape. In addition, the vibration circuit portion 59 may be provided at one
end of the flexible substrate 50, may be provided at a plurality of ends, and may be provided at
the center of the flexible substrate 50, for example. .
[0042]
Further, the number of the wiring patterns 60 bent (turned) in a serpentine or zigzag manner is
not limited to three. If the area of the vibration circuit portion 59 can not be sufficiently secured,
the wiring pattern 60 may be straight. The wiring pattern 60 preferably includes an even number
of first array patterns 65. In this case, it is desirable that the turn portion (second wiring pattern
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66) of the wiring pattern 60 be an odd number.
[0043]
Although the positions of the through holes (vents) 34 provided in the magnet plates 31 and 32
are arbitrary, it is desirable that the through holes (vents) be disposed along the magnetization
boundary 36 where the displacement of the vibration circuit portion 59 becomes large. Further,
the through holes 34 may be arranged in a zigzag or lattice, and may be circular, oval or
polygonal.
[0044]
Further, although the speaker in which the vibration circuit unit 59 outputs sound is described
above as an example, the device including the flexible substrate 50 has a function as a
microphone in which the vibration circuit unit 59 converts sound into an electric signal. It may
be an apparatus. In a device having a function as a microphone, it is possible to set a sound
collection characteristic flexibly and provide a microphone for outputting a digital signal.
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