JPH02122290

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DESCRIPTION JPH02122290
[0001]
FIELD OF THE INVENTION This invention relates to a composite ultrasonic sonar. BACKGROUND
OF THE INVENTION Since ultrasonic sonar surface montages require fixation of the sonar, they
lead to damping of the vibrations and acoustic lambda coupling to the fixation resulting in a
reduction of acoustic amplitude. In addition, difficulties arise in electrical contact. Conventionally
known ultrasonic sonars are constructed at the nodes of oscillation of the resonator with aligned
supports as individual components. SUMMARY OF THE INVENTION The object of the present
invention is to avoid the considerable reduction of the ultrasonic vibrations which occur in
simple and inexpensive constructions and to enable a reliable electrical contact of the
piezoceramic disc used. It is to provide an ultrasonic sonar. [Means for Solving the Problems]
This problem is solved by adopting the configuration described as the feature of claim 1 in the
above-mentioned composite ultrasonic sonar. The present invention will be described in more
detail with reference to the drawings. 1a, b and c are ultrasonic sonars according to the
invention. 6) shows the cross section of the cross section and the distribution of the force of this
cross section and the deflection of the ultrasonic sonar acting as a thickness direction resonator,
FIG. 3a, 3b show cross sections of various embodiments of the present invention. A matching
layer made of a material having a low product of density ρ and elastic modulus E, for example,
polysilicon compared to ceramic and placed on piezoelectric ceramic 7 is an acoustic exchanger
with a thickness direction resonator of wavelength (2 n + 1) λ / 4. Complete as. Here, n is an
integer when n ≧ 1. This causes a single point of oscillation to occur on the surface of the
substrate fixed with the control and measuring electronics (FIG. 1). The matching layer is so thick
that the ultrasound portion emitted in the direction of the montage plane is almost completely
reflected at the montage surface. Must be matched to the ceramic. The following effects are
achieved by this configuration. (1) The composite ultrasonic sonar can be supported at one
vibration node without significantly reducing the conversion efficiency due to the acoustic λ
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coupling to the support. (2) The sound amplitude is not reduced compared to the free suspension
type λ / 2 sonar. (3) The manufacturing process is consistent with the current thick film
manufacturing technology. (4) The surface mounting of the composite ultrasonic sonar can be
fabricated as a composite element. (5) It is equally suitable for both high-frequency gas acoustic
transducers and liquid acoustic transducers above IM Hz. (6) The efficiency of the transducer is
almost doubled due to the total reflection of the sound at the interface.
The matching layer on the ceramic solves the problem of electrical contact of the piezoelectric
ceramic (FIG. 2). Through contacts through the matching layer and the overlying metallization
allow for easy electrical contact during surface montage. The matching layer can be made, for
example, by screen printing using synthetic materials that can be screen printed, or by synthetic
resin casting or film processing techniques. For example, polyethylene, epoxy resin, polyimide or
kapton is used as a synthetic material. The montage surface is advantageously the surface of a
substrate made by thick film or thin film technology. When the substrate is a semiconductor
substrate, components can be attached to the substrate by S, MD technology. The vibrating object
may have a substantially circular or rectangular perimeter.
[0002]
Brief description of the drawings
[0003]
1a, b, c are ultrasonic sonars according to the invention.
Fig. 6 shows the cross section of 6) and the distribution of forces on this cross section and the
deflection of the ultrasonic sonar operating with a thickness direction resonator, Fig. 2 shows the
cross section of the ultrasonic sonar where the placement of the electrical contacts is revealed
3a, 3b show cross sections of various embodiments of the present invention. A: Matching layer
DA, Thickness of matching layer K: Vibration object DK: Thickness of vibration object
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