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JP2005260771

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DESCRIPTION JP2005260771
PROBLEM TO BE SOLVED: There is no risk of melting a resin frame on which a spring terminal is
mounted due to heat when soldering a lead from a voice coil to the spring terminal, and
positioning accuracy of the spring terminal on the resin frame is maintained with high accuracy.
To provide a speaker device that can SOLUTION: A metal spring terminal 41 fixed to a resin
frame 31 accommodating a speaker unit 14 has a lead connection portion 44 to which the voice
coil 11 of the speaker unit 14 is soldered and a surface of the resin frame 31. The lead
connecting portion 44 is extended to one side of the frame bonding portion 42 bonded to the
surface of the resin frame 31 so that a predetermined heat radiation space s is secured between
the resin bonding portions. It prevents the frame 31 from melting. [Selected figure] Figure 1
Speaker device
[0001]
The present invention relates to a speaker device mounted on an information device such as a
mobile phone.
[0002]
In recent years, with the progress of downsizing and cost reduction of information devices such
as mobile phones and PDAs (Personal Digital Assistants), cost reduction and space saving are also
achieved for the speaker device which is a component of the information devices.
Correspondence such as is required.
[0003]
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1
From such a background, as a speaker device corresponding to incorporation into a small
information device, a speaker unit for driving a diaphragm by a voice coil, and a resin frame that
accommodates the speaker unit and serves as an attachment frame to a device case And a pair of
metal spring terminals fixedly mounted on the resin frame, and the output terminal on the device
side circuit board assembled to the device case is electrically supplied to the voice coil through
the pair of spring terminals. Various configurations for connection have been proposed (see, for
example, Patent Document 1 and Patent Document 2).
[0004]
In such a speaker device, a spring terminal fixed to a resin frame is normally connected to a
frame bonding portion bonded to the resin frame, and the frame bonding portion and a lead of
the voice coil is soldered. The lead connection portion to be connected and the elastic connection
piece connected to the frame bonding portion and connected to the output terminal on the
device-side circuit board assembled to the device case in an elastically deformed state by a metal
plate It is considered to be a structure.
[0005]
JP 10-224879 JP 11-282473
[0006]
By the way, conventionally, in the spring terminal in the above speaker device, the frame bonding
portion and the lead connection portion are directly surfaced on the surface of the frame in order
to secure a large contact surface with the frame and stabilize fixation to the frame. It was
considered to be finished in a series of flat plates in contact.
[0007]
However, when soldering the lead from the voice coil to the lead connection portion of the spring
terminal attached to the frame, the heat of soldering is easily transmitted to the frame through
the lead connection portion. The surface of the resin frame melts with the heat of soldering,
resulting in a shift in the mounting position of the spring terminal, resulting in electrical
connection between the elastic connection piece of the spring terminal and the output terminal
on the device side circuit board There is a possibility that connection failure etc. may occur.
[0008]
As a problem to be solved by the present invention, there is no risk that the resin frame on which
the spring terminal is mounted is melted by the heat when soldering the lead from the voice coil
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2
to the spring terminal, and the resin frame of the spring terminal (2) maintain the high
positioning accuracy of the spring and prevent the occurrence of connection failure due to the
displacement of the spring terminal in the electrical connection between the elastic connection
piece of the spring terminal and the output terminal on the device side circuit board One possible
example is to provide a speaker device that can be used.
[0009]
The speaker device according to claim 1 comprises: a speaker unit for driving a diaphragm by a
voice coil; a resin frame which accommodates the speaker unit and serves as an attachment
frame to an apparatus case; A speaker device in which an output terminal on a device-side circuit
board assembled to the device case is electrically connected to the voice coil through the pair of
spring terminals. Each of the spring terminals is a frame bonding portion bonded to the resin
frame, a lead connection portion connected to the frame bonding portion and to which a lead of
the voice coil is soldered, and the frame bonding portion An elastic connection piece connected
in an elastically deformed state to an output terminal on a device-side circuit board which is
connected in series and assembled to the device case The lead connecting portion is extended to
one side of the frame bonding portion so as to secure a predetermined heat radiation space
between the lead connecting portion and the surface of the resin frame while forming an
integrally formed structure. It is characterized by
[0010]
Hereinafter, an embodiment of a speaker device according to the present invention will be
described in detail with reference to the drawings.
1 to 5 show an embodiment of a speaker device according to the present invention. FIG. 1 is a
perspective view of an embodiment of a speaker device according to the present invention, and
FIG. 2 is a speaker shown in FIG. 3 is a side view along the line A-A in FIG. 1, FIG. 4 is a crosssectional view along the line B-B in FIG. 3, FIG. It is a perspective view of the spring terminal used
for the speaker apparatus shown in FIG.
[0011]
The speaker device 1 according to the embodiment of the present invention is incorporated in an
information device such as a mobile phone or PDA, and contains a speaker unit 14 for driving the
diaphragm 12 by the voice coil 11 and the speaker unit 14. A device side circuit board 51
including a resin frame 31 as a mounting frame for the device case 21 and a pair of metal spring
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terminals 41 and 41 fixedly mounted on the resin frame 31 and assembled to the device case 21.
The upper output terminals 53, 53 are electrically connected to the voice coil 11 via the pair of
spring terminals 41.
[0012]
The speaker unit 14 is a so-called dome-shaped speaker unit, and as shown in FIG. 4,
accommodates the dome-shaped diaphragm 12, the cylindrical voice coil 11 connected to the
outer peripheral edge of the diaphragm 12, and the voice coil 11. And a speaker unit frame 17
for supporting the magnetic circuit 16 and the diaphragm 12.
The edge 12 is joined to the outer periphery of the diaphragm 12, and the outer peripheral edge
of the edge 18 is fixed to the edge support portion 17 a of the speaker unit frame 17 so as to be
supported by the speaker unit frame 17.
[0013]
As shown in FIG. 4, the magnetic circuit 16 includes a cylindrical center pole 16a disposed on the
back side of the speaker unit 14 and a first plate formed by projecting the outer periphery of the
proximal end of the center pole 16a into a bowl shape. 16b, an annular magnet 16c disposed on
the first plate 16b, and an annular second plate 16d placed on the magnet 16c to face the first
plate 16b, A gap between the inner peripheral surface of the second plate 16 d and the outer
peripheral surface of the center pole 16 a is a magnetic gap 15 that accommodates the voice coil
11.
The above magnetic circuit 16 forms an external magnet type magnetic circuit which
concentrates the magnetic flux in the magnetic gap 15, and in accordance with the electric signal
inputted to the voice coil 11, the voice coil 11 in the central axis direction indicated by arrow C.
To drive.
[0014]
As shown in FIG. 4, the resin frame 31 extends radially inward from one end of the large
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4
diameter first cylindrical portion 32 in which the speaker unit frame 17 is fitted, and one end of
the first cylindrical portion 32. An annular portion 33 for holding the back surface of the one
plate 16b, and a small diameter second cylindrical portion 34 extending in the opposite direction
to the first cylindrical portion 32 from the inner peripheral edge of the annular portion 33 are
integrally molded of synthetic resin. It is a thing.
The first tubular portion 32 and the second tubular portion 34 are concentric, and a concave
space surrounded by the first tubular portion 32 and the annular portion 33 serves as a housing
portion of the magnetic circuit 16.
[0015]
As shown in FIG. 2, a stepped portion 36 which is recessed for mounting the pair of spring
terminals 41, 41 is formed in a part of the annular portion 33.
As shown in FIG. 2 and FIG. 3, the flat portion 37 on which the spring terminal 41 is placed in
surface contact and the locking pieces 42a and 42b mounted on the spring terminal 41 are
engaged with the step portion 36. Terminal engagement holes 38a and 38b are provided.
[0016]
Each of the spring terminals 41 is mounted on the flat portion 37 of the resin frame 31, as
shown in FIGS. 2 and 5, and a frame bonding portion 42 which is adhesively fixed to the flat
portion 37 by an adhesive as appropriate. The lead connection portion 44 connected to one side
of the frame bonding portion 42 and to which the lead of the voice coil 11 is soldered, and the
device side connected to the other side of the frame bonding portion 42 and assembled to the
device case 21 An elastic connection piece 46 which is in contact with the output terminal 53 on
the circuit board 51 in an elastically deformed state to be electrically connected is integrally
formed by press forming of a metal plate.
As a metal plate which forms this spring terminal 41, the thin plate material of the metal which
had elasticity and corrosion resistance, such as phosphor bronze, spring steel, stainless steel,
beryllium copper, titanium copper etc., for example is desirable.
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5
[0017]
In the frame bonding portion 42, as shown in FIG. 5, the locking pieces 42a and 42b engaged by
being inserted into the terminal engaging holes 38a and 38b formed around the flat portion 37
are bent and formed. ing.
The spring terminal 41 is applied between the frame adhesive portion 42 and the flat portion 37
when the engaging pieces 42a and 42b are engaged with the terminal engaging holes 38a and
38b of the resin frame 31, respectively. It is fixed to the resin frame 31 by the adhesive force of
the adhesive.
[0018]
As shown in FIGS. 2 and 5, in the lead connection portion 44 of the spring terminal 41 of the
present embodiment, a predetermined heat radiation space s is secured between the lead
connection portion 44 and the surface of the resin frame 31. As shown in FIG. 5, after the step
44a is attached to one side of the frame bonding portion 42, the frame bonding portion 42 is
extended.
Further, the elastic connecting piece 46 has an arc-shaped curved surface 46 a so that the
portion continuous with the frame bonding portion 42 can be elastically deformed smoothly
when the pressing force from the device-side circuit board 51 is received at the tip. ing.
Further, the dimension of the step portion 36 and the flat portion 37 is selected so that the
curved surface 46 a does not contact the surface of the resin frame 31.
[0019]
The device-side circuit board 51 is a substrate assembled on the upper side of the speaker device
1 after the speaker device 1 is assembled to the device case 21 as shown in FIG. The elastic
connection piece 46 shown by the solid line in FIG. 2 is elastically deformed to the position
shown by the broken line, and the elastic contact pressure at that time makes the electrical
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connection between the pair of spring terminals 41, 41 and the output terminals 53, 53 Get
In addition to the above output terminals 53, 53, for example, an amplifier circuit that outputs an
acoustic signal to the output terminals 53, 53, a control circuit necessary for operation control
on the information device side, etc. Will be mounted.
[0020]
In the speaker device 1 described above, the lead connection portion 44 of the spring terminal
41 to which the lead from the voice coil 11 is soldered has a heat dissipation space s between it
and the surface of the resin frame 31. It is not in direct contact with the surface of the frame 31.
Therefore, the heat at the time of soldering the lead to the lead connection portion 44 is difficult
to be transmitted to the resin frame 31, and the heat at the time of soldering the lead to the
spring terminal 41 melts the resin frame 31. It is possible to prevent the occurrence of the
inconvenience of displacement of the position. Therefore, the positioning accuracy of the spring
terminal 41 to the resin frame 31 can be maintained with high accuracy, and the elastic
connection piece 46 of the spring terminal 41 and the output terminals 53 and 53 on the device
side circuit board 51 and the spring terminal 41 In the electrical connection between them, it is
possible to prevent the occurrence of connection failure due to the displacement of the spring
terminal 41.
[0021]
The speaker unit used in the present invention is not limited to the dome shape shown in the
above embodiment. As a speaker unit, a cone type thing can also be employ ¦ adopted, and it is
also possible to employ ¦ adopt an elliptical speaker unit. Further, the magnetic circuit of the
speaker unit is not limited to the external magnet type shown in the above embodiment, but may
be an internal magnet type. Further, the dimensional shape and the like of each part of the spring
terminal can be appropriately designed and changed without departing from the spirit of the
present invention.
[0022]
It is a perspective view of a speaker device concerning an embodiment of the invention. It is a
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side view of the state which attached the speaker apparatus shown in FIG. 1 to apparatus cases,
such as information equipment. It is an arrow line view along the AA line of FIG. It is sectional
drawing in alignment with the BB line of FIG. It is a perspective view of the spring terminal used
for the speaker apparatus shown in FIG.
Explanation of sign
[0023]
DESCRIPTION OF SYMBOLS 1 speaker apparatus 11 voice coil 12 diaphragm 14 speaker unit 17
speaker unit frame 21 apparatus case 31 resin frame 36 step part 37 flat part 38a, 38b terminal
engagement hole 41 spring terminal 42 frame bonding part 42a, 42b locking piece 44 Lead
connection 46 Elastic connection piece 51 Equipment side circuit board s Heat dissipation space
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