Patent Translate Powered by EPO and Google Notice This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate, complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or financial decisions, should not be based on machine-translation output. DESCRIPTION JPH02122290 [0001] FIELD OF THE INVENTION This invention relates to a composite ultrasonic sonar. BACKGROUND OF THE INVENTION Since ultrasonic sonar surface montages require fixation of the sonar, they lead to damping of the vibrations and acoustic lambda coupling to the fixation resulting in a reduction of acoustic amplitude. In addition, difficulties arise in electrical contact. Conventionally known ultrasonic sonars are constructed at the nodes of oscillation of the resonator with aligned supports as individual components. SUMMARY OF THE INVENTION The object of the present invention is to avoid the considerable reduction of the ultrasonic vibrations which occur in simple and inexpensive constructions and to enable a reliable electrical contact of the piezoceramic disc used. It is to provide an ultrasonic sonar. [Means for Solving the Problems] This problem is solved by adopting the configuration described as the feature of claim 1 in the above-mentioned composite ultrasonic sonar. The present invention will be described in more detail with reference to the drawings. 1a, b and c are ultrasonic sonars according to the invention. 6) shows the cross section of the cross section and the distribution of the force of this cross section and the deflection of the ultrasonic sonar acting as a thickness direction resonator, FIG. 3a, 3b show cross sections of various embodiments of the present invention. A matching layer made of a material having a low product of density ρ and elastic modulus E, for example, polysilicon compared to ceramic and placed on piezoelectric ceramic 7 is an acoustic exchanger with a thickness direction resonator of wavelength (2 n + 1) λ / 4. Complete as. Here, n is an integer when n ≧ 1. This causes a single point of oscillation to occur on the surface of the substrate fixed with the control and measuring electronics (FIG. 1). The matching layer is so thick that the ultrasound portion emitted in the direction of the montage plane is almost completely reflected at the montage surface. Must be matched to the ceramic. The following effects are achieved by this configuration. (1) The composite ultrasonic sonar can be supported at one vibration node without significantly reducing the conversion efficiency due to the acoustic λ 04-05-2019 1 coupling to the support. (2) The sound amplitude is not reduced compared to the free suspension type λ / 2 sonar. (3) The manufacturing process is consistent with the current thick film manufacturing technology. (4) The surface mounting of the composite ultrasonic sonar can be fabricated as a composite element. (5) It is equally suitable for both high-frequency gas acoustic transducers and liquid acoustic transducers above IM Hz. (6) The efficiency of the transducer is almost doubled due to the total reflection of the sound at the interface. The matching layer on the ceramic solves the problem of electrical contact of the piezoelectric ceramic (FIG. 2). Through contacts through the matching layer and the overlying metallization allow for easy electrical contact during surface montage. The matching layer can be made, for example, by screen printing using synthetic materials that can be screen printed, or by synthetic resin casting or film processing techniques. For example, polyethylene, epoxy resin, polyimide or kapton is used as a synthetic material. The montage surface is advantageously the surface of a substrate made by thick film or thin film technology. When the substrate is a semiconductor substrate, components can be attached to the substrate by S, MD technology. The vibrating object may have a substantially circular or rectangular perimeter. [0002] Brief description of the drawings [0003] 1a, b, c are ultrasonic sonars according to the invention. Fig. 6 shows the cross section of 6) and the distribution of forces on this cross section and the deflection of the ultrasonic sonar operating with a thickness direction resonator, Fig. 2 shows the cross section of the ultrasonic sonar where the placement of the electrical contacts is revealed 3a, 3b show cross sections of various embodiments of the present invention. A: Matching layer DA, Thickness of matching layer K: Vibration object DK: Thickness of vibration object 04-05-2019 2
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