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Specification 1 Name of the invention Bonding method between voice coil bobbin for speaker and
cone 1 Vinyl polymerization such that the Young's modulus of the cured product is 23000 kg /
am or more at 27 ° C and 9500 kg / ckg or more at 80 ° C A method of bonding a voice coil
bobbin for a speaker and a cone, comprising bonding the voice coil bobbin and the cone with a
mold adhesive.
2, the scope of claims
5. Detailed Description of the Invention The present invention relates to an adhesive for bonding
a voice coil bobbin of a speaker and a cone. Conventionally, rubber-based, hot-melt-based, and
polyamide-curable epoxy-based adhesives have been used for bonding a voice coil bobbin and a
cone of a speaker. In addition, the temperature of the speakers often rises to around 80 ° C
when operating. When using a rubber-based adhesive, the curing time is slow, so the bonding
time is long, the cost for manufacturing the speaker is high, and the operating temperature is
from room temperature to a high temperature (around 80 ° C) Through, ', · Young's modulus (B)
is extremely low, the value of (here, 1 密度 density # # 1) is small, the sound quality without
distortion. There is a disadvantage that the characteristics of the speaker are bad because the
good area is narrowed. When using a hot melt adhesive, the curing speed is high but the melting
temperature is high, so it is difficult to select a coating machine, the heat creep resistance is poor,
and, more importantly, the room temperature as well as the rubber system is room temperature.
From the high temperature side · · Through the Young's modulus is extremely low, the
characteristics of the speaker. It had a defect such as poor sex. When a polyamide curing type
epoxy adhesive is used, the Young's modulus near room temperature is extremely high, and the
Young's modulus is higher than the above two adhesives even at a temperature around 80 ° C.
at the time of operation. Although it is slightly superior to the above two types of adhesives in
terms of sex, it has a disadvantage that the bonding time is long because the curing speed is slow
as in the case of the rubber system, and the cost for manufacturing the speaker is high.
Therefore, the temperature characteristic of Young's modulus is better than that of the abovementioned polyamide curable epoxy adhesive. And the appearance of an adhesive that cures
rapidly is desired. The object of the present invention is to eliminate the disadvantages of the
prior art. It is a quick curing type that the gelation time at room temperature (25 ° C) when
thickly applied o, smm ˜ thick on the adherend surface And, the temperature characteristic of
Young's modulus in the cured product of the adhesive is extremely good, and a speaker voice coil
bobbin and a cone adhesive bonding agent are obtained having a Young's modulus of 9500 kg /
am 'or more even at 80 ° C. In order to achieve the above object, the inventors have intensively
studied an adhesive and as a result, have found that a two-component vinyl polymerizable
adhesive containing ferrocene is good. That is, the present invention is characterized in that the
adhesive is a two-component vinyl polymerizable adhesive containing 7-erocene. The speaker
obtained by this becomes good in sound quality, and since adhesion is completed in a short time,
manufacturing cost also becomes cheap.
Next, materials used in the present invention will be described. The vinyl polymerizable resin
composition is composed of a vinyl polymerizable monomer (such as methyl acrylate) and / or a
vinyl polymerizable polymer (such as unsaturated polyester □ leupolybutadiene etc). Curing
agents are organic that do not undergo polymerization reaction at room temperature. Peroxide
(eg cumene hydroperoxide etc.) is used. Hereinafter, the present invention will be described in
detail by way of examples. EXAMPLE 1 In FIG. 1, 1 is a voice coil bobbin and 2 is a cone.
(Diaphragm) 5 indicates an adhesive, 4 indicates a voice coil, 5 indicates an edge, 6 indicates a
spider, 7 indicates a frame, 8 indicates a yoke plate, 9 indicates a magnet, and 10 indicates a
plate with a center pole. Here, the adhesive used in 3 of FIG. 1 will be described. In addition, as a
standard of the curing speed, the contact drying time at 25 ° C. when the adhesive was applied
to a thickness of s mm by using a flat plate made of brass as the adhesion surface button was
used as the gelation time. (A-1) Liquid part by weight Bisco-) "540 *--------50 polyethylene glycol
(" 200) diacrelay) "-40 ethylene glycol dimethacrylate------- -10 ferrocene---------0-5 hydroquinone------0, 0 SCB-1) part by weight Biscoat "540 *-------- -50 polyethylene glycol ("200" diacreature) *40 ethylene glycol dimethacrylate--------10-t-butyl hydroperoxide------2-para, benzoquinone-- ------01:01 Osaka Organic Chemical Industry Co., Ltd. The adhesion method using the composition
which consists of 2 liquid of the above ('A-1 liquid and (B-1) liquid) is described. Both solutions
(A-i) and (B-1) are each stable at 25 ° C., and the gelation time at 25 ° C. when mixing the same
amount is only 3 minutes, the temperature of Young's modulus The characteristics are as shown
in the curve 11 of FIG. 2, and the Young's modulus is as high as 24000 kg / aJ, not only at room
temperature but also on the high temperature side, for example at 80 ° C. The sound quality of
the speakers was good. Example 2 (A-2) Liquid part by weight Tetraethylene glycol
dimethacrylate----302-hydroxyethyl methacrylate-)---30 propylene glycol 1.10 mol, anhydrous
lido Unsaturated polyester of acid value 20 obtained by reacting 2 mol and 0.8 mol of maleic
anhydride in nitrogen at 160 ° C. for 10 hours for 10 minutes.---40 ferrocene---a, S
hydroquinone- ---0, 02 CB-2) Liquid part by weight Tetraethylene glycol dimethacrylate-----20
EndPage: 2 pentaerythritol tetraacrylate-H,----52-hydroxyethyl methacrylate---- 75 cumene
hydroperoxide----1 barabenzoquinone----Q, 04 two liquids of liquid (A-2) and liquid (B-2) It
described bonding method using a deposition material.
The two solutions are stable at 25 ° C., respectively, the same amount is mixed, and the gelation
time at 25 ° C. at nine o'clock is only 4 minutes, and the temperature characteristics of Young's
modulus are as shown by curve 12 in FIG. Not only room temperature but also high temperature
side, even at 80 ° C., Young's modulus was as high as 9500 kg / cm 2 and the sound quality of
the speaker was good as in Example 1 above. Comparative Example Among the rubber-based,
hot-melt-based and polyamide ° -hardened epoxy-based adhesives, the temperature
characteristics of the Young's modulus It is the best, so-called polyamide-curable epoxy-based
adhesives classified as so-called good sound quality. As an example, a bonding method using
Cemedine 1500 (manufactured by Cemedine KK) having a weight ratio of 1: 1 of the main agent
to the curing agent is described. In this case, the gelation time at 25 ° C. is much longer than
that of the above example, and it takes 300 minutes. The temperature characteristics of the
Young's modulus are as shown by the curve 16 in FIG. 2, and there is no difference in
temperature near room temperature compared to the above example, but the C. on
the high temperature side becomes 320 kvaal Decrease in Young's modulus temperature. It was
found that the power characteristics were significantly worse than those of the above two
examples, and that a good region of sound quality with little distortion could not be taken widely,
and that the sound quality of the speaker was clearly worse than the examples. From the above,
the gelation time at 25 ° C. of the vinyl polymer adhesive containing ferrocene is extremely
short, ** / 75 or less as compared with Cedemaine 1500, and the temperature characteristic of
Young's modulus is also very good. It is clear that even when the temperature of the bonded part
rises to 80 ° C. at the time of car operation, the Young's modulus is 15 200 9.6 times or more of
Cemedine. Therefore, it is possible to take a wide range of good sound quality with less
distortion, and it became clear that the production rationalization of the speaker and the
remarkable improvement of the car were achieved. Moreover, these adhesives can be widely
applied to electronic parts as the adhesive Nj for vibration part.
4. Brief description of the drawings Fig. 1 is a cross-sectional view of a speaker, and Fig. 2 is a
relationship between Young's modulus E (kg / cm 2) obtained by measuring the cured adhesive
by vibration lead method and measurement temperature. It is shown. 1----Voice coil bobbin 2---Cone 3---One adhesive j1, 12 One experimental example of the adhesive according to the present
invention 13----One conventional example 1) Toshiyuki) X / Figure EndPage: 3
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