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JPH01138897

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DESCRIPTION JPH01138897
[0001]
TECHNICAL FIELD The present invention relates to a method of manufacturing a piezoelectric
vibrator formed by joining a piezoelectric ceramic and a metal diaphragm. (Prior Art) When using
a piezoelectric ceramic as a piezoelectric vibrator such as an actuator or sensor, the piezoelectric
ceramic is in contact with a metal diaphragm using an epoxy adhesive or the like. In a circuit for
driving a device using such a piezoelectric ceramic, the electrical capacity of the abovementioned bonded body is very important. FIG. 4 shows a typical configuration of a conventional
piezoelectric vibrator. The metal diaphragm 1 and the piezoelectric ceramic 2 are bonded with an
epoxy adhesive 5. On the piezoelectric ceramic 2 't! 3.4 is formed. The electrodes 3 and 4 are
usually formed by baking a silver paste. Power supply to the piezoelectric ceramic 2 is performed
from the electrode 4 on the opposite side to the bonding surface of the metal diaphragm 1 and
the piezoelectric ceramic 2. Here, the lead wire 7 is in contact with the electrode 4 by the solder
6. Therefore, in this piezoelectric vibrator, the electric capacitances of the epoxy adhesive 5 and
the piezoelectric ceramic 2 are in series. Therefore, unless all factors for forming the two
capacitors are fixed, stable capacitance can not be obtained. Also, it is the present dog that can
not adjust this electric capacity. (Object of the Invention) The present invention has been made in
view of I, t as described above, and the object of the present invention is to provide a method of
manufacturing a piezoelectric vibrator formed by joining a piezoelectric ceramic and a metal
diaphragm. In the above, it is possible to adjust so as to obtain a desired electric capacity.
Disclosure of the Invention In the present invention, in order to achieve the above object, in a
method of manufacturing a piezoelectric vibrator formed by joining a piezoelectric ceramic and a
metal diaphragm, bonding the piezoelectric ceramic and the metal diaphragm After bonding with
an agent, the electric capacity is adjusted by applying a stress to the bonding surface within a
range not damaging the contact interface. In the present invention, since the stress is applied to
the contact surface 3 after the contact 6 by the adhesive as described above, the electric capacity
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can be adjusted, and the stress is in a range that does not damage the bonding interface. As a
result, the bonding strength is not impaired. The following is a brief description of embodiments
of the present invention. And, as the metal diaphragm 1 shown in FIG. 1, a new one was used in
which <Al100 aluminum plate (0, 8III Il + thickness) was cut to 20 mm in diameter based on
JISH4000. The aluminum plate was subjected to ultrasonic cleaning with 1 to reclen.
Next, a piezoelectric ceramic 2 having a thickness of 0.2 mm and a diameter of 8.4 mm made of
Fuji Ceramics C-6 material was attached to the center of the aluminum plate with an adhesive. As
an adhesive, using an epoxy-based adhesive (manufactured by Nippon Ciba Geigy Co., Ltd. AW,
06), after tightening at a pressure of 5 ° KH / am 2, curing was performed at 100 ° C. for 20
minutes. The electric capacitance after curing was 2850 pF. Ten samples were prepared in a
manner of 0 or more. Stress as shown in FIG. 1 was applied to the central portion of this sample.
FIG. 2 shows the change in electric capacity with respect to the displacement id due to stress. The
displacement ff 1 d is indicated by the amount of displacement of the central portion with
respect to the peripheral portion of the metal diaphragm 1. As apparent from FIG. 2, when stress
is applied from the side of the metal diaphragm 1, the electric capacity is increased, and when
stress is applied from the side of the piezoelectric ceramic 2, the electric capacity is decreased.
FIG. 3 is a cross-sectional view of an ultrasonic transducer manufactured using the
manufacturing method of the present invention. This ultrasonic transducer is obtained by
bonding the piezoelectric ceramic 2 to the inner bottom surface of the truncated conical metal
diaphragm 1 with an adhesive. In the vibrator of this structure, the electric capacitance can be
reduced by applying stress to the central portion of the piezoelectric ceramic 2 from the inside of
the metal diaphragm 1, and the metal diaphragm 1 of the metal diaphragm 1 is If stress is
applied to the central portion, the electric capacity can be increased. In the ultrasonic transducer,
in order to adjust the reverberation time in a circuit manner, it is necessary to adjust the electric
capacity of the transducer, and the method of the present invention is useful as a simple
adjustment method. (Effects of the Invention) As described above, according to the present
invention, since stress is applied to the bonding surface within the range that does not impair the
contact interface after bonding with the adhesive, the electric capacity q, q, which was
conventionally difficult. Since the adjustment is possible and the stress is in the range not to
damage the bonding interface, there is an effect that the bonding strength is not lost.
[0002]
Brief description of the drawings
[0003]
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FIG. 1 is a cross-sectional view for describing the present invention in detail, FIG. 2 is a view
showing the above characteristics, and FIG. 3 is a cross-sectional view of an ultrasonic transducer
manufactured using the manufacturing method of the present invention. FIG. 4 is a crosssectional view of an essential part of a piezoelectric vibrator manufactured using the
manufacturing method of the present invention.
1 is a metal diaphragm, 2 is a piezoelectric ceramic, 3 4 is an electrode, and 5 is an adhesive.
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