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JP2014103651

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DESCRIPTION JP2014103651
Abstract: The present invention provides an earphone which is hard to destroy a carbon
nanotube film of a loudspeaker and which has an excellent stereo effect, has a simple structure,
is easy to realize production, downsizing and industrialization, and is easy to repair. Provides an
earphone that can replace the sound generator. An outer case includes an outer case (110) and at
least one loudspeaker (100 '), the outer case having a receiving space, each loudspeaker
comprising a first substrate, an acoustic wave generator, and at least one first electrode. And at
least one second electrode, wherein the first substrate comprises opposing first and second
surfaces, the acoustic wave generator is disposed on the first surface of the first substrate, and
the at least one first The one electrode and the at least one second electrode are spaced apart
from each other on the first surface of the first substrate and electrically connected to the sound
generator. [Selected figure] Figure 1
イヤホーン
[0001]
The present invention relates to earphones, and in particular to thermoacoustic earphones.
[0002]
In general, an acoustic device comprises a signal device and a sound generator.
The signaling device transmits the signal to the sound generator. The earphone is a type of
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acoustic device utilizing a thermoacoustic phenomenon, and when an alternating current flows
through a conductor, a sound is generated by heat. The heat capacity of the conductor is small
and the thickness is thin. In addition, the heat generated inside the conductor is rapidly
transmitted to the surrounding medium, and the thermal expansion generated by the transmitted
heat can change the density of the surrounding medium and generate an acoustic wave. .
[0003]
Referring to Non-Patent Document 1, in a thermoacoustic apparatus, a carbon nanotube film is
used as a sound wave generator. The carbon nanotube film generates an acoustic wave by a
thermoacoustic phenomenon.
[0004]
However, when using a carbon nanotube film as a sound wave generator, the carbon nanotube
film is easily broken by an external force, which is disadvantageous to industrialization of
earphones. In addition, in the conventional electromagnetic earphone, it is difficult to realize a
stereo effect because the sound wave is adjusted by the input signal. Also, when repairing, the
sound generator can not be easily replaced.
[0005]
Chinese Patent Application Publication No. 101239712 Specification Japanese Patent
Application Laid-Open No. 2004-107196 Japanese Patent Application Laid-Open No. 2006161563
[0006]
Lin Xiao et
al., Flexible,Stretchable,Transparent Carbon
Nanotube Thin Film Loudspeakers ,Nano
Letters,Vol.8(12),p.4539−4545
[0007]
In order to solve the above-mentioned problems, the present invention provides an earphone
which is hard to destroy a carbon nanotube film of a loudspeaker and which has an excellent
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stereo effect, and has a simple structure and realizes production, miniaturization and
industrialization. To provide an earphone which can be easily replaced and the sound generator
can be easily replaced.
[0008]
The earphone of the present invention is an earphone including an outer case and at least one
loudspeaker, wherein the outer case has a housing space, the at least one loudspeaker is housed
in the housing space, and each loudspeaker Comprises a first substrate, an acoustic wave
generator, at least one first electrode, and at least one second electrode, the first substrate
comprising opposing first and second surfaces, An acoustic wave generator is disposed on the
first surface of the first substrate, and the at least one first electrode and the at least one second
electrode are spaced apart from each other on the first surface of the first substrate, A plurality
of recesses electrically connected to the sound wave generator and spaced apart and parallel to
the first surface of the substrate, wherein the depth of the recesses is 100 μm to 200 μm.
[0009]
In the earphone of the present invention, the outer case has an utterance part, the number of
loudspeakers is plural, and the plural loudspeakers are installed at different angles with respect
to the utterance part.
[0010]
In the earphone of the present invention, the number of loudspeakers is one, and further, a
housing is included, the housing has a space, the loudspeaker is housed in the space of the
housing, and an acoustic chip is formed. The acoustic chip is accommodated in the
accommodation space of the outer case and fixed to the outer case by a removable method, and
the space of the casing has at least one opening, and the sound wave generator Located opposite
the at least one aperture, the case has at least two pins, the at least two pins being electrically
connected to the at least one first electrode and the at least one second electrode of the
loudspeaker. Connected.
[0011]
Compared to the prior art, the earphone of the present invention has the following advantages.
First, since the plurality of recesses are formed in the first substrate, the carbon nanotube
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structure can be effectively protected without affecting the acoustic effect.
Second, the depth of the plurality of recesses is 100 μm to 200 μm.
In this case, at the same time as protecting the sound generator, the distance between the first
area of the sound generator and the bottom of the recess can be secured.
By means of said distance, the heat generated by activating the sound generator can be
completely absorbed by the first substrate.
This prevents the volume being lowered as the generated heat is not transmitted to the
surrounding media, and ensures that the sound generator has an excellent acoustic effect at each
acoustic frequency.
Third, the earphones include a plurality of loudspeakers, and by inputting a different sound
source to each loudspeaker or adjusting the order of generating the sound of each loudspeaker,
or by arranging the loudspeakers in a different arrangement, A three-dimensional sound effect
can be realized. Fourth, the sound generator can be disassembled because the sound generator is
mounted on the sound chip and the sound chip is fixed to the outer case in a removable manner.
Thereby, when a sound wave generator breaks down, an acoustic chip can be replaced easily.
[0012]
It is a block diagram of the earphone in Example 1 of this invention. It is sectional drawing of the
earphone in Example 1 of this invention. It is a three-dimensional view of the loudspeaker in the
earphone of Example 1 of this invention. It is sectional drawing along IV-IV in FIG. It is a
scanning electron micrograph of the carbon nanotube film in the earphone of Example 1 of this
invention. It is a scanning electron micrograph of the non-twisted carbon nanotube wire utilized
in Example 1 of this invention. It is a scanning electron micrograph of the twisted carbon
nanotube wire utilized in Example 1 of this invention. It is an optical microscope photograph of
the carbon nanotube wire after the process by the organic solvent in Example 1 of this invention.
It is sectional drawing of the loudspeaker in the earphone of Example 2 of this invention. It is a
curve figure of the sound pressure level-frequency of the earphone in Example 2 of this invention
which is an optical microscope photograph of the loudspeaker in Example 2 of this invention. It
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is an effect figure of generation ¦ occurrence ¦ production of the sound of the earphone in
Example 2 of this invention. It is sectional drawing of the loudspeaker in the earphone of
Example 3 of this invention. It is sectional drawing of the loudspeaker in the earphone of
Example 4 of this invention. It is a block diagram of the earphone in Example 5 of this invention.
It is a three-dimensional view of the sound generation assembly in which the several loudspeaker
was formed in the earphone of Example 5 of this invention. It is a block diagram of the earphone
in Example 9 of this invention. It is sectional drawing of the earphone in Example 10 of this
invention. It is sectional drawing of 10 A of audio chips in Example 10 of this invention. It is
sectional drawing of 20 A of acoustic chips in Example 11 of this invention. It is sectional
drawing of the acoustic chip 30A in Example 12 of this invention. It is sectional drawing of
acoustic chip 40A in Example 13 of this invention. It is sectional drawing of acoustic chip 50A in
Example 14 of this invention. It is sectional drawing of 60 A of acoustic chips in Example 15 of
this invention.
[0013]
Hereinafter, embodiments of the present invention will be described with reference to the
drawings.
[0014]
Embodiment 1 Referring to FIGS. 1 and 2, the earphone 10 of this embodiment includes an outer
case 110 and a loudspeaker 100 '.
The outer case 110 has a housing space, and the loudspeaker 100 'is housed in the housing
space.
[0015]
The structure of the outer case 110 is not limited, and may be integral molding or another
method as long as it has a space. In the present embodiment, the outer case 110 includes a front
cover 112, a rear cover 114, and a through hole 116. The through hole 116 is formed in the
front cover 112. The front cover 112 and the rear cover 114 are tightly coupled to form the
outer case 110. If installed in the outer case 110 and opposed to the through hole 116, the fixed
position of the loudspeaker 100 'is not limited. To be installed opposite to the through hole 116
means that the sound wave generator in the loudspeaker 100 ′ is installed to be opposite to the
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through hole 116. In the present embodiment, the loudspeaker 100 'is fixed to the rear cover
114 of the outer case 110 and spaced apart from the front cover 112 of the outer case 110.
Further, the loudspeaker 100 ′ is disposed opposite to the through hole 116 in the front cover
112 and spaced apart from the through hole 116. The sound generated by the loudspeaker 100
′ is transmitted to the outside of the earphone 10 through the through hole 116.
[0016]
The material of the outer case 110 is light and has a specific strength. For example, plastic or
resin. The size and shape of the outer case 110 can be selected as needed. The size of the outer
case 110 is the same as or larger than the size of the human ear and covers the human ear. The
design of the outer case 110 may be a structural design suitable for ergonomics.
[0017]
Further, the outer case 110 includes a protective cover 118. The protective cover 118 is
disposed between the loudspeaker 100 'and the front cover 112 and spaced apart from the
loudspeaker 100'. The protective cover 118 is connected to the front cover 112 by a fixing
element (not shown). Protective cover 118 has a plurality of openings (not shown). The material
of the protective cover 118 is not limited, but is preferably plastic or metal. The protective cover
118 protects the loudspeaker 100 'from dust and the like. In addition, the protective cover 118
may not be installed as needed.
[0018]
Furthermore, the earphone 10 includes at least one lead 130. The at least one conductor 130 is
electrically connected to the loudspeaker 100 'through the inside of the outer case 110 to
transmit a frequency electrical signal to the loudspeaker 100'.
[0019]
Referring to FIGS. 3 and 4, the loudspeaker 100 ′ includes a first substrate 101, a sound wave
generator 102, an insulating layer 103, a first electrode 104, and a second electrode 105. The
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first substrate 101 has opposing first and second surfaces 106 and 107. The first electrode 104
and the second electrode 105 are spaced apart from each other, and electrically connected to the
sound wave generator 102. The first surface 106 forms a plurality of recesses 108 and a
plurality of projections 109. The insulating layer 103 is disposed on the first surface 106 of the
first substrate 101 and adheres to the surfaces of the plurality of recesses 108 and the plurality
of protrusions 109. The sound wave generator 102 is installed on the first surface 106 of the
first substrate 101 and installed so as to insulate the first substrate 101 by the insulating layer
103. The sound wave generator 102 has a first area 1020 and a second area 1021. The first area
1020 corresponds to the position of the recess 108. That is, the sound wave generator 102 in
the first area 1020 is suspended. The sound wave generator 102 in the second area 1021 is
installed on the surface of the protrusion 109 and installed so as to be insulated from the first
substrate 101 by the insulating layer 103.
[0020]
The shape of the first substrate 101 is not limited, and may be circular, square, rectangular or
any other shape. The first surface 106 and the second surface 107 of the first substrate 101 are
flat or curved. The size of the first substrate 101 is not limited and can be selected as needed, but
preferably, the area of the first substrate 101 is 25 mm <2> to 100 mm <2>. Specifically, the area
of the first substrate 101 is 36 mm <2>, 64 mm <2> or 80 mm <2>. The thickness of the first
substrate 101 is 0.2 mm to 0.8 mm. The first substrate 101 may have other structures as long as
it is ensured that the first substrate 100 has a surface supporting the acoustic wave generator
102. For example, a block structure, a curved surface structure, an arc surface structure or the
like.
[0021]
The material of the first substrate 101 is single crystal silicon or polycrystalline silicon. Since the
first substrate 101 is excellent in thermal conductivity, the heat generated by the sound wave
generator 102 during operation can be transmitted to the outside, and the service life of the
sound wave generator 102 can be extended. In the present embodiment, the first substrate 101
has a square planar structure, the length of one side of the first substrate 101 is 8 mm, and the
thickness of the first substrate 101 is 0.6 mm. The material of is single crystal silicon.
[0022]
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The plurality of recesses 108 may be a kind of through groove, a through hole, a blind groove, a
blind hole, or any one or more of them. Also, the plurality of recesses 108 may be distributed on
the first surface 106 of the first substrate 101 in a uniform distribution manner, may be
distributed according to a specific rule, or may be distributed in a random distribution manner.
The recess 108 has one bottom surface and two side surfaces connected to the bottom surface.
In addition, the projection 109 is provided between two adjacent recesses 108. The surface of
the first substrate 101 between the two adjacent recesses 108 is the surface of the protrusion
109. The first area 1020 corresponds to the position of the recess 108. Thus, the acoustic wave
generator 102 of the first section 1020 is suspended and does not contact the bottom and sides
of the recess 108.
[0023]
The depth of the recess 108 can be selected as needed and depending on the thickness of the
first substrate 101. Preferably, the depth of the recess 108 is 100 μm to 200 μm. At this time,
the first substrate 101 protects the sound wave generator 102 and at the same time secures the
distance between the first substrate 101 and the sound wave generator 102. Because of the
distance, the heat generated when the sound wave generator 102 operates can be completely
absorbed by the first substrate 101. This prevents the volume from becoming low as heat is not
transmitted to the surrounding media. It also ensures that the sound generator 102 has excellent
acoustical effects at each acoustic frequency.
[0024]
The length in which the plurality of concave portions 108 extend on the first surface 106 is
equal to or less than the length of the side of the first substrate 101. The cross-sectional shape in
the direction in which the recess 108 extends is V-shaped, rectangular, E-shaped, trapezoidal,
polygonal, circular or any other irregular shape. The width of the recess 108 (that is, the
maximum value of the length of the cross section of the recess 108) is 0.2 mm to 1 mm. In the
present embodiment, the recess 108 is a groove structure, and its cross section is an inverted
trapezoid. That is, the width of the groove narrows as the groove gets deeper. The angle formed
by the bottom surface and the side surface of the inverted trapezoid is α, and the magnitude of
the angle α is related to the material of the first substrate 101. Specifically, the magnitude of the
angle α is the same as the angle of the crystal plane of single crystal silicon of the first substrate
101. Preferably, the plurality of recesses 108 are parallel to one another and uniformly
distributed at intervals. The distance between two adjacent grooves is d1, which is 20 μm to
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200 μm. Since d1 is 20 μm to 200 μm, the first electrode 104 and the second electrode 106
can be formed on the surface of the first substrate 101 by the subsequent screen printing
method, and at the same time the etching accuracy can be guaranteed. Also, ensure that the
sound effect is enhanced. The extending direction of the recess 108 is parallel to the extending
direction of the first electrode 104 and the second electrode 106.
[0025]
In the present embodiment, the first surface 106 of the first substrate 101 has a plurality of
inverted trapezoidal grooves which are parallel to one another and uniformly spaced apart from
one another. The width (maximum width) of the inverted trapezoidal groove on the first surface
106 is 0.6 mm, the depth is 150 μm, d1 is 100 μm, and the inverted trapezoidal angle α is
54.7 degrees. is there.
[0026]
The insulating layer 103 has a single layer structure or a multilayer structure. In the case where
the insulating layer 103 has a single-layer structure, the insulating layer 103 is provided only on
the surface of the protrusion 109 or attached to the entire first surface 106 of the first substrate
101. Here, pasting means that the insulating layer 103 covers the bottom and the side of the
recess 108 and covers the surface of the protrusion 109. That is, the insulating layer 103
directly covers the recess 108 and the protrusion 109, and the relief shape of the insulating layer
103 and the relief shape of the recess 108 and the protrusion 109 are the same. Thereby, in any
case, the insulating layer 103 can insulate the first substrate 101 from the sound wave generator
102. The material of the insulating layer 103 is silica, silicon nitride, or a combination thereof,
but any other insulating material may be used as long as the insulating layer 103 can insulate the
first substrate 101 from the sound wave generator 102. The thickness of the insulating layer
103 is 10 nm to 2 μm, and specifically, 50 nm, 90 nm or 1 μm. In addition, when the material
of the first substrate 101 is an insulating material, the insulating layer 103 need not be provided.
In the present embodiment, the insulating layer 103 is a continuous single layer silicon, and its
thickness is 1.2 μm, covering the entire first surface 106 of the first substrate 101.
[0027]
The sound wave generator 102 has a very low heat capacity per unit area. The material of the
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sound wave generator 102 is not limited, and is, for example, a thermosonic wave generation
material of a pure carbon nanotube structure, a carbon nanotube composite structure or other
non-carbon nanotubes consisting only of carbon nanotubes. Preferably, the sound wave
generator 102 includes only a carbon nanotube structure composed of a plurality of carbon
nanotubes. Preferably, the sound generator 102 consists of carbon nanotubes only. In the
present embodiment, the heat capacity per unit area of the sound wave generator 102 is smaller
than 2 × 10 <−4> J / cm <2> · K. Specifically, the sound wave generator 102 has a conductive
structure, a large specific surface area, and a small thickness. Thereby, the sound wave generator
102 can convert the input electrical energy into heat. That is, according to the input signal, the
sound wave generator 102 can be quickly heated, and heat is exchanged rapidly with the
surrounding medium, and the density of the surrounding medium is changed by the thermal
expansion generated by the propagated heat. Can be generated. Also, the sound wave generator
102 preferably has a self-supporting structure. Here, the free standing structure is a structure
that can be used without using a support. That is, the sound wave generator 102 does not utilize
the support, but maintains its own specific shape. Thereby, the sound wave generator 102 can be
installed by suspending its part. Also, it can be in sufficient contact with surrounding media and
can propagate heat. The surrounding medium is a medium outside the sound wave generator
102 and does not include the medium inside. The sound wave generator 102 is a film structure, a
layered structure in which a plurality of linear structures are formed in parallel, or a combination
of a film structure and a linear structure.
[0028]
In the present embodiment, the sound wave generator 102 includes a carbon nanotube structure.
Specifically, the carbon nanotube structure is a layered structure. The thickness of this layered
carbon nanotube structure is preferably 0.5 nm to 1 mm. When the thickness of the carbon
nanotube structure is thin, for example, 10 nm or less, the transparency of the carbon nanotube
structure is excellent. The carbon nanotube structure has a specific shape because a plurality of
carbon nanotubes in the carbon nanotube structure mutually attract each other by an
intermolecular force. Therefore, a part of the carbon nanotube structure is supported by the first
substrate 101, and the other part is suspended. That is, at least a part of the carbon nanotube
structure is suspended.
[0029]
The carbon nanotube structure includes at least one carbon nanotube film, a carbon nanotube
wire, or a combination thereof. The carbon nanotube film can be obtained by directly stretching a
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carbon nanotube array. The thickness of the carbon nanotube film is 0.5 nm to 100 μm, and the
heat capacity per unit area of the carbon nanotube film is smaller than 1 × 10 <-6> J / cm <2> ·
K. The carbon nanotubes are one or more types of single-walled carbon nanotubes, double-walled
carbon nanotubes, and multi-walled carbon nanotubes. The diameter of single-walled carbon
nanotubes is 0.5 nm to 50 nm, the diameter of double-walled carbon nanotubes is 1 nm to 50
nm, and the diameter of multi-walled carbon nanotubes is 1.5 nm to 50 nm. The length of the
carbon nanotube film is not limited, and the width can be selected according to the width of the
carbon nanotube array.
[0030]
Referring to FIG. 5, the carbon nanotube film is a freestanding structure formed by a plurality of
carbon nanotubes, and the plurality of carbon nanotubes are arranged along the same direction.
The extending direction of the plurality of carbon nanotubes is basically parallel to the surface of
the carbon nanotube film. Also, the plurality of carbon nanotubes are connected by
intermolecular force. Specifically, in each carbon nanotube in the plurality of carbon nanotubes,
the adjacent carbon nanotube in the extending direction is connected with the end by an
intermolecular force. Carbon nanotube films also contain a small number of random carbon
nanotubes. However, since most of the carbon nanotubes are arranged along the same direction,
the extending direction of the random carbon nanotubes does not affect the extending direction
of most of the carbon nanotubes.
[0031]
The carbon nanotube film is a free standing structure. Here, a self-supporting structure is a form
which can maintain its own form without using a support and can independently utilize a carbon
nanotube film. That is, it means that the carbon nanotube film can be suspended by supporting
the carbon nanotube film from opposite sides without changing the structure of the carbon
nanotube film. The carbon nanotubes in the carbon nanotube film have a self-supporting
structure realized by intermolecular force connecting the ends to the ends and arranging them.
[0032]
Specifically, the large number of carbon nanotubes in the carbon nanotube film may be slightly
curved basically not absolutely linear. Alternatively, the stretching directions may not be
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completely aligned but may be slightly offset. Therefore, parallel carbon nanotubes may partially
come into contact with a plurality of carbon nanotubes arranged along the same direction.
[0033]
The plurality of carbon nanotubes are substantially parallel to the first surface 106 of the first
substrate 101. The carbon nanotube structure includes a plurality of carbon nanotube films, and
when the width of the plurality of carbon nanotube films is very small, the plurality of carbon
nanotube films are aligned on the first surface 106 of the first substrate 101 on the same plane.
Will be installed. In addition, the carbon nanotube structure includes multi-layered carbon
nanotube films overlapping each other, and carbon nanotubes in adjacent two-layered carbon
nanotube films intersect to form an angle β, and this angle β is 0 ° to 90 ° A method for
producing a carbon nanotube film is disclosed in Patent Document 1.
[0034]
Since the carbon nanotube film has strong adhesiveness, the carbon nanotube film can be
directly attached to the surface of the insulating layer 103 in the protrusion 109. The plurality of
carbon nanotubes in the carbon nanotube film are arranged along the same direction. The
extending direction of the plurality of carbon nanotubes and the extending direction of the recess
108 form an angle. The extending direction of the plurality of carbon nanotubes is preferably
perpendicular to the extending direction of the recess 108. Furthermore, after the carbon
nanotube film is attached to the surface of the insulating layer 103 in the protrusion 109, the
carbon nanotube film attached to the first substrate 101 can be treated with an organic solvent.
[0035]
Specifically, a test tube is used to drip the organic solvent until the carbon nanotube film is
immersed. The organic solvent is a volatile organic solvent, such as ethanol, methanol, acetone,
dichloroethane or chloroform. In the present example, the organic solvent is ethanol.
Microscopically, when the volatile organic solvent evaporates, the action of surface tension
causes a portion of adjacent carbon nanotubes in the carbon nanotube film to shrink and bundle.
In addition, the mechanical strength and toughness of the carbon nanotube film are enhanced,
the surface area of the carbon nanotube film is decreased, and the adhesion is decreased, since a
part of adjacent carbon nanotubes is contracted and bundled. Macroscopically, the carbon
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nanotube film has a uniform film structure.
[0036]
The layered carbon nanotube structure may be a plurality of spaced apart and parallel carbon
nanotube wires. The plurality of carbon nanotube wires are suspended and installed at positions
corresponding to the recesses 108. Preferably, the extending direction of the carbon nanotube
wire is perpendicular to the extending direction of the recess 108. The distance between adjacent
carbon nanotube wires is 1 μm to 200 μm. Preferably, it is 50 micrometers-130 micrometers.
In the present embodiment, the distance between adjacent carbon nanotube wires is 120 μm,
and the diameter of the carbon nanotube wires is 1 μm.
[0037]
The carbon nanotube wire is a non-twisted carbon nanotube wire or a twisted carbon nanotube
wire. Both non-twisted carbon nanotube wires and twisted carbon nanotube wires are selfsupporting structures. Referring to FIG. 6, when the carbon nanotube wire is a non-twisted
carbon nanotube wire, the carbon nanotube wire includes a plurality of carbon nanotube
segments (not shown) connected end to end by an intermolecular force. Furthermore, a plurality
of carbon nanotubes of the same length are arranged in parallel in each carbon nanotube
segment. The plurality of carbon nanotubes are arranged parallel to the central axis of the carbon
nanotube wire. The length, thickness, uniformity and shape of the carbon nanotube segments are
not limited. The length of the non-twisted carbon nanotube wire is not limited, and its diameter is
0.5 nm to 100 μm. The carbon nanotube film is treated with an organic solvent to obtain a nontwisted carbon nanotube wire. Specifically, the entire surface of the carbon nanotube film is
soaked with an organic solvent. Thereafter, when the volatile organic solvent evaporates, the
surface tension causes the plurality of carbon nanotubes parallel to each other in the carbon
nanotube film to be closely coupled by the intermolecular force, causing the carbon nanotube
film to shrink. Form a non-twisted carbon nanotube wire. The organic solvent is ethanol,
methanol, acetone, dichloroethane or chloroform. Non-twisted carbon nanotube wires treated
with organic solvents have reduced specific surface area and lower adhesion as compared to
carbon nanotube films that are not treated with organic solvents. In addition, the mechanical
strength and toughness of the carbon nanotube wire are enhanced to reduce the possibility of
the carbon nanotube wire being broken by an external force.
[0038]
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Referring to FIG. 7, a twisted carbon nanotube wire can be formed by applying opposing forces
to opposite ends along the longitudinal direction of the carbon nanotube film. The twisted carbon
nanotube wire preferably includes a plurality of carbon nanotube segments (not shown)
connected end to end by intermolecular force. Also, a plurality of carbon nanotubes of the same
length are arranged in parallel in each carbon nanotube segment. The length, thickness,
uniformity and shape of the carbon nanotube segments are not limited. The length of one twisted
carbon nanotube wire is not limited, and its diameter is 0.5 nm to 100 μm. Further, the twisted
carbon nanotube wire is treated with an organic solvent. Twisted carbon nanotube wires treated
with an organic solvent have a reduced specific surface area and less adhesion, but enhance the
mechanical strength and toughness of the carbon nanotube wire. Methods of making carbon
nanotube wires are described in US Pat.
[0039]
The plurality of carbon nanotube wire manufacturing methods first install a carbon nanotube
film on the first electrode 104 and the second electrode 105, and then cut the carbon nanotube
film by a laser so as to be parallel and spaced apart from each other. Forming a plurality of
carbon nanotube strips installed. Finally, the carbon nanotube strip is shrunk with an organic
solvent to form a carbon nanotube wire.
[0040]
Referring to FIG. 8, the carbon nanotube strip is treated with the organic solvent to form a
plurality of carbon nanotube wires spaced apart from one another. Both ends of the carbon
nanotube wire are connected to the first electrode 104 and the second electrode 105,
respectively. Thereby, the drive voltage of the sound wave generator 102 is decreased, and the
stability of the sound wave generator 102 is improved. In FIG. 8, the black part is the first
substrate and the white part is the electrode.
[0041]
In the process of processing the carbon nanotube film strip with the organic solvent, the carbon
nanotubes located at the portion of the protrusion 109 are strongly fixed to the surface of the
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insulating layer 103, and therefore, they do not shrink basically. Therefore, the carbon nanotube
wire is preferably electrically connected to the first electrode 104 and the second electrode 105.
The width of the carbon nanotube strip is 10 μm to 50 μm to ensure that the carbon nanotube
strip is favorably shrunk to the carbon nanotube wire. If the width of the carbon nanotube strip is
wider than 10 μm to 50 μm, a crack may be formed in the process of shrinking the carbon
nanotube film, which affects the thermoacoustic effect. In addition, when the width of the carbon
nanotube film strip is narrower than 10 μm to 50 μm, the carbon nanotube film strip may be
ruptured in the process of shrinking, or the carbon nanotube wire formed may be thin, so that
the working life of the sound wave generator Affect. Thus, in the present example, the width of
the carbon nanotube strip is 30 μm, the diameter of the contracted carbon nanotube wire is 1
μm, and the distance between adjacent carbon nanotube wires is 120 μm. The width of the
carbon nanotube strip is not limited, and the width of the carbon nanotube strip can be selected
as needed, as long as the carbon nanotube wire generates sound properly. After the treatment
with the organic solvent, the carbon nanotube wire is strongly stuck to the surface of the first
substrate 101, and the suspended portion is kept in a stretched state so that the carbon nanotube
wire does not deform during operation. To guarantee. This prevents the carbon nanotube wire
from being deformed and affecting the thermoacoustic effect.
[0042]
In this embodiment, the sound generator 102 comprises non-twisted carbon nanotube wire,
which is obtained by treating a single-walled carbon nanotube film. In each loudspeaker 100 ',
the acoustic wave generator 102 corresponding to the recess 108 comprises a plurality of
spaced apart and parallel carbon nanotube wires.
[0043]
The first electrode 104 and the second electrode 105 are electrically connected to the sound
wave generator 102, and the frequency electric signal is input to the sound wave generator 102
by the first electrode 104 and the second electrode 105. Specifically, the first electrode 104 and
the second electrode 105 may be provided directly on the first surface 106 of the first substrate
101. Alternatively, it may be installed on the surface of the sound wave generator 102 opposite
to the first substrate 101. The first electrode 104 and the second electrode 105 are made of a
conductive material, and their shape and structure are not limited. Specifically, the first electrode
104 and the second electrode 105 may be in the form of an elongated strip, a rod, or any other
shape. The material is a conductive material such as metal, conductive polymer, conductive
adhesive, conductive paste, metallic carbon nanotube, and ITO.
10-05-2019
15
[0044]
In the present embodiment, the first electrode 104 and the second electrode 105 are respectively
disposed on the insulating layers 103 disposed on the protrusions 109 on opposite sides of the
sound wave generator 102, and disposed parallel to the extension direction of the recess 108. Be
done. The first area 1020 and the second area 1021 of the sound wave generator 102 are
disposed between the first electrode 104 and the second electrode 105. The first electrode 104
and the second electrode 105 are made of metal thread.
[0045]
Since carbon nanotubes have excellent conductivity in the axial direction, when the carbon
nanotubes are arranged along the same direction, the carbon nanotubes extend along the
direction from the first electrode 104 to the second electrode 105 Is preferred. Preferably, the
distances from the first electrode 104 to the second electrode 105 are essentially the same. At
this time, the carbon nanotube structure between the first electrode 104 and the second
electrode 105 basically has the same resistance value. Preferably, the length of the first electrode
104 and the second electrode 105 is equal to or greater than the width of the carbon nanotube
structure. Thereby, the whole carbon nanotube structure can be used on average. In the present
embodiment, the carbon nanotubes in the carbon nanotube structure are arranged
perpendicularly to the length direction of the first electrode 104 and the second electrode 105.
The first electrode 104 and the second electrode 105 are parallel to each other. A frequency
electrical signal is input to the carbon nanotube structure by the first electrode 104 and the
second electrode 105.
[0046]
The loudspeaker 100 'is fixedly accommodated in the accommodation space of the outer case
110 by an adhesive and a groove structure. In the present embodiment, the loudspeaker 100 'is
fixed to the rear cover 114 of the outer case 110 by an adhesive. Further, a fixing groove 120 is
formed in a storage space of the rear cover 114 of the outer case 110. The fixing groove 120 is
integrally formed with the rear cover 114. The shape of the fixing groove 120 is not limited. A
portion of the loudspeaker 100 ′ contacts the fixing groove 120, and the other portion of the
loudspeaker 100 ′ is suspended in the receiving space of the back cover 114. As a result, the
10-05-2019
16
loudspeaker 100 'can have excellent sound generation efficiency because it has a large contact
area with air or surrounding media and a high rate of heat exchange.
[0047]
The material of the fixing groove 120 is an insulating material or a material having low
conductivity. Specifically, a hard material or a soft material may be used. The hard material is, for
example, diamond, glass, ceramic or quartz. The soft material is, for example, a plastic, resin or
paper-like material. Preferably, the material of the fixing groove 120 has excellent thermal
insulation. As a result, the heat generated by the sound wave generator 102 is not absorbed by
the material of the fixed groove 120 and does not affect the sound generation efficiency.
[0048]
Since the principle of sound generation of the sound generator 102 is electro-thermal-sound
conversion, the sound generator 102 generates constant heat simultaneously with the generation
of sound. When the earphone 10 is activated, the lead 130 is electrically connected to the first
electrode 104 and the second electrode 105. A lead 130 connects the loudspeaker 100 'with a
frequency electrical signal source and a drive signal source. Since the sound wave generator 102
has a small heat capacity per unit area and a large heat dissipation surface, after inputting a
signal, the sound wave generator 102 is rapidly heated, the temperature changes periodically,
and heat is transferred to the surrounding medium. The thermal expansion caused by the
propagated heat causes the density of the surrounding medium to be changed to generate an
acoustic wave. Furthermore, a heat dissipation device (not shown) may be installed in the
earphone 10. The heat dissipation device is installed on the surface of the first substrate 101
opposite to the sound wave generator 102.
[0049]
The earphone 10 of the present invention has the following advantages. First, since the plurality
of recesses 108 are formed in the first substrate 101, the carbon nanotube structure can be
effectively protected without affecting the acoustic effect. Second, the depth of the plurality of
recesses 108 is 100 μm to 200 μm. Therefore, while protecting the sound wave generator 102,
the distance between the first area 1020 of the sound wave generator 102 and the bottom of the
recess 108 is secured. Because of this distance, the heat generated when the sound generator
10-05-2019
17
102 is activated can be completely absorbed by the first substrate 101. This prevents the volume
from becoming low because the generated heat is not transmitted to the surrounding media. It
also ensures that the sound generator 102 has excellent acoustical effects at each acoustic
frequency.
[0050]
Example 2 Example 2 of the present invention provides an earphone 20. The earphone 20 of the
present embodiment includes an outer case 210 and a loudspeaker 200 '. The outer case 210
has a housing space, and the loudspeaker 200 'is housed in the housing space.
[0051]
The structure of the earphone 20 of this embodiment is different from the structure of the
earphone 10 in the following points. Referring to FIG. 9, the loudspeaker 200 ′ includes a
plurality of first electrodes 104 and a plurality of second electrodes 105, and the plurality of first
electrodes 104 and the plurality of second electrodes 105 are alternately disposed on the surface
of the protrusion 109. The plurality of first electrodes 104 are electrically connected to each
other, and the plurality of second electrodes 105 are electrically connected to each other.
[0052]
Specifically, the plurality of first electrodes 104 are electrically connected to form a first comb
electrode (not shown). The plurality of second electrodes 105 are electrically connected to form a
second comb electrode (not shown). Referring to FIG. 10, the teeth of the first comb electrode
and the teeth of the second comb electrode are alternately arranged. By this connection method,
the adjacent first electrode 104 and second electrode 105 form one thermoacoustic unit. That is,
the sound wave generator 102 includes a plurality of thermoacoustic units. Further, the drive
voltage of the sound wave generator 102 is lowered by arranging the plurality of thermoacoustic
units in parallel.
[0053]
10-05-2019
18
11 and 12 show the effect of the sound generation of the earphone 20 due to the different
depths of the recess 108. If the depth of the recess 108 is too deep, there is a problem that the
acoustic effect of the sound wave generator 102 is adversely affected. Therefore, the depth of the
recess 108 is preferably 100 μm to 200 μm. At this time, the earphone 20 reaches an acoustic
frequency that can be heard even by the human ear and has an excellent heat wavelength, so it is
small in size and excellent in thermoacoustic effect. Furthermore, the first substrate 101 protects
the sound wave generator 102 and at the same time secures a sufficient distance between the
first substrate 101 and the sound wave generator 102. According to the distance, the heat
generated by operating the sound wave generator 102 can be completely absorbed by the first
substrate 101. This prevents the volume from becoming low because the generated heat is not
transmitted to the surrounding media. Also, it ensures that the sound generator 102 has
excellent sound effects for each sound frequency.
[0054]
Example 3 Example 3 of the present invention provides an earphone 30. The earphone 30 of this
embodiment includes an outer case 310 and a loudspeaker 300 '. The outer case 310 has a
housing space, and the loudspeaker 300 'is housed in the housing space.
[0055]
The structure of the earphone 30 of this embodiment is different from the structure of the
earphone 10 in the following points. Referring to FIG. 13, in the loudspeaker 300 ', a groove (not
shown) is formed in the second surface 107 of the first substrate 101, and the integrated circuit
chip 201 is integrated in the groove.
[0056]
Specifically, a groove (not shown) is formed in the second surface 107 of the first substrate 101,
and the integrated circuit chip 201 is fitted in the groove. Since the first substrate 101 is made of
silicon, the integrated circuit chip 201 can be formed directly on the first substrate 101. That is,
the circuits and microelectronic devices in the integrated circuit chip 201 are integrated in the
grooves of the second surface 107 of the first substrate 101. The first substrate 101 is a support
for the electronic wiring and the microelectronic device, and the integrated circuit chip 201 and
the first substrate 101 have an integral structure.
10-05-2019
19
[0057]
Furthermore, the integrated circuit chip 201 includes a third electrode (not shown) and a fourth
electrode (not shown), the third electrode is electrically connected to the first electrode 104, and
the fourth electrode is a second electrode. It is electrically connected to 105. Thereby, a signal is
input to the sound wave generator 102. In addition, the third electrode and the fourth electrode
may be disposed inside the first substrate 101. In this case, the third electrode and the fourth
electrode are insulated from the first substrate 101. In the present embodiment, the surfaces of
the third electrode and the fourth electrode have insulating layers. Thereby, the first substrate
101 is insulated. If the area of the first substrate 101 is very large, the integrated circuit chip
201 may be disposed on the first surface 106 of the first substrate 101. In this case, there is no
need to install a connection line inside the first substrate 101. Specifically, the integrated circuit
chip 201 may be installed on the side surface of the first surface 106 of the first substrate 101
because it does not affect the normal operation of the sound wave generator 102. The integrated
circuit chip 201 includes an audio processing module and a current processing module. In
operation, the integrated circuit chip 201 drives the sound wave generator 102 after processing
the input audio signal and current signal. The audio processing module increases the power of
the audio signal and also inputs the increased audio signal to the sound generator 102. Also, the
current processing module processes the current input from the power supply, provides a stable
input current to the sound generator 102, and ensures the normal operation of the sound
generator 102.
[0058]
Since the first substrate 101 is made of silicon, the integrated circuit chip 201 can be integrated
directly on the first substrate 101. Thus, the volume of the earphone 30 can be reduced by
reducing the space for installing the integrated circuit chip 201 alone, which is advantageous for
downsizing. Further, since the first substrate 101 has excellent heat dissipation, the heat
generated by the integrated circuit chip 201 and the sound wave generator 102 can be
conducted to the outside to enhance the thermoacoustic effect.
[0059]
Example 4 Example 4 of the present invention provides an earphone 40. The earphone 40 of the
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20
present embodiment includes an outer case 410 and a loudspeaker 400 '. The outer case 410
has a receiving space, and the loudspeaker 400 'is received in the receiving space.
[0060]
The structure of the earphone 40 of the present embodiment is different from the structure of
the earphone 10 in the following points. Referring to FIG. 14, the loudspeaker 400 ′ includes a
heat dissipation element 202 disposed on the second surface 107 of the first substrate 101.
[0061]
The heat dissipation element 202 is fixed to the second surface 107 of the first substrate 101 by
an adhesive or a heat conductive material. The heat dissipation element 202 includes a second
substrate 2020 and a plurality of heat dissipation fins 2021. The plurality of heat dissipating fins
2021 are disposed on the surface of the second substrate 2020. The second substrate 2020 has
a planar structure. Also, the material of the second substrate 2020 is not limited as long as it has
excellent thermal conductivity. Specifically, the material of the first substrate 2020 is any one of
single crystal silicon, polycrystalline silicon, and metal. The heat dissipating fins 2021 are metal
pieces. The metal material is any one of gold, silver, copper, iron and aluminum or an alloy
thereof. In the present embodiment, the heat dissipating fins 2021 are copper pieces, and the
thickness thereof is 0.5 mm to 1 mm. The plurality of heat dissipating fins 2021 are installed on
the surface of the second substrate 2020 by an adhesive or welding. In the present embodiment,
the plurality of heat dissipating fins 2021 are installed on the surface of the first substrate 2020
by an adhesive. The heat dissipating fins 2021 can transmit the heat generated during the
operation of the sound wave generator 102 to the outside, lower the operating temperature of
the earphone 40, prolong the service life of the earphone 40, and increase the work rate of the
earphone 40. .
[0062]
Furthermore, the earphone 40 of this embodiment may have a plurality of heat transfer holes
(not shown). The plurality of heat transfer holes are disposed in the rear cover 114 of the outer
case 110. The shape and size of the heat transfer hole are not limited and can be selected as
needed. The heat dissipation hole can transmit the heat generated during the operation of the
sound wave generator 102 to the outside, lower the operating temperature of the earphone 40,
10-05-2019
21
prolong the service life of the earphone 40, and increase the work rate of the earphone 40. .
[0063]
Example 5 Referring to FIGS. 15, 16 and 4, Example 5 of the present invention provides an
earphone 50. The earphone 50 of this embodiment includes an outer case 510 and a plurality of
loudspeakers 100 '. The outer case 510 has a receiving space, and a plurality of loudspeakers
100 'are received in the receiving space.
[0064]
The structure of the outer case 510 is not limited, and may be integral molding or another
method as long as it has a space. In the present embodiment, the outer case 510 includes a front
cover 512, a rear cover 514, and a sound generator 515. The front cover 512 has a sound
generation unit 515, and at least one through hole 516 is formed in the sound generation unit
515. The front cover 512 and the rear cover 514 are tightly coupled to form an outer case 510.
If the plurality of loudspeakers 100 ′ are installed in the outer case 510 and installed opposite
to the sound generation unit 515, the fixed positions thereof are not limited. In the present
embodiment, the plurality of loudspeakers 100 ′ are fixed to the rear cover 514 of the outer
case 510 and spaced apart from the front cover 512 of the outer case 510. The plurality of
loudspeakers 100 ′ form one sound generating assembly 500. The sound generating assembly
500 is installed opposite to the sound generating unit 515 in the front cover 512 at an interval.
Thus, the sounds generated by the plurality of loudspeakers 100 ′ are transmitted to the
outside of the earphone 50 through the through holes 516.
[0065]
The material of the outer case 510 is light and has a specific strength. For example, plastic or
resin. The size and shape of the outer case 510 can be selected as needed. The size of the outer
case 510 is the same as or larger than the size of the human ear, and covers the human ear. The
design of the outer case 510 may be a structural design applied to ergonomics.
[0066]
10-05-2019
22
Furthermore, the outer case 510 may include a protective cover 518. The protective cover 518 is
disposed between the sound generating assembly 500 and the front cover 112 and spaced apart
from the sound generating assembly 500. The protective cover 518 is connected to the front
cover 512 by a fixing element (not shown). Protective cover 518 has a plurality of openings (not
shown). The material of the protective cover 518 is not limited, and may be plastic or metal. The
protective cover 518 protects the plurality of loudspeakers 100 'and prevents dust and the like.
However, if necessary, the protective cover 518 may not be installed.
[0067]
Additionally, the earphone 50 includes a plurality of electrical leads 530. At least two leads are
provided for each loudspeaker 100 '. The plurality of conductors 530 are electrically connected
to the plurality of loudspeakers 100 'through the inside of the outer case 510 to transmit
frequency electrical signals to the plurality of loudspeakers 100'.
[0068]
Additionally, the earphone 50 may include a sponge cover (not shown). The sponge cover
reduces pressure on the ear by covering the outer case 510. Also, the earphone 50 may include a
microphone (not shown). The microphone is connected to the outer case 510 by a wire. The
earphone 50 may also include a wireless signal receiving unit (not shown). The wireless signal
reception unit is installed inside the outer case 510, and is electrically connected to the plurality
of loudspeakers 100 '. Thereby, the earphone 50 can receive the wireless signal.
[0069]
Referring to FIG. 16, a plurality of loudspeakers 100 'are mounted on the shared first surface
106' of the shared first substrate 101 '. The arrangement of the plurality of loudspeakers 100 'is
not limited as long as the sound generators 102 of the loudspeakers 100' are mutually isolated.
Thus, each loudspeaker 100 'can generate sound independently. In the present embodiment, the
number of loudspeakers 100 'is four, and the four loudspeakers 100' are installed on the shared
first surface 106 'of the shared first substrate 101' in a 2x2 manner. The earphone 50 can realize
excellent three-dimensional sound effects by a method of inputting different signals to the
plurality of loudspeakers 100 ', a method of adjusting the order of sound generation of the
10-05-2019
23
respective loudspeakers 100', or other methods. .
[0070]
A plurality of dividing lines 1010 are provided on the common first surface 106 'of the common
first substrate 101', and the common first surface 106 'forms a plurality of unit grids by the
plurality of dividing lines 1010. Do. A plurality of recesses 108 are formed in each unit grid. The
number of recesses 108 formed in the unit grid is not limited and can be selected as needed. In
this embodiment, four unit grids are formed on the shared first surface 106 'of the first substrate
101', and six recesses 108 are formed on each unit grid. The plurality of dividing lines 1010 may
be one or more of a through groove, a through hole, a blind groove, and a blind hole. In the
present embodiment, the plurality of dividing lines 1010 are blind grooves. When a plurality of
dividing lines 1010 are through grooves, it is necessary to ensure that two adjacent dividing lines
1010 do not intersect. This ensures that the first substrate 101 'is integrally formed. The
distribution of the dividing lines 1010 can be selected according to the area of the first substrate
101 'and the number and area of unit grids obtained. In the present embodiment, the plurality of
dividing lines 1010 in the first substrate 101 'are arranged in parallel to each other, or the
plurality of dividing lines 1010 are arranged in perpendicular to each other.
[0071]
The plurality of loudspeakers 100 ′ are fixed to the rear cover 514 of the outer case 510 by an
adhesive and fixing grooves. In the present embodiment, the plurality of loudspeakers 100 ′ are
fixed to the housing space of the rear cover 514 of the outer case 510 by the fixing groove 520.
The fixing groove 520 is formed by the outer case 510. The shape of the fixing groove 520 is not
limited. Preferably, the fixing groove 520 is a fixing groove in the storage space of the rear cover
514 of the outer case 510. A portion of the loudspeaker 100 ′ contacts the fixing groove 520,
and the other portion of the loudspeaker 100 ′ is suspended in the receiving space of the rear
cover 114. As a result, the loudspeaker 100 'has an excellent sound generation efficiency
because it has a large contact area with air or the surrounding medium and a high rate of heat
exchange.
[0072]
The material of the fixing groove 520 is an insulating material or a material having low
10-05-2019
24
conductivity. Specifically, a hard material or a soft material may be used. The hard material is, for
example, diamond, glass, ceramic or quartz. The soft material is, for example, a plastic, resin or
paper-like material. The material of the fixing groove 520 preferably has excellent thermal
insulation. As a result, the heat generated by the sound wave generator 102 is not absorbed by
the material of the fixed groove 520 and therefore does not affect the sound generation
efficiency.
[0073]
The earphone 50 of the present invention has the following advantages. First, the earphone
includes a plurality of loudspeakers, and implements a three-dimensional acoustic effect by
inputting different sound sources to the respective loudspeakers or adjusting the order of
generating the respective loudspeakers. Second, since the plurality of recesses and protrusions
are formed on the first substrate of each loudspeaker, the carbon nanotube structure can be
effectively protected, and an excellent acoustic effect can be realized.
[0074]
Example 6 Example 6 of the present invention provides an earphone 60. The earphone 60 of the
present embodiment includes an outer case 610 and a plurality of loudspeakers 200 '. The outer
case 610 has a receiving space, and a plurality of loudspeakers 200 'are received in the receiving
space.
[0075]
The structure of the earphone 60 of this embodiment is basically the same as the structure of the
earphone 50, except that the earphone 60 includes a plurality of loudspeakers 200 '.
[0076]
Example 7 Example 7 of the present invention provides an earphone 70.
The earphone 70 of this embodiment includes an outer case 710 and a plurality of loudspeakers
300 '. The outer case 710 has a receiving space, and a plurality of loudspeakers 300 'are
10-05-2019
25
received in the receiving space.
[0077]
The structure of the earphone 70 of this embodiment is basically the same as the structure of the
earphone 50, except that the earphone 70 includes a plurality of loudspeakers 300 '.
[0078]
Example 8 Example 8 of the present invention provides an earphone 80.
The earphone 80 of this embodiment includes an outer case 810 and a plurality of loudspeakers
400 '. The outer case 810 has a receiving space, and a plurality of loudspeakers 400 'are
received in the receiving space.
[0079]
The structure of the earphone 80 of this embodiment is basically the same as the structure of the
earphone 50, except that the earphone 80 includes a plurality of loudspeakers 400 '.
[0080]
Example 9 Referring to FIG. 17, Example 9 of the present invention provides an earphone 90.
The earphone 90 of this embodiment includes an outer case 910 and a plurality of loudspeakers
100 '. The outer case 910 has a receiving space, and a plurality of loudspeakers 100 'are
received in the receiving space.
[0081]
The structure of the earphone 90 of this embodiment is different from the structure of the
earphone 50 in the following points. In the earphone 90, a plurality of loudspeakers 100 'are
installed not at the same surface but at different angles with respect to the sound generation unit
10-05-2019
26
915. The plurality of loudspeakers 100 ′ do not adopt the common first substrate 101 ′, and
are respectively installed in the housing space of the outer case 910. The sound generating unit
915 is installed at a different angle. The angle is 0 ° to 180 ° (0 ° and 180 ° not included).
The plurality of loudspeakers 100 ′ are fixed at different positions of the housing space of the
outer case 910 by the fixing grooves 920. In the present embodiment, the fixing groove 920 has
a sound generating portion 915, a corresponding bottom surface (not shown), and two side
surfaces (not shown) adjacent to the bottom surface. At least one loudspeaker 100 'is installed on
the bottom surface and the two side surfaces. The loudspeakers 100 ′ installed on the bottom
and the two side surfaces are installed at different angles with respect to the sound generator
915. Also, the fixing groove 920 may have a plurality of faces, and at least one loudspeaker 100
'is installed on each face. The plurality of loudspeakers 100 ′ are installed at different angles
with respect to the sound generator 915. The plurality of loudspeakers 100 'respectively
generate sound independently, and by adjusting the plane on which the plurality of loudspeakers
100' are installed, the plurality of loudspeakers 100 'respectively form an angle different from
that of the sound generation unit 915. . This creates an excellent acoustic effect.
[0082]
Furthermore, the earphone 90 of the present embodiment may have a plurality of heat transfer
holes (not shown). The plurality of heat transfer holes are installed in the rear cover 914 of the
outer case 910. The shape and size of the heat transfer hole are not limited and can be selected
as needed. The heat transfer holes transmit the heat generated during operation of the sound
wave generator 102 to the outside, lower the operating temperature of the earphone 90, extend
the useful life of the earphone 90, and increase the work rate of the earphone 90.
[0083]
Tenth Embodiment Referring to FIGS. 18 and 19, an earphone 10 'of the present embodiment
includes an outer case 110' and an acoustic chip 10A. The outer case 110 'has a housing space,
and the acoustic chip 10A is housed in the housing space.
[0084]
The structure of the outer case 110 'is not limited, and may be integral molding or another
method if it has a space. In the present embodiment, the outer case 110 'includes a front cover
10-05-2019
27
112', a rear cover 114 ', and a through hole 116'. The through holes 116 'are formed in the front
cover 112'. The front cover 112 'and the rear cover 114' are tightly coupled to form an outer
case 110 '. The acoustic chip 10A can be disassembled because it is fixed to the outer case 110
'in a removable manner. Thereby, when the sound wave generator 102 breaks down, it is easy to
replace the acoustic chip 10A. The fixing position of the acoustic chip 10A is not limited as long
as it is installed in the outer case 110 'and opposed to the through hole 116'. Here, being
disposed opposite to the through hole 116 'means that the sound wave generator 102 in the
acoustic chip 10A is disposed opposite to the through hole 116'. In the present embodiment, the
acoustic chip 10A is fixed to the rear cover 114 'of the outer case 110' and spaced apart from
the front cover 112 'of the outer case 110'. Also, the acoustic chip 10A is installed opposite to
the through hole 116 'in the front cover 112' and at a distance from the through hole 116 '. The
sound generated by the acoustic chip 10A is transmitted to the outside of the earphone 10 'by
the through holes 116'.
[0085]
The material of the outer case 110 'is light in weight and has a specific strength. For example,
plastic or resin. The size and shape of the outer case 110 'can be selected as needed. The size of
the outer case 110 'is equal to or larger than the size of the human ear and covers the human
ear. The design of the outer case 110 'may be a structural design applied to ergonomics.
[0086]
Additionally, the earphone 10 'includes at least one lead 130'. The at least one lead 130 'is
electrically connected to the acoustic chip 10A through the inside of the outer case 110' to
transmit a frequency electrical signal to the acoustic chip 10A.
[0087]
Furthermore, the earphone 10 'of this embodiment may have a plurality of heat transfer holes
(not shown). The plurality of heat transfer holes are disposed in the rear cover 114 'of the outer
case 110'. The shape and size of the heat transfer hole are not limited and can be selected as
needed. The heat transfer holes transmit the heat generated during operation of the acoustic chip
10A to the outside, lower the operating temperature of the earphone 10 ', extend the service life
of the earphone 10', and increase the work rate of the earphone 10 ' Can.
10-05-2019
28
[0088]
The acoustic chip 10A includes a loudspeaker 100 'and a housing 200. The housing 200 has a
space, and the loudspeaker 100 'is accommodated in this space.
[0089]
In the loudspeaker 100 ′, the carbon nanotube structure included in the sound wave generator
102 is protected by the housing 200 so that the carbon nanotube structure is not broken by an
external force. The size and shape of the housing 200 are not limited and can be selected as
needed. The housing 200 has at least one aperture 210, which is spaced apart from the throughhole 116 'of the outer case 110' and by means of the aperture 210 the loudspeaker 100. The
sound generated by 'can be transmitted to the outside of the housing 200. The sound wave
generator 102 is preferably disposed between the first substrate 101 and the aperture 210 and
opposite the at least one aperture 210. In the present embodiment, the housing 200 includes a
third substrate 207 and a protective cover 204. The protective cover 204 is disposed on the
surface of the third substrate 207. The loudspeaker 100 'is mounted on the surface of the third
substrate 207, and the protective cover 204 covers the loudspeaker 100'. That is, the third
substrate 207 and the protective cover 204 form a space, and the loudspeaker 100 'is
accommodated in the space.
[0090]
The third substrate 207 is a glass plate, a ceramic plate, a printed circuit board (PCB), a polymer
plate or a wood plate. The third substrate 207 is used to support and secure the loudspeaker 100
'. The size and shape of the third substrate 207 are not limited and can be selected as needed.
The area of the third substrate 207 is larger than the size of the loudspeaker 100 ', and the area
is 36 mm <2> to 150 mm <2>, for example, 49 mm <2>, 64 mm <2>, 81 mm <2>, It is 100 mm
<2>. The thickness of the third substrate 207 is 0.5 mm to 5 mm, and is, for example, 1 mm, 2
mm, 3 mm, or 4 mm. Protective cover 204 includes an annular side wall 206 and a bottom wall
208. The bottom wall 208 has a plurality of the apertures 210. The size and shape of the
protective cover 204 are not limited and can be selected as needed. The size of the protective
cover 204 is slightly larger than the size of the loudspeaker 100 '. Also, the protective cover 204
is fixed to the surface of the third substrate 207 by an adhesive or a removable method. The
10-05-2019
29
material of the protective cover 204 is glass, ceramic, polymer or metal. In the present
embodiment, the third substrate 207 is a printed circuit board, and the protective cover 204 is a
metal bucket type whose one end is opened. The protective cover 204 and the loudspeaker 100
'are spaced apart from one another.
[0091]
The housing 200 has two pins 212, and the two pins 212 are installed outside the housing 200.
There is no limitation on the position of the two pins 212. The two pins 212 are electrically
connected to the first electrode 104 and the second electrode 105, respectively. Also, the two
pins 212 may be a pin grid array (PGA), a surface mount type (SMD) or other shape. When the
two pins 212 are a pin grid array, when installing the acoustic chip 10A in the electronic
component, the two pins 212 are directly inserted into the corresponding insertion holes in the
electrical circuit board of the electronic component. When the two pins 212 are surface
mounted, when installing the acoustic chip 10A to the electronic component, the two pins 212
are welded to the surface of the electrical circuit board of the electronic component. In the
present embodiment, the two pins 212 are a pin grid array, and are installed on the bottom
surface of the third substrate 207 opposite to the loudspeaker 100 ', and are respectively
connected to the first electrode 104 and the second electrode 105 by conducting wires.
Electrically connected.
[0092]
The acoustic chip 10A is fixed to the housing space of the outer case 110 'by an adhesive and a
groove structure. In the present embodiment, the acoustic chip 10A is fixed to the housing space
of the outer case 110 'by the fixing groove 120'. The fixing groove 120 'is integrally formed with
the outer case 110'. Although the shape of the fixing groove 120 'is not limited, preferably, the
fixing groove 120' is a fixing groove formed in the housing space of the outer case 110 '. A
portion of the acoustic chip 10A is in contact with the fixing groove 120 ', and the other portion
of the acoustic chip 10A is suspended in the housing space of the rear cover 114. As a result, the
contact area of the acoustic chip 10A with the air or the surrounding medium is increased, and
the speed of exchanging heat is also fast, so that it has excellent sound generation efficiency.
[0093]
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30
The material of the fixing groove 120 'is an insulating material or a material having low
conductivity. Specifically, a hard material or a soft material may be used. The hard material is, for
example, diamond, glass, ceramic or quartz. The soft material is, for example, a plastic, resin or
paper-like material. Preferably, the material of the fixing groove 120 'has excellent thermal
insulation. As a result, the heat generated by the sound wave generator 102 is not absorbed by
the material of the fixed groove 120 'and does not affect the sound generation efficiency.
[0094]
Example 11 The earphone 20 'of the present example includes an outer case 210' and an
acoustic chip 20A. The outer case 210 'has a housing space, and the acoustic chip 20A is housed
in the housing space.
[0095]
The structure of the acoustic chip 20A of the eleventh embodiment is different from the
structure of the acoustic chip 10A of the tenth embodiment in the following points. Referring to
FIG. 20, the housing 200 includes a third substrate 207 and a protection net 216, and the third
substrate 207 has a first recess 214. Specifically, the loudspeaker 100 ′ is installed in the first
recess 214 of the third substrate 207, and the protection net 216 covers the first recess 214.
The protective net 216 also has a plurality of apertures 210. The protective net 216 may be a
metal net or a fiber net. Alternatively, it may be a metal plate having a plurality of openings, a
ceramic plate, a resin plate or a glass plate. The protection net 216 is suspended and installed in
the first recess 214. The first recess 214 is manufactured by etching, imprinting, molding, and
stamping. In the present embodiment, the third substrate 207 is a printed circuit board, and the
protection net 216 is a metal net. Also, the housing 200 may have two pins 212, and the two
pins 212 may be installed on the same side or different sides of the bottom of the third substrate
207.
[0096]
Example 12 An earphone 30 'of this example includes an outer case 310' and an acoustic chip
30A. The outer case 310 'has a housing space, and the acoustic chip 30A is housed in the
housing space.
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[0097]
The structure of the acoustic chip 30A of the twelfth embodiment is different from the structure
of the acoustic chip 10A of the tenth embodiment in the following points. Referring to FIG. 21, a
loudspeaker 100 ′ includes a first electrode 104, a second electrode 105, and an acoustic wave
generator 102. Also, the housing 200 has two pins 212, which are surface mounted and are
respectively installed on both sides of the housing 200. Specifically, the first electrode 104 and
the second electrode 105 are directly installed on the surface of the third substrate 207, and the
sound wave generator 102 is suspended and installed by the first electrode 104 and the second
electrode 105. . That is, the loudspeaker 100 'can omit the first substrate 101. This makes the
structure of the earphone 30 'simpler, easier to produce and advantageous for industrialization.
[0098]
Example 13 The earphone 40 'of this example includes an outer case 410' and an acoustic chip
40A. The outer case 410 'has a housing space, and the acoustic chip 40A is housed in the
housing space.
[0099]
The structure of the acoustic chip 40A of the thirteenth embodiment is different from the
structure of the acoustic chip 20A of the eleventh embodiment in the following points. Referring
to FIG. 22, a loudspeaker 100 ′ includes a first electrode 104, a second electrode 105, and an
acoustic wave generator 102. Also, the housing 200 has two pins 212, which are surface
mounted and are respectively installed on both sides of the housing 200. Specifically, in the
present embodiment, the bottom surface of the first recess has one recess, by which the sound
wave generator 102 is suspended and installed. That is, the loudspeaker 100 'can omit the first
substrate 101. This further simplifies the structure of the earphone 40 '. The third substrate 207
is preferably an insulating substrate. In the present embodiment, the two pins 212 are attached
to the outer surface of the second substrate 202.
[0100]
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Example 14 The earphone 50 'of the present example includes an outer case 510' and an
acoustic chip 50A. The outer case 510 'has a housing space, and the acoustic chip 50A is housed
in the housing space.
[0101]
Comparing the structure of the acoustic chip 50A of the fourteenth embodiment with the
structure of the acoustic chip 20A of the eleventh embodiment, there are the following
differences. Referring to FIG. 23, the acoustic chip 50A includes an integrated circuit chip 201,
and the integrated circuit chip 201 is accommodated in the space of the housing 200.
Specifically, the first surface 106 of the first substrate 101 has a second recess 218, by which
the sound wave generator 102 is placed in a suspended manner. A third recess 220 is formed on
the second surface 107 of the first substrate 101, and the integrated circuit chip 201 is placed in
the third recess 220. The housing 200 has four pins 212, of which two pins 212 are electrically
connected to the integrated circuit chip 201. Thus, a driving voltage can be provided to the
integrated circuit chip 201. The other two pins 212 are electrically connected to the first
electrode 104 and the second electrode 105 through the integrated circuit chip 201 to input a
frequency electrical signal to the loudspeaker 100 '.
[0102]
For example, the integrated circuit chip 201 may be installed on the first surface 106 of the first
substrate 101, installed on the second surface 107, or installed inside the first substrate 101. .
The integrated circuit chip 201 includes a power amplification circuit (not shown) for frequency
electrical signals and a DC bias circuit (not shown). The integrated circuit chip 201 has a power
amplification function and a DC bias function with respect to the frequency electric signal. Thus,
the integrated circuit chip 201 can increase the frequency electric signal input and then input it
to the sound wave generator 102, and at the same time solve the frequency multiplication
problem of the frequency electric signal by the DC bias. Also, the integrated circuit chip 201 may
be a packaged chip or a non-packaged bare chip. The size and shape of the integrated circuit chip
201 are not limited. The integrated circuit chip 201 only realizes the power amplification action
and the DC bias action, so the internal circuit structure is simple and the area is smaller than 1
cm <2>, for example, 49 mm <2>, 25 mm <2 >, 9 mm <2> or even smaller than 9 mm <2>. Thus,
the acoustic chip 50A is miniaturized. In the present embodiment, the integrated circuit chip 201
is fixed in the third recess 220 of the first substrate 101 by an adhesive. In addition, the
integrated circuit chip 201 is electrically connected to the first electrode 104 and the second
electrode 105 by two leads 140 respectively. When the first substrate 101 is an insulating
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substrate, two holes are formed in the first substrate 101, and two conducting wires 140 are
passed through the two holes. When the first substrate 101 is a conductive substrate, it is
necessary to cover the conducting wire 140 with an insulating material. When the acoustic chip
50A is activated, the integrated circuit chip 201 outputs a frequency electric signal to the sound
wave generator 102, and the sound wave generator 102 intermittently heats the surrounding
medium by the output frequency electric signal and the surrounding The medium is thermally
expanded and heat exchanged to generate a sound wave.
[0103]
Example 15 An earphone 60 'of the present example includes an outer case 610' and an acoustic
chip 60A. The outer case 610 'has a housing space, and the acoustic chip 60A is housed in the
housing space.
[0104]
Comparing the structure of the acoustic chip 60A of the fifteenth embodiment with the structure
of the acoustic chip 50A of the fourteenth embodiment, there are the following differences.
Referring to FIG. 24, the first substrate 101 is made of silicon, and the integrated circuit chip 201
is directly installed on the first substrate 101 by microelectronic processing and integrally
molded with the first substrate 101. The structure of the loudspeaker in the acoustic chip 60A is
the same as that of the loudspeaker 200 'of the second embodiment. A plurality of recesses 108
and a plurality of protrusions 109 are formed on the first surface 106 of the first substrate 101,
and the loudspeaker 100 'in the acoustic chip 60A includes a plurality of first electrodes 104 and
a plurality of second electrodes 105. .
[0105]
The earphone of the present invention has the following advantages. The sound wave generator
is installed in the housing to form an acoustic chip, so that if the acoustic chip of the earphone
fails, the acoustic chip can be easily replaced and the useful life of the earphone can be extended.
[0106]
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10, 20, 30, 40, 50, 60, 70, 80, 90, 10 ', 20', 30 '40', 50 ', 60' earphones 10A, 20A, 30A, 40A,
50A, 60A acoustic chips 100 ' , 200 ', 300', 400 'loudspeaker 101 first substrate 101' common
first substrate 102 acoustic wave generator 103 insulating layer 104 first electrode 105 second
electrode 106 first surface 106 'common first surface 107 second surface 108 recess 109
protrusion 1010 dividing line 1020 first area 1021 second area 110, 210, 310, 410, 510, 610,
710, 810, 910, 110 ′, 210 ′, 210 ′, 310 ′, 410 ′, 510 ′, 610 ′ Outer case 112, 512,
912, 112 'front cover 114, 514, 914, 114' rear cover 116, 5 16, 916, 116 'through hole 118,
204, 518, 918 protective cover 120, 520, 920, 120' fixing groove 130, 530, 130 ', 140 lead 201
integrated circuit chip 202 heat dissipation element 2020 second substrate 2021 heat
dissipation fin 200 case 206 annular side wall 207 third substrate 208 bottom wall 210 opening
212 pin 214 first recess 216 protection net 218 second recess 220 third recess 500 sound
generating assembly 515, 915 sound generating portion
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