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Patent application (23) Showa 49 I: November 1b Patent office director's office 2 inventor 3
Patent applicant address Osaka Prefecture Kadoma city Oda Kadama address 1006 Name (582)
Representative of Matsushita Electric Industrial Co., Ltd. Representative Masaharu Matsushita 4
〒 571 Address Osaka Prefecture Monbabu Ogata Monshin 1006 5 attachment '+ W list, 8 (1)
specification 1-7 (2) drawing 1 pain-(3) proxy letter 1 (4) application form duplicate copy 1
[Phase] Japan Patent Office ■ Japanese Patent Application Laid-Open No. 51-589450 Published
Japanese Patent Application No. 51. (1976) 5, 2 0 serial number in the office / g g /-specification
1, the name of the invention
Speaker diaphragm
3. Detailed Description of the Invention The present invention provides a lightweight speaker
diaphragm having a high specific elastic modulus and an appropriate internal loss.
Conventionally, papermaking moldings such as pulp, polymer foams, polymer films, 釡 tS foils,
etc. have been used as diaphragms for speakers, but each has merits and demerits and is
sufficiently satisfactory as a diaphragm material It was not. That is, since there is a mechanical
internal loss due to the friction between fibers, the fiber diaphragm is not likely to cause sharp
resonance, but it has the disadvantage that the specific elastic modulus is I "8 and it is easy to
receive humidity 1'1. . In addition, although built metal foils have relatively high specific elastic
modulus, steep internal resonance is likely to appear because of small internal loss, and defects
such as generation of distortion due to non-linear motion at large amplitude The present
invention eliminates the above-mentioned disadvantages of the prior art. Silicon is very light (ρ2, 33 f / 3) I, or-has a high modulus. Also, it is possible to obtain an even higher elastic modulus
if it is busy to apply a proper alloying treatment to the surface. The present invention is to
provide a speaker diaphragm which is capable of obtaining excellent acoustic characteristics
which can not be obtained with the conventional materials and at the same time. Hereinafter, the
present invention will be described in detail by way of examples and drawings. Example (1) Ruri,
a silicon diaphragm of 60 μm in thickness etched with a mixed solution of HF = 5: 1. (FIG. 1)
Example (2) As shown in FIG. 2, a 20 μm thick metal plate is formed on the surface of a 20 μm
thick 7 recon plate 1 prepared by the same method as in Example (1). 9 EndPage: 1 silicon-boron
alloy diaphragm forming 4 layers 2. Example (3) A silicon-carbide alloy diaphragm in which a
carbon layer 3 of 20 μm in thickness is formed on the surface of silicon @ 1 of 20 μm in
thickness as shown in FIG. Although the details of the present invention have been described
above by way of examples, these examples do not impose any limitation on the contents of the
present invention. Next, the results obtained by the present invention are also shown in the
following table O. As apparent from the above table, the 1-invention speaker diaphragm uses
silicon or silicon alloy, so the specific elasticity is high and the inside is appropriate. A lightweight
diaphragm with loss can be obtained
4. Brief Description of the Drawings FIGS. 1 to 8 are cross-sectional views of a speaker
diaphragm in the embodiment of the present invention. 1 ······ Silicon plate = 2
········································································································································· Carmen layer. Name of agent
Attorney Nakao Toshio and others 1 person Ill figure / 6 Inventors and agents other than the
above (1) inventor (2) agent EndPage: 2
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