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JP2008187484

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DESCRIPTION JP2008187484
PROBLEM TO BE SOLVED: To efficiently manufacture a microphone with a hook. SOLUTION: An
electric circuit board assembly 12 is a large substrate in which a large number of regions of the
electric circuit board 2 are arrayed vertically and horizontally, and a back electrode substrate
assembly 13 includes an array of one side of the terminal electrodes 2a. This is a large substrate
in which a large number of regions of the back electrode substrate 3 are arranged along the slits
13c. The spacer assembly 14 is an assembly having the same planar shape as the back electrode
substrate assembly 13 and has a circular hole 14 b having the same outer shape as the laminated
portion 13 b of the back electrode 3 b and the electret material 3 c and a slit 14 c having the
same shape as the slit 13 c. And an aggregate including many. The diaphragm supporting frame
assembly 15 is an assembly having the same planar shape as the back electrode substrate
assembly 13, and is an assembly including a large number of circular holes having the same
outer shape as the back electrode 3b and slits 15c having the same shape as the slits 13c. is
there. These assemblies are laminated and joined to each other with the adhesive sheet 16
interposed therebetween. [Selected figure] Figure 3
Method of manufacturing a microphone with a hook
[0001]
The present invention relates to a method of manufacturing a small-sized hooked microphone
widely used in devices such as mobile phones, video cameras, digital cameras, PCs and the like.
[0002]
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1
2. Description of the Related Art Conventionally, among small-sized microphones mounted on
portable devices such as mobile phones, there are surface-mounted substantially cube-shaped
microphones.
In the method of manufacturing this microphone, first, a plurality of parts are arrayed and
integrated vertically and horizontally for each of a circuit board on which an electric element is
mounted, a back electrode board, a spacer, and a diaphragm supporting frame having a
diaphragm. Prepare your body. Then, these parts are stacked one on another and joined together.
The laminated assembly obtained in this manner is one in which a large number of condenser
microphones of a configuration in which components are laminated are connected vertically and
horizontally. If this laminated assembly is diced with a cutter along the boundaries between
product regions, a large number of condenser microphones can be obtained at one time (for
example, see Patent Document 1).
[0003]
In addition to such dice-like ones, there are small microphones with hooks (see, for example,
Patent Document 2). When mounted on a motherboard, this one is not limited to surface
mounting, and holes are made in the board. There is an advantage that it can be incorporated
from the back side, in which case the mounting height can be reduced. JP-A-2002-345092 (FIG.
1-2, paragraph number 0010-0013) JP-A-2006-50385 (FIG. 1)
[0004]
However, in the case of the conventional dice-like microphone, when mounting on a
motherboard, the mounting height from the substrate is determined by the influence of the
height of the microphone as it is. On the other hand, with a hooked microphone, no method has
been known for efficiently producing this.
[0005]
The present invention has been made to solve such conventional problems, and an object thereof
is to provide a method of manufacturing a barbed microphone capable of efficiently
manufacturing a barbed microphone.
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2
[0006]
The means of the present invention for achieving the above object comprises an electric circuit
board having a conversion circuit for converting a change in vibration of a vibrating film into an
electric signal, and an acoustic detection unit joined on the electric circuit board. The method is a
manufacturing method of a hooked microphone in which the electric circuit board protrudes
from at least one side from the side surface of the acoustic detection unit, and a plurality of the
electric circuit boards are integrally arranged in a row and integrated. A step of forming a circuit
board assembly, and a slit having the same planar shape as the electrical circuit board assembly
and having a width including one of the array of ridges of the electrical circuit board assembly A
step of forming an assembly of acoustic detection unit components in which a plurality of parts
constituting the acoustic detection unit are arrayed and integrated along the slit, the electric
circuit board assembly, and the configuration of the acoustic detection unit Forming a
microphone assembly by joining a goods aggregate is characterized by having a step of cutting
and dividing along the microphone assembly to the boundary line of the product region.
[0007]
Further, in the step of bonding the electric circuit board assembly and the acoustic detection unit
component part assembly, a sheet-like adhesive having the same planar shape as the electric
circuit substrate assembly formed by punching other than the bonding portion for bonding. It is
characterized by using an agent.
[0008]
According to the present invention, the electric circuit board includes the electric circuit board
having the conversion circuit for converting the vibration change of the vibrating film into the
electric signal, and the acoustic detection unit joined on the electric circuit board, the electric
circuit board is the acoustic detection A method of manufacturing a hooked microphone having a
hook portion formed to project from at least one side of a side surface of the cover, wherein a
large number of the electric circuit boards are arrayed vertically and horizontally to form an
integrated electric circuit board assembly. And a slit having the same planar shape as the electric
circuit board assembly and including one of the array of ridges of the electric circuit board
assembly, and the acoustic wave is formed along the slit. A step of forming an assembly of
acoustic detection unit component parts in which a large number of parts constituting the
detection unit are arrayed and integrated, and a microphone by joining the electric circuit board
assembly and the assembly of acoustic detection unit components. Since the process of forming
the phone assembly and the process of cutting and dividing the microphone assembly along the
boundary of the product area are efficiently performed, it is possible to efficiently manufacture a
hooked microphone having freedom in the mounting form. Can.
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Further, in the step of bonding the electric circuit board assembly and the acoustic detection unit
component part assembly, a sheet-like adhesive having the same planar shape as the electric
circuit substrate assembly formed by punching other than the bonding portion for bonding. Since
the agent is used, since the adhesive does not stick out, good quality bonding is made.
[0009]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A barbed microphone to which a
method of manufacturing a barbed microphone according to a first embodiment of the present
invention is applied will hereinafter be described in detail with reference to the drawings.
FIG. 1 is a perspective view showing a barbed microphone to which a manufacturing method of a
barbed microphone according to an embodiment of the present invention is applied.
FIG. 2 is a cross-sectional view showing an A-A cross section of FIG. 3 and 4 are exploded
perspective views showing a method of manufacturing the hooked microphone according to the
first embodiment of the present invention. FIG. 5 is a cross-sectional view showing an
implementation of a hooked microphone.
[0010]
First, the configuration of the hooked microphone according to the first embodiment of the
present invention will be described. In FIGS. 1 and 2, the hooked microphone 1 which is an
electret condenser microphone is configured such that the substantially square back electrode
substrate 3 having the same planar shape, the spacer 4 and the diaphragm supporting frame 5
are sequentially stacked on the electric circuit substrate 2. It is joined. Here, the portion joined on
the electric circuit board 2, that is, the back electrode board 3, the spacer 4 and the vibrating
membrane supporting frame 5 will be collectively referred to as an acoustic detection unit 7. The
hooked microphone 1 has a hook portion 1a having a predetermined width, which is a portion in
which the electric circuit board 2 projects to at least one side of one of both opposing side
surfaces of the sound detection unit 7.
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[0011]
An electric element such as a field effect transistor (FET) 6 is mounted on the electric circuit
board 2 to form a conversion circuit for converting a change in vibration into an electric signal.
At upper and lower surfaces of the four corners of the electric circuit board 2, there are formed
terminal electrodes 2a which are conducted through the through holes 2b. A recess 3a for
escaping the FET 6 is formed at the center on the lower surface side of the back electrode
substrate 3. A back electrode 3b is formed at the center on the upper surface side, and the
electret material 3c is stacked thereon. A hole 4a is formed in the center of the spacer 4 to allow
the laminated portion of the back electrode 3b and the electret material 3c to escape. The recess
3a communicates with the hole 4a via the air hole 3d. A sound collection hole 5b is formed in the
center of the vibrating membrane support frame 5, and the vibrating membrane 5a is stretched
on the lower surface.
[0012]
Next, a method of manufacturing the hooked microphone according to the first embodiment of
the present invention will be described with reference to FIGS. 3 and 4. In FIG. 3 and FIG. 4, the
virtual dividing line BL of the product is indicated by a broken line for convenience of
explanation. In order to manufacture the microphone with a hook 1, first, it is possible to obtain a
large number of each component constituting the electric circuit board 2 and the acoustic
detection unit 7, that is, the back electrode board 3, the spacer 4 and the vibrating membrane
support frame 5. An assembly having the same planar shape as the electric circuit board 2 in
which a large number is arrayed and integrated in the vertical and horizontal directions, that is,
an electric circuit board assembly 12, a back electrode substrate assembly 13, a spacer assembly
14, a diaphragm supporting frame assembly 15 And an adhesive sheet 16 comprising an
adhesive for bonding them together.
[0013]
A large number of FETs 6 and the like are mounted on the electric circuit board assembly 12 and
wire bonded to coat a resin protective film (not shown). Through holes 2 b are provided at the
intersections of virtual boundary lines BL in the product region, and terminal electrodes 2 a are
formed on the upper and lower surfaces so as to include the through holes 2 b at the center.
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[0014]
A slit 13c is provided in the back electrode substrate assembly 13 so as to include one of the
arrangements of the terminal electrodes 2a of the electric circuit substrate assembly 12, and a
large number of back electrode substrates 3 are arranged along the slit 13c. . The spacer
assembly 14 has a laminated portion 13b of the back electrode 3b of the back electrode
substrate assembly 13 and the electret material 3c, a circular hole 14b and a slit 14c in the same
shape and position as the slit 13c, and a spacer along the slit 14c. Many 4 are arranged. The
adhesive sheet 16 is a sheet-like adhesive formed by punching out portions other than the
adhesive portion, and has the same planar shape as the rear electrode substrate assembly 13 and
has the same structure as the laminated portion 13b of the back electrode 3b and the electret
material 3c and the slit 13c. It has a circular hole 16b and a slit 16c of the same shape in
position.
[0015]
The diaphragm supporting frame assembly 15 has a laminated portion 13b of the back electrode
3b of the back electrode substrate assembly 13 and the electret material 3c, and a circular hole
15b and a slit 15c in the same shape and position as the slit 13c. A large number of vibrating
membrane support frames 5 are arranged along the line. Near the corners of each of the
component assemblies 12, 13, 14 and 15 and the adhesive sheet 16 described above, guide holes
12a, 13a, 14a, 15a and 16a for positioning are provided. As described above, the assembly 13,
14 and 15 of the components constituting the acoustic detection unit 7 has a width that can
include one of the arrangements of the terminal electrodes 2 a of the electric circuit board
assembly 12. The slits 13c, 14c, 15c are formed.
[0016]
Next, while inserting and positioning a guide pin (not shown) in the guide holes 12a, 13a, 14a,
15a and 16a, the assembly of parts 12, 13, 14 and 15 and the adhesive sheet 16 are stacked in
the order of FIG. By pressure heating and bonding, the microphone assembly 11 shown in FIG. 4
is formed. The bonding may be performed by applying an adhesive to the surface of each
assembly without using the adhesive sheet 16. Next, the microphone assembly 11 is attached to
the adhesive sheet and dicing is performed with a cutter along the virtual boundary line BL
between the respective product areas. The divided pieces become the hooked microphone 1
shown in FIG. Since FIG. 3 and FIG. 4 are schematic diagrams for explanation, only 12 product
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areas of 3 rows and 4 columns are drawn on each assembly, but in actuality, several hundred in
one assembly. A product area can be arranged for mass production.
[0017]
Next, the effects of the manufacturing method of the hooked microphone according to the first
embodiment of the present invention will be described. The microphone 1 according to the
present invention has terminal electrodes 2a provided at four corners of the electric circuit board
2 and requiring power feeding, provided at the ridges 1a projecting outward from both side
surfaces of the back electrode substrate 3, as shown in FIG. As shown in the figure, the
motherboard 10 is provided with a hole 10a for mounting a microphone, and the electrode
wiring is provided on the lower surface side, so that the electric circuit board 2 of the
microphone with microphone 1 is soldered to the back surface of the motherboard 10 Mounting
height can be kept low. If the FPC is adopted as the electric circuit board 2, the mounting height
can be further reduced. In the method of manufacturing such a microphone with a hook 1, by
processing slits in advance in the assembly of each component constituting the acoustic
detection unit 7, the microphone with a hook 1 as shown in FIG. 1 is efficiently manufactured.
can do.
[0018]
Next, a modification of the buttocks of the hooked microphone will be described. FIG. 6 is a plan
view of a hooked microphone showing a modification of various hooks. In FIG. 6, any terminal
electrode is provided only on the surface side of the electric circuit board. As described above,
the terminal electrode of the electric circuit board is not necessarily required on the lower
surface side, in which case the through hole is not necessary, and the manufacturing cost of the
electric circuit board can be reduced. Further, the ridge portion may be protruded to only one
side surface of the back electrode substrate 3 as shown in FIG. 6 c and FIG. 6 f, and as shown in
FIG. 6 d, FIG. It may be narrower than the width. In addition, when the ridges are on both sides,
one terminal electrode may be provided at one ridge. The configuration other than the buttocks
is the same as that of the microphone with a hook 1.
[0019]
Next, as an example, a method of manufacturing the hooked microphone according to the second
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embodiment of the present invention, which is a method of manufacturing the hooked
microphone 21 illustrated in FIG. FIG. 7 is an exploded view showing a method of manufacturing
the hooked microphone 21. As shown in FIG. In FIG. 7, in the electric circuit board assembly 32
which is an assembly of the electric circuit boards 22, a hole 32b is formed in advance for
limiting the size of the flange portion 21a. A terminal electrode 22a is formed in the ridge
portion 21a between the hole 32b and the hole 32b. The other parts are the same as in the
method of manufacturing the microphone with a hook 1, so the same reference numerals and
names are given to the same components, and the description is omitted. Any of the barbed
microphones shown in FIG. 6 can be manufactured by the same method.
[0020]
Next, another barbed microphone to which the manufacturing method of the barbed microphone
according to the embodiment of the present invention is applied will be described. FIG. 8 is a
cross-sectional view of another caged microphone. The wedged microphone 41 is a silicon
capacitor microphone having a MEMS (Micro Electro-Mechanical Systems) vibrating film 45
formed by a semiconductor manufacturing process. A MEMS vibrating film 45 and an IC 46
constituting a conversion circuit for converting a change in vibration into an electric signal are
mounted on the electric circuit board 42. The MEMS diaphragm 45 and the IC 46 are covered
with a spacer 44 constituting the acoustic detection unit 47 and a shield substrate 43 having an
air hole 43a. The electric circuit board 42 projects outward from both sides of the acoustic
detection unit 47 to form a collar portion 41 a. The method for manufacturing a microphone
with a hook according to the present invention can be applied to a silicon condenser microphone
by using an assembly of electric circuit base assemblies and components of an acoustic detection
unit having a slit.
[0021]
It is a perspective view of the caged microphone to which the manufacturing method of the
caged microphone of the present invention is applied. It is sectional drawing which shows the AA
cross section of FIG. FIG. 7 is an exploded perspective view showing a method of manufacturing
the hooked microphone according to the first embodiment of the present invention. It is a
perspective view showing an assembly of a barbed microphone. It is sectional drawing which
shows the mounting form of a cage ¦ basket with a microphone. It is a top view which shows the
modification of a collar part. It is a disassembled perspective view which shows the
manufacturing method of the cage ¦ basket with a microphone which is the 2nd Embodiment of
this invention. FIG. 6 is a cross-sectional view of another caged microphone to which the caged
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microphone manufacturing method of the present invention is applied.
Explanation of sign
[0022]
1, 21, 41 microphone with microphone 1a, 21a, 41a ridge portion 2, 42 electric circuit board 3
back electrode board 3b back electrode 4 spacer 5 vibrating membrane support frame 5a
vibrating membrane 7, 47 acoustic detection unit 11 microphone assembly 12 electricity Circuit
board assembly 13c, 14c, 15c, 16c Slit 13 back electrode substrate assembly 14 spacer assembly
15 diaphragm support frame assembly 16 adhesive sheet BL boundary
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