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JPS58118739

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DESCRIPTION JPS58118739
[0001]
{Circle over (1)} Background of the Invention A, Technical Field The present invention relates to
an ultrasonic probe and a method of manufacturing the same. (5) B, Prior Art and Problems
Thereof An ultrasonic medical electronic device such as an ultrasonic diagnostic apparatus
capable of observing a tomogram of a living body in real time has no mechanically movable parts
and is electronically super Many electronic scanning ultrasonic probes capable of scanning a
sound beam are used. In such an ultrasonic probe, a vibrator provided with a flat plate electrode
formed by vapor deposition, screen printing or coating fixation of silver on both main surfaces of
a flat plate-like flat plate piezoelectric material made of, for example, a ceramic piezoelectric
material is used. It is arranged in a large number of lines, and each plate electrode is connected
to each external connection terminal by a lead to form a one-dimensional array structure. In such
an ultrasonic probe, an ultrasonic beam is scanned by selectively sequentially driving a large
number of ultrasonic transducers arranged in a one-dimensional manner, and each transducer is
sequentially selected also upon reception. The electronic scan is performed by making it active.
Conventionally, an ultrasonic probe consisting of such a one-dimensional array of a large number
of ultrasonic transducers is electrically connected between each of the electrodes (6) on both
main surfaces of the flat plate piezoelectric material, ie, the front and back surfaces, and the
connecting leads. Each connection was made in a separate step. For example, first, a lead is
connected to the electrode on the back surface of each vibrator obtained by dividing the flat plate
piezoelectric material into a large number in the first step to form individual electrodes for each
vibrator, and 11 next surface of each vibrator in the second step There is an example in which a
common electrode such as a metal foil such as copper is commonly connected to the electrode of
(see, for example, JP-A-56-54833). As described above, according to the conventional
manufacturing method, two steps are necessarily required to connect both the electrodes of the
vibrator and the access portion to the external circuit, and many of them are temporarily
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temporarily performed only during the manufacturing process. I needed an auxiliary plate to
hold it. The manufacturing of the ultrasonic probe not only includes the connection between the
electrodes and the lead portion, but also includes many steps such as bonding of the backing
material or the acoustic matching layer with the piezoelectric material, and division and cutting
into a plurality of transducers. It is required to reduce the number of processes as much as
possible to reduce the price and eliminate the accumulation of variation in processing accuracy
in each process to obtain a highly reliable confectionery. {Circle over (2)} Objects of the Invention
Accordingly, the present invention aims to provide a method capable of manufacturing a highly
reliable ultrasonic probe with as few processes as possible, and to provide such an ultrasonic
probe. . According to the invention this object is achieved by the following method of
manufacturing an ultrasound probe. That is, according to this method, the first flat plate
conductive material is deposited on the one main surface of the rectangular flat plate
piezoelectric material so as to substantially cover the main flat plate piezoelectric material, and
the first flat plate conductive material is attached to the other main surface. A second
independent flat plate conductive material is attached, and a part of the first flat plate conductive
material extends to the other main surface, and a part of the other main surface is covered in the
longitudinal direction. Forming a first conductive pattern extending along one long side of the
opening on the surface of a flexible flat insulating material having a rectangular opening having a
width smaller than the width of the flat piezoelectric material; Forming a second conductive
pattern extending along the other long side and independent of the first conductive four turns,
the second conductive / J turn having a plurality of conductor portions extending in the direction
away from the opening; The flat plate piezoelectric material is placed on the surface of the flat
plate conductive material so that its long side is substantially parallel to the long side of the
opening, A part of one of the first and second flat plate conductive materials covering a part of
the other main surface of the piezoelectric material to the first conductive pattern of the flat plate
insulating material, and a part of the other flat plate piezoelectric material On the main surface of
the backing material having an acoustic impedance different from that of the flat plate
piezoelectric material and having a shape close to the rectangular outer shape of the flat plate
piezoelectric material. Attach the flat plate insulation material with its back side down so that the
side is substantially parallel to the long side of the backing material, and fold the flat plate
insulation material along the long side of the rectangular shape of the backing material toward
its side The flat plate piezoelectric material, the flat plate insulating material and the backing
material are bent, and the notch extends in the width direction of the rectangular shape of the
flat plate piezoelectric material and is located between the plurality of conductor portions and
reaches at least the main surface of the backing material Use this one flat conductive material An
electrode, an ultrasonic probe, such as the following may be provided according to other flat
conductive material into a plurality of ultrasonic transducers is formed (9) the present invention
to the individual electrode.
That is, in this ultrasonic probe, a first flat plate conductive material is adhered to one main
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surface of a rectangular flat plate piezoelectric material so as to substantially cover it, and a first
flat plate conductive material is formed on the other main surface Form a second flat conductive
material independent of the second flat conductive material, and a part of the first flat conductive
material extends to the other main surface and covers a part of the other main surface in the
longitudinal direction, Forming a first conductive pattern extending along one long side of the
opening on the surface of a flexible flat insulating material having a rectangular opening having a
width smaller than the width of the flat piezoelectric material; A second conductive pattern
extending along the other long side and forming a second conductive pattern independent of the
first conductive pattern, the second conductive pattern having a plurality of conductor portions
extending in the direction away from the opening The flat plate piezoelectric material is placed
on the surface so that its long side is substantially parallel to the long side of the opening, and
flat plate pressure is applied. Part of the first and second flat plate conductive materials covering
a part of the other main surface of the material to the first conductive pattern of the flat plate
insulating material, and the other flat plate r1 n) plate piezoelectric material A flat plate
piezoelectric material on a main surface of a backing material which has a portion different from
the flat plate piezoelectric material and has a shape similar to the rectangular outer shape of the
flat plate piezoelectric material with a portion connected to the second conductive and mother
turns respectively. Attach the flat plate insulation material with its back side down so that the
long side of the backing material is substantially parallel to the long side of the backing material,
and the flat plate insulation material along the long side of the rectangular backing material
toward the side A bend is made by cutting a notch into the flat plate piezoelectric material, the
flat plate insulating material and the backing material, and the notch extends in the width
direction of the rectangular shape of the flat plate piezoelectric material and is positioned
between a plurality of conductor portions. To reach one end of the plate conductive material A
common electrode, is intended to include a plurality of ultrasonic transducers that the other flat
conductive material and the individual electrode. According to one aspect of the present
invention, the ultrasonic probe uses the first flat conductive material as a common electrode and
the second flat conductive material as individual electrodes. According to another aspect of the
present invention, the incision in the ultrasonic probe is between each of the plurality of
conductor portions according to the other aspect of the present invention, the opening of the flat
insulating material in the ultrasonic probe has a periphery Forms a completely closed rectangle.
According to another aspect of the present invention, the plurality of conductor portions are
formed independently on the surface of the flat insulating material in the second conductive turn
in the ultrasonic probe. {Circle over (2)} Detailed Description of the Invention Next, an ultrasonic
probe and a method of manufacturing the same according to the present invention will be
described in detail with reference to the attached drawings. As in the embodiment shown in FIGS.
81 (4) and (2), for example, a flat plate piezoelectric material 10 of a generally rectangular shape
made of a ceramic piezoelectric material is left with a side surface 12 corresponding to one long
side of this rectangle. The main surface of the flat plate is coated with a very thin flat conductive
material formed by vapor deposition, screen printing or coating fixation of a conductive material
such as silver in a U-shape, and a part of one of the main surfaces is coated A slit 14 is inserted in
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parallel with the long side of the rectangle to remove a part of the flat conductive material, and
this is divided into a first flat conductive material 16 and a second flat conductive material 18.
Both are completely independent of each other. In order to further understand the actual
dimensions of this embodiment, the long side ioom of the flat plate piezoelectric material, the
short side 13 * m + the width 1 mu of the flat plate conductive material 16 on the slit side main
surface + the width 1 ス リ ッ ト of the slit 14 The thickness is 0.4 mm for 3.5 MHz. Next, as
shown in FIG. 1 (0, at least a flat substrate 22 made of a flexible insulating material such as
polyimide having an opening 20 having a dimension in the width direction slightly smaller than
the rectangle of the flat plate piezoelectric material 10. , As shown) J? A first conductive pattern
24 and a second conductive pattern 26 having a turn shape are formed. Both patterns are
formed by depositing a foil of a conductive material such as copper on the main surface of the
substrate 22. The first conductive pattern 24 includes an electrode portion 28 along one long
side of the opening 20 and a lead portion 30 connected to an external circuit, and the second
conductive A ′ turn 26 has an opening 20. An electrode portion 32 along the other long side
(13) and a large number of conductor portions 34 connected to an external circuit. The second
conductive pattern 26 is a part of the common electrode of the first plurality of ultrasonic
transducers 60 (FIG. 1 (2) or CF ′)), and the second conductive pattern 26 is a part of the
individual electrodes of the plurality of ultrasonic transducers. It will be a part. Therefore, in this
example, the conductor portions 34 of the second conductive pattern 26 are provided
corresponding to the number of transducers included in the completed ultrasonic probe. Further,
a cover film such as polyimide is applied to cover the lead portion excluding the electrode
portion. Next, as shown in FIG. 1, the same figure (the opening 20 of the flexible substrate 22 of
Q is slightly larger, and at least the same size as the rectangle of the piezoelectric material 10
shown in FIG. A backing material 40 having the shape of a bar is prepared. After the backing
material is completed as an ultrasonic probe, the ultrasonic wave to the front load is reflected by
reflecting the ultrasonic wave (14) emitted in the direction opposite to the ultrasonic output
direction of the probe, that is, the back side. As a reflector to increase the output and improve the
sensitivity as a probe, or as an absorber that absorbs ultrasonic waves emitted to the back
surface to make ultrasonic pulses sharp, the response of the probe is good Play a role in If an
example suitable for a reflector for improving sensitivity is shown, the acoustic impedance of the
piezoelectric material 10, for example, an epoxy resin having an acoustic impedance significantly
different from 30 X I Of / − / crls, for example, about 3 × 1055 ′ ′ Is preferred. By the way,
according to the method of manufacturing an ultrasonic probe according to the present
invention, the piezoelectric material 10 provided with the first and second flat conductive
members 16 and 18 is directed as shown in FIG. And the rectangular portion of the piezoelectric
material 10 is placed on the flexible substrate 22 shown in FIG.
In this state, the electrodes 28 and 32 of the first and second conductive patterns 24 and 26,
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respectively, and a part of the first and second flat conductive members 16 and 18 in contact
with them, respectively, are soldered by a button or the like. Join. In this case, it is processically
advantageous to heat the back surface of the substrate 22). As a result, the first and second flat
conductive members 16 and 18 are electrically connected to the terminal portions 30 and 34 of
the first and second conductive i4 turns 24 and 26, respectively. Next, the state in which the
piezoelectric material 10 is mounted on the flexible substrate 22 in this manner as shown in FIG.
1C and on the backing material 40 shown in FIG. The flexible substrate 22 is placed with the
pattern side up, with the openings 20 aligned with the substrate 22. Bonding between the
backing material 40 and the piezoelectric material 10 in the portion of the substrate 22 and the
first and second conductive materials 16 and 18 exposed from the opening 2 ° and the slit 14 is
bonded, for example, with an epoxy resin or the like Do with the agent. When the backing
material 40 is an epoxy resin, it is preferable to use an adhesive containing the same material as
the backing material 40 so that the adhesive is also an epoxy resin. By this, an interface is not
formed between the adhesive and the backing material 40, and reflection of ultrasonic waves at
an undesirable interface can be prevented. Next, as shown in FIG. 1G, the flexible substrate 22 is
bent along the side surfaces of the backing material 40, and the two are similarly bonded with an
adhesive. ? The cuts 50 are made in the width direction of the piezoelectric material 1 o by a thin
grinding wheel such as a scribing dicer, for example, to divide the piezoelectric material 10
equally in the longitudinal direction. As shown in FIGS. 1 (g) and 1 (c), the incisions 5o are
formed from the first conductive material 16 of the piezoelectric material 10 to the piezoelectric
material 10 and a part of the second conductive material 18 and the first conductive material 16.
To reach each electrode portion 28 and 32 of the first and second conductive patterns 24 and 26
on the flexible substrate 22, and the tip 52 thereof has a second conductive turn as shown in FIG.
It is slightly cut into the backing material 40 at a position (the position of the tip of the arrow A
in FIG. 3) which completely divides the 26 electrode portions 32. In addition, the distance
between two adjacent cuts 50, ie, the (17) pitch, is equal to the arrangement pitch of the plurality
of lead portions 34 of the second conductive pattern 26, and one cut approximately at the center
of the two adjacent conductor portions 34. 5G is positioned to electrically cut the lead portions
34 in contact with each other.
The tip 52 of the incision 50 must not reach the end 36 of the first conductive pattern 24 (which
is also the end of the flexible substrate 22 in this example), as shown in FIG. The first conductive
pattern 24 is not divided by the cuts 50 but becomes continuous. As a result, an ultrasonic probe
62 including a large number of ultrasonic transducers 60 is completed. This electrical connection
is shown in FIG. In the figure, the elements shown in FIG. 1 are conceptually indicated by the
same reference numerals. As described above, the first flat plate conductive member 16 is
connected to the terminal portion 30 as a common electrode common to the individual vibrators
60, and the second flat plate conductive # 18 is unique to each of the vibrators 60. It is
connected to the conductor part 34 as an electrode. FIG. 4 shows an example of another shape of
the flexible substrate 22 C1). In the example (4) of the figure, an example is shown in which the
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second conductive patterns are not continuous but are independent as the individual conductor
portions 34 from the beginning. Thus, the connection of the piezoelectric material 10 to the
second conductive material is a part of the individual conductor parts 34 32. It is done for A. FIG.
1B (B) shows a flexible substrate 22 having an opening 20A which is not completely closed
around the opening 20 shown in FIG. 1 (0, but is partially open. Any substrate 22 shown in FIG. 4
can be favorably applied to the manufacturing method according to the present invention. FIG. 5
shows an example in which the pitch of the notches 50 is 173 of the pitch of the terminal
portions 34, and the individual electrodes 18 of the three vibrators 60 are commonly connected
to one terminal portion 34. The electrical connection is shown in FIG. Thus, the correspondence
between the terminal portion 34 and the vibrator 60 may not necessarily be one to one, but may
be one to a plurality. FIG. 7 shows an example in which one end 36 of the substrate 22 is not
bent along the side surface of the backing material 40, but is joined while being stretched to the
main surface, ie, the surface on which the piezoelectric material is mounted. In this case, in order
to cause the first conductive material 16 to function as a common electrode, the first conductive
pattern 24 must not be separated for each individual vibrator 60, so in the cutting step for
separating into individual vibrators 60 The cutting stroke needs to be controlled so as not to
reach the end 36 of the first conductive pattern 24 as shown by the arrow B in FIG. In the
embodiment of FIG. 1, the control of the cutting stroke is not necessary as described above with
reference to FIG. 3, and only control of the cutting depth (arrow A) is sufficient. In any of the
embodiments described above, after completion as the ultrasonic probe # '-a2, the first
conductive material 16 is the common electrode of each transducer 60.
However, the manufacturing method according to the present invention is not necessarily limited
to this form. In order to use the first conductive material 16 as an individual electrode and the
second conductive material 18 as a common electrode, the piezoelectric material 10 shown in
FIG. 1 (G) is 180 in a plane including the flat plate shape of the piezoelectric material. In the
same figure (the flexible substrate 22 may be placed and joined in the same direction as Q). The
ultrasonic probe using the first conductive material 16 as the common electrode has an
advantage that the resistance to noise due to the induced current is excellent by grounding the
common electrode to the ground. {Circle over (0)} Specific Effects of the Invention According to
the ultrasonic probe and ultrasonic probe manufacturing method of the present invention, the
connection of the two electrodes of the ultrasonic transducer to the circuit pattern on the flexible
substrate is , Can be performed simultaneously in a single step. Further, the electrode connection
process and the process of dividing into each ultrasonic transducer can be performed almost
simultaneously. Therefore, both electrodes can be accurately connected to the circuit prior to
division into individual ultrasonic transducers. In addition, in the dividing step, each transducer
can be formed uniformly with high precision mechanical dimensions for each ultrasonic
transducer. Since the circuit connection to each electrode is made by a printed circuit formed on
the flexible substrate, one mechanical dimension of high accuracy can be obtained for the circuit
connection also for a large number of transducers. Moreover, the use of a mark (21) imprinting
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circuit board in the access to such external circuits also results in good compatibility in
mechanical interface with the external circuits. Therefore, it is possible to provide a highly
reliable ultrasonic probe in which a large number of ultrasonic transducers of high accuracy are
accumulated at high density, as well as the manufacturing process is shortened and the cost is
reduced. The ultrasound probe provided in this manner has vibrations of each other because the
mechanical-electrical characteristics of the individual transducers are uniform and are
mechanically independent of each other. In the case of electronic scanning, there is little
interference from the time and-dimensional arrays are precisely arranged with a uniform pitch,
so that, in the case of electronic scanning, the electrical circuit design theory due to
nonuniformity of the transducers or arrangement or interference between the transducers. This
has the effect of preventing inconveniences such as errors in the combined beam direction and
the actual beam direction.
[0002]
Brief description of the drawings
[0003]
1 (4) to 1 (C) are perspective views for explaining the manufacturing process of the ultrasonic
probe according to the present invention, and FIG. 2 is an example of the circuit connection of
the ultrasonic probe (22). 3 is an end view of the ultrasonic probe shown in FIG. 1 (G), and FIGS.
4 (4) and 4 (B) are plan views showing other examples of the flexible substrate shown in FIG. 5 is
a partial side view showing another embodiment of the ultrasonic probe, FIG. 6 is a circuit
diagram showing the circuit connection of the embodiment shown in FIG. 5, and FIG. 7 is an
ultrasonic probe It is an end elevation showing other examples.
10: flat plate piezoelectric material 16: first flat plate conductive material 18: second flat plate
conductive material 20: opening 22: flexible substrate 24: first circuit pattern 26 Second circuit
pattern 40: backing material 50: incision 60: ultrasonic transducer 62: ultrasonic probe. Figure 1
o 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 5 is off at 6F r = H
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