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JPS59119999

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DESCRIPTION JPS59119999
[0001]
FIELD OF THE INVENTION The present invention is in the field of medical devices for
diagnostics, and relates to a transducer C2 in an ultrasound probe. [Technical background of the
invention and its problems] Conventionally, a piezoelectric ceramic is used as a piezoelectric
vibrator as a transducer in the ultrasonic probe C 2 and a piezoelectric ceramic such as a ring
according to the application used thereon. Dice or array C was cut and divided. By the way, in
order to apply a voltage to the cut and divided ceramic, it is necessary to ground each of the
divided elements individually, but in the case of an array, since the elements are strip-shaped, all
of them It can be easily taken out as a common ground from both ends of the element. However,
in the case of ring-shaped or die-shaped C2, since concentric or lattice-like cutting is performed,
it is not possible to take direct ground from elements located in the central portion other than
the cut periphery. In the prior art, for example, in the case of a ring (2 as shown in FIG. 1 ≦ 2 C
Nipunking crucible 1 (− upper surface C of the fixed ceramic 2 C 2 divided elements 2a, 2b, 2c,
2d It has been proposed to solder a thin copper foil 6 and take out the ground from its periphery.
However, when the earth is taken out according to the above-mentioned configuration C2, the
copper foil on the upper surface of the piezoelectric ceramic acts to cause unnecessary vibration,
and the acoustic characteristics of the ultrasonic wave emitted from the piezoelectric ceramic (
Become. Furthermore, in the case of forming a matching layer by bonding a coating material
molded on the upper surface of the piezoelectric ceramic to improve the sound quality (2 and
FIG. 2 (as shown in FIG. 2) It becomes unreliable-C2, adhesion failure etc. occur. In addition,
when a coating material of the upper surface C nievoxy resin of piezoelectric ceramic is applied
to form a matching layer, a constant thickness of the coating layer can be obtained from R & a Ht
2, but the copper foil 1 is exposed by this polishing It becomes unfavorable from the viewpoint of
safety as it becomes unfavorable. SUMMARY OF THE INVENTION The present invention has
been made in view of the above-mentioned circumstances ≦ 1. For example, even in the case of a
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1
ring or a die, it is possible to easily take out the ground from the element located at the central
portion C other than the periphery It is an object of the present invention to provide an
ultrasonic transducer which does not damage the acoustic characteristics of ultrasonic waves
emitted from a piezoelectric ceramic. SUMMARY OF THE INVENTION In order to achieve the
above object, an outline of the present invention is characterized in that a matching layer is
formed via a conductive adhesive on the ultrasonic emitting surface of a piezoelectric ceramic
comprising divided elements. It is said that.
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 6 is a schematic perspective view showing the main part of the ultrasonic transducer. In FIG.
3 (f), reference numeral 22 denotes a piezoelectric ceramic composed of elements 22a, 22b, 22c
and 22d concentrically cut by laser processing, and the ceramic 22 adheres to the upper surface
of the bank 21 二 two. Below the backing 21, respective lead wires 23 which are inserted
through the inside of the backing 21 from the respective elements 22a, 22b, 22c, 22d are
exposed. FIG. 4 is a schematic explanatory view of a coating material 24A which is formed of an
epoxy resin C which is formed on the ultrasonic emission surface C of the piezoelectric ceramic
22 to be the matching layer 24. As shown in FIG. This coating material 24A is formed to have the
same thickness as the outer diameter of the piezoelectric ceramic 22 with a certain thickness
effective for improving the acoustic characteristics, for example, the wavelength λ of the
medium, and a notch in the periphery thereof. A unit 25 is provided. A conductive adhesive 26 is
applied on the entire surface of the coating material 24A made of epoxy resin. FIG. 5 is a
schematic perspective view of the ultrasonic transducer according to the present invention,
showing the state in which the matching layer 24 is formed by bonding the coating material 24A
via the ultrasonic emission ff1j of the piezoelectric ceramic 22 and the two conductive adhesive
26. It is shown. In FIG. 5, reference numeral 27 denotes an earth lead wire whose one end is
soldered at the notch 25C. In the ultrasonic transducer according to the present invention, a gold
bird layer made of the conductive adhesive 26 is provided on the ultrasonic emitting surface of
the piezoelectric ceramic 22. Therefore, the elements 22 & 22b are simply soldered to the
ground lead wire 27. 22c, 22d can be made conductive, and the ceramic electrodes of each
element can be grounded, and can be grounded. It is needless to say that the present invention is
not limited to the above-mentioned embodiments, and includes various modifications within the
scope of the present invention. For example, the ultrasonic emitting surface of the piezoelectric
ceramic (the second conductive adhesive 26 is applied, and then the upper surface C1 may be
further coated with an epoxy resin and polished to form the matching layer 24 having a
predetermined thickness. Further, the present invention is not limited to the ring-shaped
transducers shown in Example 1, but may be applied to die-shaped transducers and array-shaped
transducers (two). As described above, according to the present invention, it is possible to easily
take out the ground from, for example, a ring-like or die-like divided element, and it is possible to
use ultrasonic waves emitted from pressure ceramic. It is possible to provide an ultrasonic
transducer which does not impair the acoustic characteristics.
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In addition, since the conductive adhesive has a high acoustic impedance as compared to a
general adhesive, the accuracy of the thickness of the adhesive layer is not so strict, which is
extremely convenient in manufacturing.
[0002]
Brief description of the drawings
[0003]
1 is a schematic perspective view showing a conventional transducer, the second cause is a 1u11
plane view of FIG. 1, FIG. 3 is a schematic perspective view showing an essential part of a ringshaped transducer, and FIG. FIG. 5 is a schematic view of a coating material, and FIG. 5 is a
schematic perspective view of an ultrasonic transducer according to the present invention.
21: Banking, 22: Piezoelectric ceramic, 22a, 22b, 22c, 22d,-each element of piezoelectric ceramic,
2'5: lead wire, 24: matching layer, 24A: coating thickness , 25: Cutaway part, 26: Conductive
adhesive, 27: Earth lead wire agent Patent attorney's rule Ken Ken Kin (1 other person) Fig. 2
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