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JPS60236599

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DESCRIPTION JPS60236599
[0001]
Industrial Applicability According to the invention (for a d1 transducer, it comprises two
connecting elements in the form of connecting strips and still connecting lines, of which the first
connecting element is bonded to the bonding sub-electrode of the piezoelectric ceramic,
Electrical (piezoelectric) acoustic transducers for electroacoustic capsules, in which the second
connection element is soldered to the other electrodes, and soldering of the connection strips to
the conductor band of the amplifier printed circuit board Assembly apparatus for mounting on
the support plate of the container. BACKGROUND OF THE INVENTION Electroacoustic
transducers are incorporated in telephones, in particular in transmitter capsules (microphones),
receiver capsules and the like. With the exception of the handset capsule type, the transducer
usually has two connection bands. That is, the first connection band is pressed and bonded to the
bonding side electrode of the piezoelectric ceramic, and the second connection band is soldered
to the other electrode (West German Patent Application Publication No. 42820403 or JP-A-5457. Reference 560)). FIG. 6 shows a transmitter as an example of such a conventional
electroacoustic transducer. In FIG. 3, 1 is a case, and a buffer ring 2 is disposed below the surface
of the case. A separating plate 3 is placed under the buffer ring 2 1, the transducer is composed
of a transducer plate 4 made of a conductive material and a disc-shaped piezoelectric ceramic,
and the piezoelectric ceramic has an entire surface on both sides. An electrode is provided across
the The piezoceramic provided with electrodes is adhesively fixed to the transducer plate 4. The
transducer plate 4 is held by two silicon rings 5a, 5b. The first connection band, which is bound
by suppression, is not shown in this FIG. The soldered g2 connection band 6 passes between the
converter board 4 and the recon ring 5a, and between the plastic support 7 and the metal case 1
to the component mounting surface of the amplifier printed board 9 The guide 10 is a plastic
ring, guided by a grip Wb and a rivet RIFLrFI, and is a plastic ring to prevent shorting of both
connecting bands with the metal case of the piezoelectric microphone. An insulator 11 is
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provided in the lower region of the case. In the conventional transmitter shown in FIG. 3, both
connecting bands of the converter plate 4 are soldered manually to the grip-type solder rivets 8
on the component mounting surface of the printed board 9 under the supply of solder. Will be
attached. For this purpose, the separating plate 3, the silicon rings 5a, 5b, the converter plate 4,
the support 7 and the printed circuit board 9 for the amplifier have to be preassembled.
By attaching the plastic ring 10, an electrical short circuit between the metal case 1 and the
connection band 6 is prevented. However, such an assembly method and soldering are laborious,
prone to problems, and not suitable for automation. SUMMARY OF THE INVENTION The present
invention is described at the outset and in FIG. 3 so as to enable fully automatic soldering of the
two connecting bands of the acoustoelectric converter board to the printed circuit board of the
microphone. The aim is to improve the electroacoustic transducer as shown. Furthermore, the
connection band needs to be insulated so as not to short-circuit to the metal case by a label
instead of a plastic ring. In order to achieve this object, the present invention is characterized in
that the end of the connection band not connected to the converter plate is soldered to the
conductor band of the printed circuit board for the amplifier. Do. [Effect] According to the
present invention as described above, it is possible to omit the expensive grip type solder rivet
which has been conventionally required and the Noricon adhesive which is required for fixing the
connecting band. Furthermore, since soldering and soldering used in flow soldering (flow
soldering) have sufficient working flux, soldering is no longer necessary to supply solder and flux
during operation as well. According to one embodiment of the invention, the connection points of
the connection band have tolerances for soldering. According to the invention, for the soldering
suitable for the automation of the connection strip, an assembly process is proposed which is
possible only by the component carrier or only by a suitable component carrier. The device for
carrying out the assembly process comprises a structural carrier unit, a component carrier for
the converter board and the printed circuit board for the amplifier, on which the conductor for
bonding the connecting strip for the converter is provided. It is characterized in that it can freely
approach the belt. In this case, the separating plate is fixed to the necessary component carrier
so that the conductor strip surface can be freely approached. The Noricone ring and the
converter plate are likewise preassembled on the component carrier. In this case, the two
connection strips intersect the conductor strip to which this connection strip is soldered. The two
temperatures i # IJ controlled soldering are soldered in the process by the device, and the joint
band soldering is soldered in the process. Furthermore, the support is attached from the upper
side by itself by pressing the printed circuit board for an amplifier. The assembly consisting of
the amplifier printing plate and the support is then pivoted and pushed into the separating plate.
In another process step, according to the invention, the connection strips are not automatically
shorted to the metal case of the piezoelectric microphone by the provided labels. Embodiments of
the present invention will be described in detail with reference to the drawings. In FIG. 6, a cross-
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sectional view of a prior art transistor microphone is shown in which the connection strips 6 are
bonded to the printing plate 9 by means of grip-type solder rivets 8 as already described in
detail. A schematic view of the conductor band of the printed circuit board 9 for an amplifier is
shown in FIG. On the left part of FIG. 2 there is shown a conductor band 12 which can be
soldered to a connecting band within certain tolerances, and in FIG. 1 a soldered connection to
the conductor band of the printed circuit board for amplifiers A cross-sectional view of a
transistor microphone capsule as one embodiment of the electroacoustic transducer of the
present invention is provided with a band and an insulating label. The transistor microphone
shown in FIG. 1 is different from the transistor microphone shown in FIG. 6 in that the grip type
solder rivet 8 is removed and the connecting band 6 is bonded to the conductor band 12. There
is. Furthermore, an adhesive label 10 a is provided to insulate the connection band 6 from the
metal case 1. FIG. 4 shows a structural carrier unit and a component carrier for receiving the
converter plate, and a printed circuit board for an amplifier, and a schematic view of the
assembly performed beforehand. That is, the component carrier 16 carries the structural holding
element unit, the separating plate 6, the silicon rings 5 a, 5 b and the converter plate 4 provided
with the connecting band 6. The right-hand part of the component carrier 13 is provided for
receiving the amplifier printed circuit board 9. In addition to FIG. 4, FIG. 5 additionally shows a
lid 14 for lifting the amplifier printed circuit board 9 into position. Furthermore, the head 15 is
shown for reflow complete soldering. In FIG. 6, with reference to FIG. 4, the support is shown at
the removed position of the head 15 and the support supply and mounting device 16 for
mounting the support 7 on the printed board 9 is shown. FIG. 7 schematically shows the
structural holding element unit and the auxiliary device 27 mounted in the conversion footboard
by rotating the printed circuit board for amplifier in the direction of the arrow. The assembly is
performed as follows. At one station of the transport line, the component carrier 13 is mounted
with the structural holding element unit and the amplifier printing plate 9 (FIG. 4).
This mounting process takes place automatically. In another transfer station, namely the
soldering station (FIG. 5), the printed circuit board for the amplifier is lifted by the auxiliary
device to the soldering position to reach the connection zone position, and the reflow set
soldering is the head 15. The soldering is dropped to the spot, and the soldering of the
connection strip to the conductor strip is performed automatically for a time and temperature.
Thereafter, the amplifier printed circuit board is again lowered into the component carrier. In the
next station (FIG. 86), the supply and mounting device 16 of the support 7 is provided in the
auxiliary device and is automatically pressed by the holding plunger onto the amplifier printing
plate. After being transported further to the new transport station (FIG. 7), the support 7 with the
complete amplifier printed circuit board 9 is then pivoted by the auxiliary device and mounted in
the structural holding element unit and conversion footing Be done. Finally, at another station
not shown, automatic bonding of the label 10a takes place for the insulation of the connection
zone. As described above, according to the present invention, the end of the connection band 6
not connected to the converter plate 4 is directly soldered to the conductor band 12 of the
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printed circuit board 9 for amplifier. For example, it becomes possible to solder the two
connection bands 6 of the acoustoelectric converter board 4 completely automatically on the
printed board 9 for the microphone amplifier. Moreover, according to the present invention as
described above, the expensive grip type solder rivet 8 conventionally required can be omitted.
[0002]
Brief description of the drawings
[0003]
FIG. 1 is a schematic view of a transistor microphone capsule according to an embodiment of the
present invention, FIG. 2 is a schematic view of a surface on the conductor band side of an
amplifier printed board, FIG. 6 is a cross sectional view of a conventional piezoelectric transistor
microphone, FIGS. 7 to 7 are diagrams for explaining the mounting of the printed circuit board
for an amplifier according to the present invention to the converter board, and FIG. 4 shows the
structural protection element unit, the converter board and the printed circuit board for the
amplifier. 5 is a schematic cross-sectional view of the received component carrier, FIG. 5 is a
diagram further including an amplifier lifter and reflow set soldering added to FIG. 4, and FIG.
FIG. 7 is a schematic view of a partially assembled transistor microphone.
DESCRIPTION OF SYMBOLS 1 ... Metal case, 2 ... Buffer ring, 3 ... Separating plate, 4 ... Converter
plate, 5a, 5b ... Silicon ring, 6 ... Connection zone, 7 ... Support Body 8 grip type solder rivet 9
printed circuit board for amplifier 10a adhesive label 12 conductor band 13 component carrier
14 lifter 15・ Reflow complete set head is head, 16 ・ ・ Support supply ・ Mounting device.
−FIG1FIG2FIG3
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