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JP2012051370

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DESCRIPTION JP2012051370
A plate member supporting apparatus having a structure in which a plate member having a
curved surface shape is supported without being limited by the material of the plate member and
the material of the members other than the plate member. An apparatus and a method of
manufacturing the same are provided. An assembly in which a plate member (14) is temporarily
fixed so as to cover an opening (12x) of a housing member (12) by an uncured joining member
(16) on at least a part of a main surface of the housing member (12) Heating is performed while
keeping the pressure inside the space 11 and the pressure outside the space in equilibrium. Next,
the assembly is cooled in a state where the space 11 of the housing member 12 is sealed, the
pressure inside the space 11 of the housing member 12 is reduced, and the plate member 14 is
recessed toward the space 11 of the housing member 12 Transform it. Next, with the plate
member 14 deformed, the bonding member 16 is cured to fix the plate member 14 to the
housing member 12. [Selected figure] Figure 2
Plate member supporting device and method of manufacturing the same
[0001]
The present invention relates to a plate member supporting device having a structure in which a
plate member is supported and an optical element such as a piezoelectric device such as a
piezoelectric microphone or a lens, and a method of manufacturing the same. The present
invention relates to a plate member supporting device having a curved shape and a method of
manufacturing the same.
[0002]
Conventionally, various methods have been proposed for manufacturing a plate member
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supporting device in which the plate member has a curved surface shape.
[0003]
For example, according to the manufacturing method disclosed in Patent Document 1, the air in
the concave portion is made lower than the atmospheric pressure in a state in which the member
having the concave portion formed on the lower surface is in close contact with the upper
surface of the uncured ultraviolet curable resin. And forming a recess on the upper surface of the
uncured ultraviolet curable resin, curing the ultraviolet curable resin by irradiating the ultraviolet
light, and releasing the member on which the recess is formed. It is a manufacturing method of
optical elements, such as a micro lens.
[0004]
In addition, according to the manufacturing method disclosed in Patent Document 2, a lid having
an air blowing hole is provided after a ceramic green sheet is disposed on a mold having a
hemispherical concave portion and an air suction hole so as to cover the concave portion.
Covering the mold in the step of forming the ceramic green sheet into a curved shape along the
recess of the mold by air pressure by blowing high pressure air from the air blowing hole in a
state covered with the lid; It is a manufacturing method of piezoelectric devices, such as a
piezoelectric sensor, which has the process of baking after taking out a green sheet from a
metallic mold.
[0005]
Japanese Patent Laid-Open Publication No. 2001-315217 Japanese Patent Laid-open Publication
No. 4-198827
[0006]
In a plate member supporting device that detects light, sound waves, etc. like a piezoelectric
device such as a piezoelectric microphone or an optical element such as a lens, the directivity
angle can be broadened by forming a thin plate member made of ceramics or resin into a curved
shape. You can increase the sensitivity.
Then, it is possible to produce the board member which has curved surface shape.
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[0007]
However, the manufacturing method disclosed in Patent Document 1 is limited to those in which
the material of the plate member has photocurability.
Further, since the manufacturing method disclosed in Patent Document 2 uses the sintering
method, the material of the plate member is limited to the ceramic, and the material of the
member other than the plate member is the sintering temperature of the plate member made of
ceramic. It is limited to what can withstand.
[0008]
In the present invention, in view of such circumstances, the material of the plate member is not
limited to those having photo-curing properties or ceramics, and the material of members other
than the plate member is not limited to those capable of withstanding high temperature; It is an
object of the present invention to provide a plate member supporting device and a method of
manufacturing the same, which can manufacture a plate member supporting device having a
structure in which a plate member having a shape is supported.
[0009]
In order to solve the above-mentioned subject, the present invention provides the manufacturing
method of the board member support device constituted as follows.
[0010]
In the method of manufacturing a plate member supporting device, a housing member in which
an opening is formed on at least one main surface and a space communicating with the opening
is formed inside, a plate member covering the opening of the housing member, and the main
surface of the housing member And a bonding member for bonding the plate members, and the
plate member supporting device is fixed to the housing member by the bonding members in a
state in which the plate members are deformed.
According to a method of manufacturing a plate member supporting apparatus, an assembly in
which a plate member is temporarily fixed so as to cover an opening of the housing member by
at least a part of the main surface of the housing member by an uncured joining member The
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first step of heating while maintaining the pressure inside the space and the pressure outside the
space, and cooling the assembly while sealing the space of the housing member, the inside of the
space of the housing member The second step of reducing the pressure of the plate member and
deforming the plate member into a concave shape toward the space of the housing member, and
curing the bonding member to fix the plate member to the housing member while the plate
member is deformed And a third step.
[0011]
According to the above manufacturing method, the pressure in the space inside the housing
member is controlled by heating and cooling the assembly to deform the plate member, and then
the bonding member is cured to fix the plate member to the housing member .
After the bonding member is cured, the plate member holds the curved surface due to the
deformation even if the internal space of the housing member communicates with the outside.
The material of the plate member is not limited to those having photo-curing property or
ceramics.
Moreover, the material of members other than a plate member is not limited to what can endure
high temperature.
[0012]
Preferably, the bonding member is made of a material having a glass transition temperature, and
in the first step, the assembly is heated to be higher than the glass transition temperature of the
bonding member.
In the second step, the assembly is cooled to a temperature lower than the glass transition
temperature of the bonding member.
[0013]
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In this case, the plate member can be easily deformed in the second step. Also, the plate member
can be easily fixed to the housing member in the third step.
[0014]
Preferably, the bonding member contains a thermosetting resin.
[0015]
In this case, it is easy to cure the joint member after heating and cooling the assembly.
[0016]
Preferably, the plate member is provided with a gap between a rectangular first portion and a
pair of opposing sides of the first portion, and a second portion disposed on both sides of the
first portion, and a first portion And a sealing member disposed in a gap between the second
portion and the second portion.
The sealing member seals the gap between the first portion and the second portion until the
deformation of the first portion reaches a predetermined size, while the deformation of the first
portion exceeds the predetermined size. , And is configured to release the seal of the gap between
the first portion and the second portion.
The sealing member keeps the pressure inside the space of the housing member and the
pressure outside in the first step in equilibrium, and in the second step, the sealing member is
between the first portion and the second portion. Seal.
[0017]
In this case, control of pressure and sealing of the space inside the housing member is easy.
[0018]
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Preferably, the housing member has a communicating portion for communicating the space of
the housing member with the outside.
In the first step, with the heating, the gas in the space of the housing member is exhausted from
the communicating portion. In the second step, the space for the housing member is sealed by
filling the sealing member into the communication portion and sealing the communication
portion.
[0019]
In this case, control of pressure and sealing of the space inside the housing member is easy.
[0020]
Preferably, the sealing member is made of silicone gel.
[0021]
Silicone gel is suitable for a sealing member because it has heat resistance and is easily
deformed.
[0022]
Preferably, the plate member is made of piezoelectric ceramic.
[0023]
In this case, it is possible to provide a piezoelectric microphone or the like in which the
directivity angle is increased or the sensitivity is increased by the curved surface of the plate
member made of piezoelectric ceramic.
[0024]
Moreover, this invention provides the plate member support apparatus comprised as follows, in
order to solve the said subject.
[0025]
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The plate member supporting device has a housing member in which an opening is formed on at
least one main surface and a space communicating with the opening is formed inside, a plate
member covering the opening of the housing member, and a plate member on the main surface
of the housing member And a joining member for joining the
The joining member holds a state in which the plate member is deformed into a concave shape
on the space side of the housing member.
[0026]
In the above configuration, since the plate member is deformed in a concave shape toward the
space side of the housing member, stress is applied to the plate member, so the plate member
can easily maintain the curved shape.
[0027]
In the above configuration, the plate member is deformed so as to be recessed toward the space
inside the housing member, so the plate member is unlikely to be broken.
[0028]
Preferably, the bonding member is made of a material having a glass transition temperature.
The glass transition temperature of the bonding member is lower than the temperature at which
the plate member can not be kept softened and deformed.
[0029]
According to the above configuration, after deforming the plate member at a temperature higher
than the glass transition temperature of the bonding member, the plate member is lowered to a
temperature lower than the glass transition temperature of the bonding member while
maintaining the deformed state. By curing the plate, it is possible to hold the plate member in a
deformed state by the joining member.
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The curved shape of the plate member can be formed by using the glass transition temperature
of the bonding member to soften and cure the bonding member by raising and lowering the
temperature, and the material of the plate member is not limited.
[0030]
Preferably, the joining member extends between the housing member and the plate member so
as to surround the opening of the housing member to keep the space of the housing member
airtight.
[0031]
In this case, the airtightness of the space inside the housing member is maintained by the joining
member.
[0032]
According to the present invention, the material of the plate member is not limited to those
having photo-curing property or ceramics, and the material of members other than the plate
member is not limited to those that can withstand high temperature, and has a curved shape. A
plate member supporting device having a structure in which the plate member is supported can
be manufactured.
[0033]
It is sectional drawing of the plate member support apparatus which concerns on Example 1 of
this invention.
It is sectional drawing which shows the manufacturing process of the board member support
apparatus which concerns on Example 1 of this invention.
It is a disassembled perspective view of the board member support apparatus which concerns on
Example 2 of this invention.
It is principal part sectional drawing of the plate member support apparatus which concerns on
Example 2 of this invention.
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It is a disassembled perspective view of the board member support apparatus which concerns on
Example 3 of this invention.
It is a disassembled perspective view of the board member support apparatus which concerns on
Example 4 of this invention.
[0034]
Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to
6.
[0035]
Example 1 A method of manufacturing a plate member supporting device of Example 1 will be
described with reference to FIGS. 1 and 2.
[0036]
FIG. 1 is a cross-sectional view schematically showing the configuration of the plate member
support device 10 of the first embodiment.
[0037]
The plate member support device 10 includes a housing member 12, a plate member 14, and a
joining member 16.
[0038]
The housing member 12 has an opening 12x formed in one main surface.
Inside the housing member 12, a space 11 communicating with the opening 12x is formed.
That is, the housing member 12 has a recess.
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A plate member 14 is joined to the housing member 12 by a joining member 16 so as to cover
the opening 12x.
The plate member 14 is made of ceramic or resin.
The joint member 16 extends between the housing member 12 and the plate member 14 so as to
surround the opening 12 x to keep the space 11 of the housing member 12 airtight.
The bonding member 16 is an adhesive made of a thermosetting resin such as an epoxy resin.
In the space 11, a gas, for example air, is present. The housing member 12 has a pipe that
communicates the space 11 with the outside. That is, the pipe is a communicating portion. The
piping is provided with a fluid valve (gas valve), for example, an air valve 18. When the air valve
18 is closed, the space 11 inside the housing member 12 is sealed.
[0039]
Next, a method of manufacturing the plate member support device 10 will be described with
reference to FIG. FIG. 2 is a cross-sectional view schematically showing a manufacturing process
of the plate member support device 10. In FIG. 2, the drawing of the piping and the air valve 18
is omitted.
[0040]
First, as shown in FIG. 2A, the flat plate member 14 is temporarily fixed to the housing member
12 by the bonding member 16 so as to cover the opening 12 x of the housing member 12. Thus,
the assembly is constructed.
[0041]
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The assembly is then heated. At this time, heating is performed at a temperature higher than the
glass transition point of the bonding member 16. That is, the bonding member 16 is softened by
exceeding the glass transition temperature by heating. The temperature at this time is such that
the plate member 14 can keep its deformation and is lower than the temperature at which the
bonding member 16 carbonizes.
[0042]
At the moment when the assembly is heated, the air in the space 11 expands and the pressure in
the space 11 of the housing member 12 increases, so the plate member 14 may be deformed as
shown in FIG. . Specifically, the plate member 14 is deformed so that the central portion of the
plate member 14 protrudes to the upper surface side of the assembly. Therefore, during heating
of the assembly, part of the air in the space 11 is exhausted from the piping to the outside by
opening the air valve 18 (see FIG. 1). As a result, the pressure inside the space 11 of the housing
member 12 and the pressure outside the housing member 12 are in equilibrium, and as shown in
FIG. 2C, the plate member 14 returns to a flat plate shape.
[0043]
Then, with the air valve 18 (see FIG. 1) closed and the space 11 of the housing member 12
sealed, the assembly is cooled to a temperature lower than the glass transition point of the
bonding member 16. Specifically, it cools to normal temperature. Because part of the air in the
space 11 is exhausted from the piping during heating of the assembly, the amount of air in the
space 11 is smaller than that before heating. Therefore, the air in the space 11 shrinks due to the
cooling, and the pressure in the space 11 of the housing member 12 decreases, so that the plate
member 14 is deformed as shown in FIG. Specifically, the plate member 14 is deformed so that
the central portion of the plate member 14 protrudes to the lower surface side of the assembly.
In other words, the plate member 14 is deformed into a shape recessed toward the space 11 of
the housing member 12.
[0044]
At this time, since the bonding member 16 is softened until reaching the temperature below the
glass transition point, the restraint force on the plate member 14 is weak, and the plate member
14 is easily deformed. The bonding member 16 then flows along the deformed plate member 14
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and maintains the seal between the plate member 14 and the housing member 12.
[0045]
When time passes further after the assembly is cooled, the bonding member 16 is cured in a
state where the plate member 14 is deformed. As a result, as shown in FIG. 2 (e), the joining
member 16 fixes the plate member 14 while the plate member 14 is deformed, and the plate
member 14 is recessed toward the space 11 of the housing member 12. Hold. That is, the plate
member 14 is fixed to and supported by the housing member 12 in a state of having a curved
surface shape by deformation. Thus, the plate member 14 is joined to the housing member 12.
[0046]
After the bonding member 16 is cured, the air valve 18 (see FIG. 1) is opened, and the plate
member 14 holds the curved surface due to deformation even if the space 11 is communicated
with the outside by piping.
[0047]
When the plate member support device 10 is manufactured by the above manufacturing method,
the material of the plate member 14 is not limited to those having photo-curing property or
ceramics.
Moreover, the material of members other than a plate member is not limited to what can endure
high temperature.
[0048]
Further, the pressure inside the space 11 of the housing member 12 is changed by adjusting the
heating temperature of the assembly or adjusting the amount of air in the space 11 of the
housing member 12 by the air valve 18, The amount of deformation of the plate member 14 can
be easily controlled.
[0049]
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In order to deform the plate member 14 by equalizing the distribution of the pressure acting on
the plate member 14 using the pressure difference between the pressure inside the space 11 of
the housing member 12 and the external pressure, the curved shape of the plate member 14
Variation is small.
Further, cracking of the plate member due to stress concentration is less likely to occur
compared to a method of deforming a part of the plate member by applying a local load from the
outside by means of a projecting member.
[0050]
When the plate member support device 10 detects light or sound waves as in a piezoelectric
device such as a piezoelectric microphone or an optical element such as a lens, light is supported
by supporting the plate member 14 in a curved surface shape. , Sound waves etc. can be detected
at a wide directional angle, and the sensitivity can be increased. Further, the sensitivity can be
improved by the presence of the initial stress in the state of the curved surface shape.
[0051]
Example 2 A method of manufacturing the plate member support device 10k of Example 2 will
be described with reference to FIGS. 3 and 4. The plate member support device 10k of the
second embodiment is a piezoelectric microphone.
[0052]
FIG. 3 is an exploded perspective view showing the configuration of a plate member support
device 10k of the second embodiment. As shown in FIG. 3, the plate member support device 10 k
includes frame members 42 and 44, plate members 20 and 30, and bonding members 52, 54
and 56. The frame members 42 and 44 are frame-like members having openings 42x and 42y;
44x and 44y at the top and bottom, respectively.
[0053]
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The plate member 20 includes a first portion 22, a second portion 24 and a sealing member 26.
The first portion 22 has a rectangular shape. The second portion 24 is disposed on both sides of
the first portion 22 with a gap provided between the pair of opposing sides of the first portion
22. The sealing member 26 is disposed between the first portion 22 and the second portion 24.
The plate member 30 also includes a first portion 32, a second portion 34, and a sealing member
36. The first portion 32 has a rectangular shape. The second portion 34 is disposed on both sides
of the first portion 32 with a gap provided between the pair of opposing sides of the first portion
32. The sealing member 36 is disposed in the gap between the first portion 32 and the second
portion 34. Electrodes (not shown) are formed on the plate members 20 and 30.
[0054]
The frame member 42 is a housing member. The frame member 42 has openings 42x and 42y
formed on both main surfaces. Inside the frame member 42, a space 11k communicating with
the openings 42x and 42y is formed. That is, the frame member 42 has a through hole. The plate
members 20 and 30 are joined to the frame member 42 by joining members 52 and 54 so as to
cover the openings 42x and 42y. For this reason, the space 11k inside the frame member 42 is
sealed. In the space 11k, a gas such as air is present.
[0055]
The frame member 44 is provided such that the lower plate member 30 floats from the
periphery when the plate member support device 10k is installed. The plate member 30 is joined
to the frame member 44 by the joining member 56 so as to cover the opening 44x. A
configuration without the frame member 44 and the joining member 56 is also possible.
[0056]
For example, the plate members 20 and 30 are flat. The first parts 22 and 32 and the second
parts 24 and 34 are made of ceramics, and the sealing members 26 and 36 are made of silicone
gel. Silicone gel is suitable for the sealing members 26 and 36 because it has heat resistance and
is easily deformed. The sealing members 26 and 36 are more rigid than the first portions 22 and
32 and the second portions 24 and 34 so that the Young's modulus is 1 MPa or more and the
04-05-2019
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restraint force against the deformation of the first portions 22 and 32 is reduced. Those having a
low (Young's modulus) are preferred. The plate members 20 and 30 are formed after forming the
first portions 22 and 32 and the second portions 24 and 34 by forming grooves of 10 μm to 40
μm in width in the fired piezoelectric ceramic plate having a thickness of 10 μm to 100 μm. ,
By filling the sealing members 26, 36 in the grooves.
[0057]
The bonding members 52, 54, and 56 are adhesives made of thermosetting resin such as epoxy
resin. It is preferable that the bonding members 52, 54, and 56 have a Young's modulus smaller
by 2 digits or more at a glass transition temperature (20 ° C. to 100 ° C.).
[0058]
The plate member supporting device 10k can be manufactured in the same manner as in the first
embodiment. Next, a method of manufacturing the plate member support device 10k will be
described with reference to FIG. FIG. 4 is an enlarged sectional view of an essential part
schematically showing a manufacturing process of the plate member supporting device 10k.
[0059]
First, the plate members 20 and 30 are temporarily fixed to the frame member 42 by the joining
members 52 and 54 so as to cover the openings 42 x and 42 y of the frame member 42. The
plate member 30 is temporarily fixed to the frame member 44 by the bonding member 56. Thus,
the assembly is constructed.
[0060]
At this time, as shown in FIG. 4A, the plate members 20 and 30 are flat and sealed by the sealing
members 26 and 36.
[0061]
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The assembly is then heated.
At this time, heating is performed at a temperature higher than the glass transition point of the
bonding members 52, 54, and 56. That is, by heating, the bonding members 52, 54, 56 are
softened by exceeding the glass transition point. The temperature at this time is a temperature at
which the plate members 20 and 30 can keep their deformation and is lower than the
temperature at which the bonding members 52, 54 and 56 carbonize. By heating, the air in the
space 11k expands and the pressure in the space 11k of the frame member 42 becomes high, so
that the plate members 20 and 30 are deformed. At this time, the sealing members 26 and 36 of
the plate members 20 and 30 function as relief valves, and the pressure inside the space 11k of
the frame member 42 and the external pressure are in an equilibrium state.
[0062]
That is, when the pressure in the space 11k of the frame member 42 rises due to heating, the
plate members 20 and 30 expand the first portions 22 and 32 outward by the internal pressure
shown by the arrow 13b in FIG. The first part 22, 32 is displaced relative to the second part 24,
34. If the pressure inside the space 11k is small and the positional deviation of the first portions
22 and 32 relative to the second portions 24 and 34 is small, deformation of the sealing
members 26 and 36 causes the first portions 22 and 32 and the second portion 24 to , 34 are
kept sealed.
[0063]
As shown by the arrow 13c in FIG. 4C, as the internal pressure increases, the deformation of the
first portions 22 and 32 further increases, and the positional deviation of the first portions 22
and 32 with respect to the second portions 24 and 34 An oversized portion occurs, and the
sealing members 26 and 36 can not seal the gap between the first portions 22 and 32 and the
second portions 24 and 34. Therefore, as shown by arrow 13x, a part of the air in space 11k of
frame member 42 is discharged to the outside through the gap between first portions 22 and 32
and second portions 24 and 34. .
[0064]
By partially discharging the air in the space 11k of the frame member 42, when the internal
pressure decreases as shown by the arrow 13d in FIG. 4D, the deformation of the first portions
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22 and 32 is reduced. The sealing members 26, 36 again seal the gap between the first portions
22, 32 and the second portions 24, 34.
[0065]
Then, the assembly is cooled to a temperature lower than the glass transition temperature of the
bonding members 52, 54, 56.
Specifically, it cools to normal temperature. The amount of air in space 11k is reduced by
discharging a part of the air in space 11k from the gap between first portion 22, 32 and second
portions 24, 34 during heating of the assembly. It is less than before heating. Therefore, the air
in the space 11k is shrunk by the cooling, and the pressure in the space 11k of the frame
member 42 is lowered, so that the plate members 20 and 30 are deformed. Specifically, the plate
members 20 and 30 are deformed so that the first portions 22 and 32 of the plate members 20
and 30 project to the space 11 side. In other words, the plate members 20 and 30 deform into a
shape that is recessed toward the space 11 k side of the frame member 42.
[0066]
At this time as well, since the sealing members 26 and 36 of the plate members 20 and 30
function as relief valves, the deformation of the first portions 22 and 32 is achieved by the
sealing members 26 and 36 having the first portions 22 and 32 and the second It is in the range
which can seal between the parts 24 and 34.
[0067]
When time passes further after the assembly is cooled, the bonding members 52, 54, 56 are
cured in a state where the plate members 20, 30 are deformed.
Thereby, the joining members 52, 54, and 56 fix the plate members 20 and 30 while the plate
members 20 and 30 are deformed, and the plate members 20 and 30 are recessed toward the
space 11k of the frame member 42. Hold. That is, the plate members 20 and 30 are fixed to and
supported by the frame members 42 and 44 in a state of having a curved surface shape due to
the deformation of the first portions 22 and 32. Thus, the plate members 20 and 30 are joined to
the frame members 42 and 44.
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[0068]
When the plate member supporting device 10k is manufactured by the above manufacturing
method, the material of the plate members 20 and 30 is not limited to those having photo-curing
property or ceramics. Moreover, the material of members other than a plate member is not
limited to what can endure high temperature. Further, since the sealing members 26 and 36 of
the plate members 20 and 30 function as relief valves, control of the pressure and sealing of the
space 11k is easy.
[0069]
When the bonding members 52, 54, and 56 are made of a thermosetting resin, it is easy to cure
the bonding members 52, 54, and 56 after the assembly is heated and cooled.
[0070]
For example, the plate members 20 and 30 are made of piezoelectric ceramics having a thickness
of 30 μm, the frame members 42 and 44 are made of dielectric ceramics having a thickness of
0.2 mm, and the bonding members 52, 54 and 56 have a thickness of 20 μm and a glass
transition point of 30 °. C, using an adhesive made of a thermosetting resin such as epoxy resin,
which lowers the Young's modulus from 3600 MPa to 4 MPa when the temperature is higher
than the glass transition point, using the first portion 22, 32 and the second portion of the plate
members 20, 30 When the width of the gap between 24 and 34 is 10 μm and the heating
temperature of the assembly is 260 ° C., the amount of deformation at the center of the first
portions 22 and 32 of the plate members 20 and 30 is 10 μm.
[0071]
The first portions 22 and 32 of the plate members 20 and 30 are rectangular, and only a pair of
opposite sides are fixed to the frame member 42, and the other pair of sides are in contact with
the low rigidity sealing members 26 and 36 Because it is easy to deform.
Therefore, when electrodes are formed on the front and back surfaces of the first portions 22
and 32 so as to detect displacement of the first portions 22 and 32, a piezoelectric microphone
with high sensitivity can be provided.
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[0072]
Example 3 A method of manufacturing the plate member support device 10 a of Example 3 will
be described with reference to FIG. 5.
[0073]
FIG. 5 is an exploded perspective view showing the configuration of the plate member support
device 10a of the third embodiment.
As shown in FIG. 5, the plate member support device 10a includes a housing member 12a, a
plate member 14a, and a joining member 16a.
The housing member 12a has an opening 12x formed in one main surface. A space 11a
communicating with the opening 12x is formed in the housing member 12a. That is, the housing
member 12a has a cylindrical shape having a recess. A plate member 14a is joined to the upper
surface 12s of the housing member 12a by a joining member 16a so as to cover the opening
12x. The plate member 14a has a disk shape and is made of ceramic or resin. The bonding
member 16 a is an adhesive made of a thermosetting resin such as an epoxy resin. In the space
11a, a gas such as air is present. The housing member 12a has an air hole 17a for
communicating the space 11a with the outside. That is, the air holes 17a are communication
parts. The air hole 17a is sealed by the sealing member 18a. The space 11a inside the housing
member 12a is sealed by the sealing member 18a.
[0074]
Next, a method of manufacturing the plate member support device 10a will be described.
[0075]
First, the flat plate member 14a is temporarily fixed to the upper surface 12s of the housing
member 12a by the joining member 16a so as to cover the opening 12x of the housing member
12a.
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Thus, the assembly is constructed. The assembly is then heated. At this time, heating is
performed at a temperature higher than the glass transition point of the bonding member 16a.
That is, the bonding member 16a is softened by exceeding the glass transition point by heating.
The temperature at this time is such that the plate member 14a can keep its deformation and is
lower than the temperature at which the bonding member 16a carbonizes. The heating expands
the air in the space 11a, but a part of the air in the space 11a is discharged from the air holes
17a. As a result, the pressure inside the space 11a of the housing member 12a and the external
pressure are in equilibrium, and the plate member 14a is not deformed.
[0076]
After heating the assembly, the air holes 17a of the housing member 12a are filled with silicone
gel as a sealing member 18a and sealed. Then, the assembly is cooled to a temperature lower
than the glass transition point of the bonding member 16a. Specifically, it cools to normal
temperature. Since part of the air in the space 11a is discharged to the outside from the air holes
17a during heating of the assembly, the amount of air in the space 11a is smaller than that
before heating. Therefore, the air in the space 11a is contracted due to the cooling, and the
pressure in the space 11a of the housing member 12a is reduced, so that the plate member 14a
is deformed. Specifically, the plate member 14a is deformed so that the central portion of the
plate member 14a protrudes to the lower surface side of the assembly. In other words, the plate
member 14a is deformed into a dome-like curved surface shape recessed toward the space 11a
of the housing member 12a.
[0077]
When time passes further after the assembly is cooled, the bonding member 16a is cured in a
state in which the plate member 14a is deformed. Thus, the bonding member 16a fixes the plate
member 14a while keeping the shape of the plate member 14a deformed, and holds the shape of
the plate member 14a recessed toward the space 11a of the housing member 12a. That is, the
plate member 14a is fixed to and supported by the housing member 12a in a state of having a
curved surface shape by deformation. Thus, the plate member 14a is joined to the housing
member 12a.
[0078]
Thereafter, even if the sealing member 18a is removed from the air hole 17a and the space 11a
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is communicated with the outside by the air hole 17a, the plate member 14a maintains the domeshaped curved surface.
[0079]
When the plate member support device 10a is manufactured by the above manufacturing
method, the material of the plate member 14a is not limited to those having photo-curing
property or ceramics.
Moreover, the material of members other than a plate member is not limited to what can endure
high temperature. In order to deform the plate member 14a by equalizing the distribution of the
pressure acting on the plate member 14a by utilizing the pressure difference between the
pressure inside the space 11a of the housing member 12a and the pressure outside the space,
the dome shape of the plate member 14a The variation of the curved surface shape is small.
When the plate member support device 10a detects light or sound waves as in a piezoelectric
device such as a piezoelectric microphone or an optical element such as a lens, light is supported
by supporting the plate member 14a in a curved surface shape. , Sound waves etc. can be
detected at a wide directional angle, and the sensitivity can be increased. Further, the sensitivity
can be improved by the presence of the initial stress in the state of the curved surface shape.
[0080]
Example 4 A method of manufacturing the plate member supporting device 10b of Example 4
will be described with reference to FIG.
[0081]
FIG. 6 is an exploded perspective view showing the configuration of the plate member support
device 10b of the fourth embodiment.
As shown in FIG. 6, the plate member support device 10b includes a housing member 12b, a
plate member 14b, and a bonding member 16b. The housing member 12b has a plurality of
openings 12y formed in one main surface. A space 11b communicating with the opening 12y is
formed in the housing member 12b. That is, the housing member 12b has a plurality of recesses.
A plate member 14b is joined to the upper surface 12t of the housing member 12b by a joining
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member 16b so as to cover the opening 12y. The plate member 14 b is made of ceramic or resin.
[0082]
The bonding member 16 b is an adhesive made of a thermosetting resin such as an epoxy resin.
The bonding members 16b are illustrated in a simplified manner in a frame shape, but in practice
are arranged around the openings 12y so that the spaces 11b are separated from each other. In
the space 11b, a gas such as air is present.
[0083]
Although only partially shown, the housing member 12b has an air hole 17b which
communicates the space 11b with the outside. That is, the air hole 17b is a communicating
portion. The air holes 17b are formed in each of the plurality of recesses of the housing member
12b. The air hole 17b is sealed by the sealing member 18b. The space 11b inside the housing
member 12b is sealed by the sealing member 18b.
[0084]
The plate member supporting device 10b is manufactured in the same manner as in the third
embodiment. A method of manufacturing the plate member support device 10b will be described.
[0085]
First, the flat plate member 14b is temporarily fixed to the upper surface 12t of the housing
member 12b by the bonding member 16b so as to cover the opening 12y of the housing member
12b. Thus, the assembly is constructed. The assembly is then heated. At this time, heating is
performed at a temperature higher than the glass transition point of the bonding member 16b.
That is, the bonding member 16b is softened by exceeding the glass transition point by heating.
The temperature at this time is such that the plate member 14b can keep its deformation and is
lower than the temperature at which the bonding member 16b carbonizes. The heating expands
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the air in the space 11b, but a part of the air in the space 11b is discharged from the air holes
17b. As a result, the pressure in the space 11b of the housing member 12b and the pressure in
the outside are in equilibrium, and the plate member 14b is not deformed.
[0086]
After heating the assembly, the air holes 17b of the housing member 12b are filled with silicone
gel as a sealing member 18b and sealed. Then, the assembly is cooled to a temperature lower
than the glass transition point of the bonding member 16b. Specifically, it cools to normal
temperature. Since part of the air in the space 11b is discharged to the outside from the air holes
17b during heating of the assembly, the amount of air in the space 11b is smaller than that
before heating. Therefore, the air in the space 11b is contracted due to the cooling, and the
pressure in the space 11b of the housing member 12b is reduced, so that the plate member 14b
is deformed. Specifically, the plate member 14b is deformed so that the central portion of the
plate member 14b protrudes to the lower surface side of the assembly. In other words, the plate
member 14b is deformed into a dome-like curved surface shape which is recessed toward the
space 11b of the housing member 12b.
[0087]
When time passes further after the assembly is cooled, the bonding member 16b is cured in a
state in which the plate member 14b is deformed. Thus, the bonding member 16b fixes the plate
member 14b while keeping the shape of the plate member 14b deformed, and holds the shape of
the plate member 14b recessed toward the space 11b of the housing member 12b. That is, the
plate member 14b is fixed to and supported by the housing member 12b in a state of having a
curved surface shape by deformation. Thus, the plate member 14b is joined to the housing
member 12b.
[0088]
Thereafter, even if the sealing member 18b is removed from the air hole 17b and the space 11b
is communicated with the outside by the air hole 17b, the plate member 14b maintains the
dome-shaped curved surface.
[0089]
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When the plate member support device 10b is manufactured by the above manufacturing
method, the material of the plate member 14b is not limited to those having photo-curing
property or ceramics.
Moreover, the material of members other than a plate member is not limited to what can endure
high temperature. In order to deform the plate member 14b by equalizing the distribution of the
pressure acting on the plate member 14b using the pressure difference between the pressure
inside the space 11b of the housing member 12b and the external pressure, the dome shape of
the plate member 14b The variation of the curved surface shape is small. When the plate
member support device 10 b detects light or sound waves as in a piezoelectric device such as a
piezoelectric microphone or an optical element such as a lens, light is supported by supporting
the plate member 14 b in a curved surface shape. , Sound waves etc. can be detected at a wide
directional angle, and the sensitivity can be increased. Further, the sensitivity can be improved by
the presence of the initial stress in the state of the curved surface shape.
[0090]
<Summary> When the plate member supporting device is manufactured by the manufacturing
method described above, the material of the plate member is not limited to those having photocuring property or ceramics. Moreover, the material of members other than a plate member is
not limited to what can endure high temperature.
[0091]
By controlling the temperature inside the space of the housing member by adjusting the heating
temperature of the assembly or adjusting the amount of air in the space of the housing member,
the amount of deformation of the plate member can be easily controlled. be able to.
[0092]
The plate member is easily broken by stress concentration when it is deformed under local load,
but the pressure difference between the pressure inside the space of the housing member and
the external pressure is used to distribute the pressure acting on the plate member Since the
plate member is uniformly deformed, cracking of the plate member due to stress concentration
hardly occurs.
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[0093]
The present invention is not limited to the above embodiment, and can be implemented with
various modifications.
[0094]
DESCRIPTION OF SYMBOLS 10, 10a, 10b, 10k Plate member supporting apparatus 11, 11a, 11b,
11k Space 12, 12a, 12b Housing member 12x, 12y Opening 14, 14a, 14b Plate member 16, 16a,
16b Joint member 17a, 17b Air hole 18 Air valve 18a, 18b Sealing member 20, 30 Plate member
22, 32 First part 24, 34 Second part 26, 36 Sealing member 42 Frame member (housing
member) 42x, 42y Opening 44 Frame member 44x, 44y Opening 52 , 54, 56 Joint members
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